Light-reflective anisotropic conductive adhesive agent, and light emitting device
A light-reflective anisotropic conductive adhesive and light-emitting device capable of maintaining luminous efficiency of a light-emitting element and preventing the occurrence of a crack to obtain conduction reliability are provided. The light-reflective anisotropic conductive adhesive contains a thermosetting resin composite, conductive particles, and a light-reflective acicular insulating particles. These light-reflective acicular insulating particles are inorganic particles of at least one type selected from the group including titanium oxide, zinc oxide, and titanate.
1. A light-reflective anisotropic conductive adhesive to be used for anisotropic conductive connection of a light-emitting element to a wiring board, the adhesive comprising:
a thermosetting resin;
conductive particles comprising inorganic particles that are multilayered and fixed; and
light-reflective acicular insulating particles.
2. The light-reflective anisotropic conductive adhesive according to claim 1 , wherein the light-reflective acicular insulating particles are inorganic particles of at least one type selected from the group comprising titanium oxide, zinc oxide, and titanate.
3. The light-reflective anisotropic conductive adhesive according to claim 1 , wherein the light-reflective acicular insulating particles are formed by processing a surface of zinc oxide with a silane agent.
4. The light-reflective anisotropic conductive adhesive according to claim 1 , wherein the light-reflective acicular insulating particles have an aspect ratio larger than 10 and smaller than 35.
5. The light-reflective anisotropic conductive adhesive according to claim 1 , wherein the light-reflective acicular insulating particles have an aspect ratio larger than 10 and smaller than 20.
6. The light-reflective anisotropic conductive adhesive according to claim 1 , wherein a content of the light-reflective acicular insulating particles in the thermosetting resin composite is 1 volume % to 50 volume % with respect to the thermosetting resin composite.
7. The light-reflective anisotropic conductive adhesive according to claim 1 , wherein the adhesive further includes light-reflective globular insulating particles.
8. The light-reflective anisotropic conductive adhesive according to claim 7 , wherein the light-reflective acicular insulating particles are contained with a volume amount equal to or larger than a volume amount of the light-reflective globular insulating particles.
9. A light-emitting device in which a light-emitting element is mounted on a wiring board by a flip-chip method via the light-reflective anisotropic conductive adhesive according to claim 1 .
10. The light-emitting device according to claim 9 , wherein the light-emitting element is a light-emitting diode.
11. The light-reflective anisotropic conductive adhesive according to claim 2 , wherein the light-reflective acicular insulating particles have an aspect ratio larger than 10 and smaller than 35.
12. The light-reflective anisotropic conductive adhesive according to claim 3 , wherein the light-reflective acicular insulating particles have an aspect ratio larger than 10 and smaller than 35.
13. The light-reflective anisotropic conductive adhesive according to claim 2 , wherein the light-reflective acicular insulating particles have an aspect ratio larger than 10 and smaller than 20.
14. The light-reflective anisotropic conductive adhesive according to claim 3 , wherein the light-reflective acicular insulating particles have an aspect ratio larger than 10 and smaller than 20.
15. The light-reflective anisotropic conductive adhesive according to claim 2 , wherein a content of the light-reflective acicular insulating particles in the thermosetting resin composite is 1 volume % to 50 volume % with respect to the thermosetting resin composite.
16. The light-reflective anisotropic conductive adhesive according to claim 3 , wherein a content of the light-reflective acicular insulating particles in the thermosetting resin composite is 1 volume % to 50 volume % with respect to the thermosetting resin composite.
17. The light-reflective anisotropic conductive adhesive according to claim 4 , wherein a content of the light-reflective acicular insulating particles in the thermosetting resin composite is 1 volume % to 50 volume % with respect to the thermosetting resin composite.
18. The light-reflective anisotropic conductive adhesive according to claim 5 , wherein a content of the light-reflective acicular insulating particles in the thermosetting resin composite is 1 volume % to 50 volume % with respect to the thermosetting resin composite.