Active implantable medical system having EMI shielded lead
A lead extending exteriorly from an active implantable medical device (AIMD) is at least partially ensheathed within an electromagnetic interference (EMI) shield. The AIMD has a conductive equipotential surface to which the EMI shield may be conductively coupled. An impeding circuit may be provided for raising the high frequency impedance of the lead. An energy diversion circuit may also be provided for conductively coupling the lead to the EMI shield.
1. An implantable medical system, comprising:
a) an active implantable medical device (AIMD) comprising electronic circuitry hermetically contained inside a device housing, wherein the device housing serves as a conductive equipotential surface;
b) a hermetic feedthrough terminal supported by the device housing;
c) at least one lead comprising:
i) at least one electrical conductor having a length extending from a proximal conductor portion having a proximal conductor end to a distal conductor portion having a distal conductor end, wherein the proximal conductor portion extends through the hermetic feedthrough terminal in a non-conductive relationship with the device housing, and wherein the proximal conductor end is electrically connected to the electronic circuitry housed inside the device housing;
ii) at least one biological sensing or stimulating electrode, wherein the at least one electrode is electrically connected to the distal conductor portion or the distal conductor end.; and
iii) at least. one electromagnetic interference (EMI) shield surrounding the at least one electrical conductor in a non-conductive relationship therewith, wherein the EMI shield extends along at least a portion of the conductor length,
d) wherein a proximal end of the EMI shield by-passes the hermetic feedthrough terminal outside the device housing and is conductively shunted directly to the device housing serving as the conductive equipotential surface.
2. The system of claim 1 , including an insulator surrounding either an outside surface of the EMI shield or disposed between the electrical conductor and an inside surface of the shield, or both, wherein the insulator extends along at least a portion of a second length of the EMI shield.
3. The system of claim 1 or 2 , wherein the EMI shield comprises a plurality of spaced apart, but electrically connected EMI shields disposed along the length of the at least one electrical conductor.
4. The system of claim 1 or 2 , wherein the at least one lead comprises a plurality of leads, and wherein the EMI shield comprises a corresponding plurality of EMI shields.
5. The system of claim 1 , wherein the EMI shield comprises a conductive heat-shrink tubing.
6. The system of claim 1 , wherein the EMI shield is selected from the group consisting of a conductive foil, a wire, a braid, a mesh, a circuit. trace, a solid tubular material, and a deposited thin film of conductive material.
7. The system of claim 6 , wherein the EMI shield is selected from the group consisting of a conductive polymer, a conductive epoxy, and nano-meshes.
8. The system of claim 1 , wherein the EMI shield includes one or more stress relief scores.
9. The system of claim 1 , wherein the EMI shield is radially spaced from the at least one electrical conductor.
10. The system of claim 1 , wherein the EMI shield is of a material selected from the group consisting of MP35N, iridium, platinum, titanium, chromium, Wolfram, tungsten, gold, and copper.
11. The system of claim 1 , including a flex cable embodying the at least one electrical conductor and the EMI shield.
12. The system of claim 1 or 2 , including an energy diversion circuit conductively coupling the at least one electrical conductor to the EMI shield.
13. The system of claim 12 , wherein the energy diversion circuit comprises a low pass filter selected from the group consisting of a capacitor, an inductor, a Pi filter, a T filter, an LL filter, and an “n” element filter.
14. The system of claim 12 , wherein the energy diversion circuit comprises at least one series resonant L-C trap filter.
15. The system of claim 1 or 2 , including an impeding circuit physically and electrically connected in series with the electrical conductor, wherein the impeding circuit is configured to raise high frequency impedance of the at least one electrical conductor.
16. The system of claim 15 , wherein the impeding circuit comprises an inductor.
17. The system of claim 15 , wherein the impeding circuit comprises a bandstop filter configured to resonate at or near an MRI RF pulsed frequency.
18. The system of claim 15 , including an energy diversion circuit conductively coupling the at least one electrical conductor to the EMI shield.
