Optical device
View Patent ↗Provided is an optical device capable of bonding each optical part to a substrate with the same applied load by surface activated bonding even if the planar shape sizes of a plurality of optical parts to be mounted on the substrate are different from one another. The optical device includes a substrate, a plurality of optical parts different in planar shape size, bonded to the substrate by surface activated bonding adjacent to one another, and optically coupled with one another, and a plurality of bonding parts provided on the substrate in correspondence to the plurality of optical parts and including metallic micro bumps for bonding each optical part. The total area of the top surfaces of the micro bumps to be bonded to the corresponding optical part of each of the plurality of bonding parts is substantially the same.
1. An optical device comprising:
a substrate;
a plurality of optical parts different in planar shape size, bonded to the substrate by surface activated bonding adjacent to one another, and optically coupled with one another; and
a plurality of bonding parts provided on the substrate in correspondence to the plurality of optical parts and including metallic micro bumps for bonding each optical part,
wherein the total area of the top surfaces of the micro bumps to be bonded to the corresponding optical part of each of the plurality of bonding parts is substantially the same.
2. The optical device according to claim 1 , wherein each of the plurality of bonding parts differs in density of the micro bumps in accordance with the size of the planar shape of the corresponding optical part.
3. The optical device according to claim 2 , wherein each of the plurality of boding parts has substantially the same area of the top surface of each micro bump and differs in the pitch of the micro bumps.
4. The optical device according to claim 2 , wherein each of the plurality of boding parts has substantially the same pitch of the micro bumps and differs in the area of the top surface of each micro bump.
5. The optical device according to claim 1 , wherein the plurality of optical parts is mounted on the same plane of the substrate.
6. The optical device according to claim 1 , wherein the plurality of optical parts is a laser light emitting element and a wavelength conversion element.