Interposer lead

1. An interposer lead for providing a connection between an integrated circuit and a circuit board, said interposer lead comprising:

a first leg for interfacing with the circuit board;

a second leg disposed generally parallel to said first leg and having a surface for interfacing with an IC electrical lead extending from the integrated circuit;

a connecting portion operatively connecting said first leg and said second leg; and

a lip extending non-parallel from said second leg and non-parallel to said first leg for limiting movement of the IC electrical lead on said second leg;

wherein said lip terminates at an end prior to extending over the surface of the second leg.

2. An interposer lead as set forth in claim 1 wherein said lip is curved.

3. An interposer lead as set forth in claim 2 wherein said lip curves at least 80 degrees away from said second leg.

4. An interposer lead as set forth in claim 2 wherein said lip curves at least 125 degrees away from said second leg.

5. An interposer lead as set forth in claim 2 wherein said lip curves at least 170 degrees away from said second leg.

6. An interposer lead as set forth in claim 1 wherein said lip is generally perpendicular with said second leg.

7. An interposer lead as set forth in claim 1 wherein said connecting portion is curved and said connection portion curves by about 180 degrees.

8. An interposer lead for providing a connection between an integrated circuit and a circuit board, said interposer lead comprising:

a first leg for interfacing with the circuit board;

a second leg disposed generally parallel to said first leg and having a surface for interfacing with an IC electrical lead extending from the integrated circuit;

a connecting portion operatively connecting said first leg and said second leg; and

a lip extending non-parallel from said second leg, terminating at an end prior to extending over the surface of the second leg, and defining an interior curve with respect to said second leg, wherein said interior curve limits movement of the IC electrical lead.

9. An interposer lead as set forth in claim 8 wherein said lip curves at least 80 degrees away from said second leg.

10. An interposer lead as set forth in claim 8 wherein said lip curves at least 125 degrees away from said second leg.

11. An interposer lead as set forth in claim 8 wherein said lip curves at least 170 degrees away from said second leg.

12. An interposer lead as set forth in claim 8 wherein said lip is generally perpendicular with said second leg.

13. An electronics assembly comprising:

an integrated circuit;

an IC electrical lead extending from said integrated circuit;

a circuit board; and

an interposer lead electrically connected to said IC electrical lead of said integrated circuit and said circuit board, said interposer lead including

a first leg interfacing with said circuit board,

a second leg disposed generally parallel to said first leg and interfacing with said electrical lead,

a connecting portion operatively connecting said first leg and said second leg, and

a lip extending non-parallel from said second leg; and

solder accumulated between said lip and said IC electrical lead;

wherein said IC electrical lead extends above said lip with respect to said second leg.

14. An electronics assembly as set forth in claim 13 wherein said lip is curved.

15. An electronics assembly as set forth in claim 14 wherein said lip curves at least 80 degrees away from said second leg.

16. An electronics assembly as set forth in claim 14 wherein said lip curves at least 125 degrees away from said second leg.

17. An electronics assembly as set forth in claim 14 wherein said lip curves at least 170 degrees away from said second leg.

18. An electronics assembly as set forth in claim 13 wherein said lip is generally perpendicular with said second leg.

19. An electronics assembly as set forth in claim 1 wherein said lip curves less than 170 degrees away from said second leg.