IP Library Granted Patent US 8,911,642
Granted Patent B2
US 8,911,642 · App. 12/995,583 · Granted Dec 16, 2014

Heat conduction composition

Inventors: Klaus Keite-Telgenbüscher (Hamburg, DE); Anja Staiger (Hamburg, DE); Florian Meyer (Hameln, DE)
Assignee: tesa SE
C09J133/06C08K3/22C08K3/38
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Quick Facts
Patent No.
US 8,911,642
App. No.
12/995,583
Granted
Dec 16, 2014
Kind
B2
Abstract

A heat conduction composition is proposed, comprising at least one polymer and a heat-conducting auxiliary material that has an especially high heat conductivity and at the same time has a high mechanical strength. To this end, the heat-conducting auxiliary material comprises particles that in turn are made up of primary particles and that have a mass-specific surface area of 1.3 m 2 /g or less. Also described are a heat-conducting surface element manufactured from said heat conduction composition as well as application possibilities thereof.

Claims (16)

1. A thermal conduction composition comprising at least one (meth)acrylic acid-based polymer and a thermally conducting auxiliary, wherein

the thermally conducting auxiliary comprises particles that (A) have a mass-based specific surface area of 1.3 m 2 /g or less and (B) are composed of primary particles;

the thermal conduction composition is formulated as an adhesive; and

the thermal conduction composition exhibits a thermal conductivity that is higher than that of a composition otherwise identical to the thermal conduction composition except for having a thermal conducting auxiliary comprising particles that (A) have a mass-based specific surface area greater than 1.3 m 2 /g and (B) are composed of primary particles.

2. The thermal conduction composition of claim 1 , wherein the primary particles have an average diameter of at least 1 μm.

3. The thermal conduction composition of claim 1 , wherein the particles of the thermally conducting auxiliary that have a mass-based specific surface area of 1.3 m 2 /g or less have a mass-based specific surface area of 1.0 m 2 /g or less.

4. The thermal conduction composition of claim 1 , wherein the particles of the thermally conducting auxiliary that have a mass-based specific surface area of 1.3 m 2 /g or less comprise at least substantially aluminum oxide particles, boron nitride particles or a mixture of aluminum oxide and boron nitride particles.

5. The thermal conduction composition of claim 4 , wherein the aluminum oxide particles are composed in a fraction of more than 95% by weight of alpha-aluminum oxide.

6. The thermal conduction composition of claim 1 , wherein the thermally conducting auxiliary is composed of material having a thermal conductivity of more than 1 W/mK.

7. The thermal conduction composition of claim 1 , wherein the thermally conducting auxiliary is present in the thermal conduction composition in a fraction of at least 5% and not more than 70% by volume, based in each case on the volume of the thermally conducting auxiliary in the thermal conduction composition.

8. The thermal conduction composition of claim 1 , wherein the particles that have a mass-based specific surface area of 1.3 m 2 /g or less have an average diameter in a range from 2 μm to 500 μm.

9. The thermal conduction composition of claim 1 , wherein said at least one polymer is a polymer based on at least one of acrylic esters, methacrylic esters and derivatives thereof.

10. The thermal conduction composition of claim 1 , which further comprises a further auxiliary with a phase change material.

11. A method for producing a thermally conducting sheetlike element comprising incorporating a thermal conduction composition of claim 1 into said thermally conducting sheetlike element.

12. A method for heat transport within an electronics device comprising incorporating a thermal conduction composition of claim 1 into said electronics device.

13. The thermal conduction composition of claim 1 , wherein the particles of the thermally conducting auxiliary that have a mass-based specific surface area of 1.3 m 2 /g or less comprise aluminum oxide particles.

Assignments (2)
CHANGE OF ADDRESS Recorded Dec 17, 2015
From: TESA SE
To: TESA SE
Reel/Frame 037317/0675 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 10, 2011
From: KEITE-TELGENBUESCHER, KLAUS, DR.; STAIGER, ANJA; MEYER, FLORIAN
To: TESA SE
Reel/Frame 025784/0868 →
Priority Claims (1)
DE 10 2008 049 849 · Oct 1, 2008 · national
Continuity (1)
Related Publication 20110168376A1 · Jul 14, 2011