Semiconductor component comprising a dopant region in a semiconductor body and a method for producing a dopant region in a semiconductor body
A semiconductor component includes a semiconductor body having a first side and a second side opposite the first side. In the semiconductor body, a dopant region is formed by a dopant composed of an oxygen complex. The dopant region extends over a section L having a length of at least 10 μm along a direction from the first side to the second side. The dopant region has an oxygen concentration in a range of 1×10 17 cm −3 to 5×10 17 cm −3 over the section L.
1. A method for producing a dopant region in a semiconductor body, the method comprising:
providing a semiconductor body having a first side and a second side opposite the first side, wherein in the semiconductor body at least one partial region is formed over a section L of at least 10 μm in a direction from the first side to the second side, the at least one partial region having an oxygen concentration in a range of 1×10 17 cm −3 to 5×10 17 cm −3 ;
heat treating at least the partial region in a temperature range between 350° C. and 450° C. so that a dopant region comprising a dopant composed of an oxygen complex forms in the partial region over the section L; and
introducing hydrogen at least into the partial region before the heat treatment.
2. The method as claimed in claim 1 , wherein the partial region is formed by setting an oxygen supply during crystal growth of the semiconductor body in a magnetic Czochralski method.
3. The method as claimed in claim 1 , wherein the partial region is formed by setting an oxygen supply from a gas phase during an epitaxial deposition of the semiconductor body on a semiconductor substrate.
4. The method as claimed in claim 1 , wherein the partial region is formed by outdiffusion of oxygen from a substrate into an epitaxial layer deposited on the substrate.
5. The method as claimed in claim 1 , wherein the partial region is formed by indiffusion of oxygen via the first side or via the second side into the semiconductor body.
6. The method as claimed in claim 1 , wherein the partial region is formed by implantation of oxygen into the semiconductor body.
7. The method as claimed in claim 1 , wherein the oxygen concentration in the partial region decreases along the section L.
8. The method as claimed in claim 7 , wherein the oxygen concentration decreases in a direction toward the first side.
9. The method as claimed in claim 1 , further comprising thinning the semiconductor body at the second side before the formation of the partial region.
10. The method as claimed in claim 1 , wherein the hydrogen is introduced by implantation of hydrogen ions.
11. The method as claimed in claim 10 , wherein the implantation of hydrogen ions is effected with at least two different implantation energies so that hydrogen accumulations are produced at different depths in the partial region.
12. The method as claimed in claim 1 , wherein the heat treatment takes place over a time period of 30 minutes to 5 hours.
13. The method as claimed in claim 1 , wherein the dopant region is predominantly formed by dopants formed from a hydrogen-oxygen-lattice vacancy complex.
14. The method as claimed in claim 1 , wherein in the semiconductor body, lattice vacancies are produced at least in the partial region before the heat treatment.
15. A method for producing a dopant region in a semiconductor body, the method comprising:
providing a semiconductor body having a first side and a second side opposite the first side, wherein in the semiconductor body at least one partial region is formed over a section L of at least 10 μm in a direction from the first side to the second side, the at least one partial region having an oxygen concentration in a range of 1×10 17 cm −3 to 5×10 17 cm −3 ; and
heat treating at least the partial region in a temperature range between 350° C. and 450° C. so that a dopant region comprising a dopant composed of an oxygen complex forms in the partial region over the section L;
wherein the partial region is formed by any one of: setting an oxygen supply from a gas phase during an epitaxial deposition of the semiconductor body on a semiconductor substrate, outdiffusion of oxygen from a substrate into an epitaxial layer deposited on the substrate, indiffusion of oxygen via the first side or via the second side into the semiconductor body, and implantation of oxygen into the semiconductor body.
16. A method for producing a dopant region in a semiconductor body, the method comprising:
providing a semiconductor body having a first side and a second side opposite the first side, wherein in the semiconductor body at least one partial region is formed over a section L of at least 10 μm in a direction from the first side to the second side, the at least one partial region having an oxygen concentration in a range of 1×10 17 cm −3 to 5×10 17 cm −3 ; and
heat treating at least the partial region in a temperature range between 350° C. and 450° C. so that a dopant region comprising a dopant composed of an oxygen complex forms in the partial region over the section L;
wherein the oxygen concentration in the partial region decreases along the section L.