19. An implantable medical system, comprising:
a) an active implantable medical device (AIMD) comprising electronic circuitry hermetically contained inside a device housing, wherein the device housing serves as a conductive equipotential surface;
b) a hermetic feedthrough terminal supported by the device housing;
c) at least one lead comprising:
i) at least one electrical conductor having a length extending from a proximal conductor portion having a proximal conductor end to a distal conductor portion having a distal conductor end, wherein the proximal conductor portion extends through the hermetic feedthrough terminal in a non-conductive relationship with the device housing, and wherein the proximal conductor end is electrically connected to the electronic circuitry housed inside the device housing;
ii) at least one biological sensing or stimulating electrode, wherein the at least one electrode is electrically connected to the distal conductor portion or the distal conductor end; and
iii) at least one electromagnetic interference (EMT) shield surrounding the at least one electrical conductor in a non-conductive relationship therewith, wherein the EMI shield extends along at least a portion of the conductor length,
d) wherein the EMI shield is an electrically conductive exterior surface suitable for long-term exposure to body tissues and fluids and wherein a proximal end of the EMI shield by-passes the hermetic feedthrough terminal outside the device housing and is conductively shunted directly to the device housing serving as the conductive equipotential surface.
20. The system of claim 19 , wherein a non-conductive insulator is disposed between the electrical conductor and the EMI shield, or surrounds the EMI shield, or both.
21. The system. of claim 19 , wherein the EMI shield comprises a conductive heat-shrink tubing.
22. The system of claim 19 , wherein the EMI shield is selected from the group consisting of a conductive foil, a wire, a braid, a mesh, a circuit trace, and a solid tubular material.
23. The system of claim 19 , wherein the EMI shield is selected from the group consisting of a conductive polymer, a conductive epoxy, carbon nano-fibers, nano-meshes, and nano-threads.
24. The system of claim 19 , wherein the EMI shield includes one or more stress relief scores.
25. The system of claim 19 , wherein the EMI shield is radially spaced from the at least one electrical conductor.
26. The system of claim 19 , wherein the EMI shield is selected from the group consisting of MP35N, iridium, platinum, titanium, chromium, Wolfram, tungsten, gold, and copper.
27. The system of claim 19 , including a flex cable embodying the at least one electrical conductor and the EMI shield.
28. The system of claim 19 , wherein the EMI shield comprises a plurality of spaced apart, but electrically connected EMI shields disposed along the length of the at least one electrical conductor.
29. The system of claim 19 , wherein the at least one lead comprises a plurality of leads, and wherein the EMI shield comprises a corresponding plurality of EMI shields.
30. The system of claim 19 , including a frequency selective energy diversion circuit conductively coupling the at least one electrical conductor to the EMI shield.
31. The system of claim 30 , wherein the energy diversion circuit comprises a low pass filter selected from the group consisting of a capacitor, an inductor, a Pi filter, a T filter, an LL filter, and an “n” element filter.
32. The system of claim 30 , wherein the energy diversion circuit comprises at least one series resonant L-C trap filter.
33. The system of claim 19 , including an impeding circuit physically and electrically connected in series with the electrical conductor, wherein the impeding circuit is configured to raise the high frequency impedance of the at least one electrical conductor.
34. The system of claim 33 , wherein the impeding circuit comprises an inductor.
35. The system of claim 33 , wherein the impeding circuit comprises a bandstop filter configured to resonate at or near an MRI RF pulsed frequency.
36. An implantable medical system, comprising:
a) an active implantable medical device (AND) comprising electronic circuitry hermetically contained inside a device housing, wherein the device housing serves as a conductive equipotential surface;
b) a hermetic terminal supported by the device housing;
c) at least one lead comprising:
i) at least one electrical conductor having a length extending from a proximal conductor portion having a proximal conductor end to a distal conductor portion having a distal conductor end, wherein the proximal conductor portion extends through the hermetic feedthrough terminal in a non-conductive relationship with the device housing, and wherein the proximal conductor end is electrically connected to the electronic circuitry housed inside the device housing;
ii) at least one biological sensing or stimulating electrode, wherein the at least one electrode is electrically connected to the distal conductor portion or the distal conductor end; and
iii) at least one electromagnetic interference (EMI) shield comprising a conductive heat-shrink tubing surrounding the at least one electrical conductor in a non-conductive relationship therewith, wherein the EMI shield extends along at least a portion of the conductor length,
d) wherein a proximal end of the EMI shield by-passes the hermetic feedthrouah terminal outside the device housing and is conductively shunted directly to the device housing serving as the conductive equipotential surface.
37. The system of claim 1 or 2 , wherein the at least one lead comprises a plurality of lead conductors, and wherein the EMT shield at least partially surrounds the plurality of conductors.