IP Library Granted Patent US 8,919,423
Granted Patent B2
US 8,919,423 · App. 13/472,509 · Granted Dec 30, 2014

Heat dissipating device

Inventors: Chia-Yu Lin (New Taipei, TW); Yen Tsai (New Taipei, TW)
Assignee: Cooler Master Development Corporation
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Quick Facts
Patent No.
US 8,919,423
App. No.
13/472,509
Granted
Dec 30, 2014
Kind
B2
Abstract

A heat dissipating device includes a base, a heat dissipating fin and a protruding member. The heat dissipating fin includes a heat dissipating portion, a fixing portion fixed in the base, and a first overflow-proof structure. The first overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the first overflow-proof structure is larger than a width of the heat dissipating portion. A first hole is formed on the heat dissipating portion and the first overflow-proof structure. The protruding member includes a second overflow-proof structure and a first protruding portion protruding from an upper surface of the second overflow-proof structure. The protruding member is disposed in the first hole, and a lower surface of the second overflow-proof structure and a lower surface of the first overflow-proof structure are coplanar.

Claims (20)

1. A heat dissipating device comprising:

a base;

a heat dissipating fin comprising a heat dissipating portion, a fixing portion and a first overflow-proof structure, the fixing portion being fixed in the base, the first overflow-proof structure being connected between the heat dissipating portion and the fixing portion, a width of the first overflow-proof structure being larger than a width of the heat dissipating portion, a first hole being formed on the heat dissipating portion and the first overflow-proof structure; and

a protruding member comprising a second overflow-proof structure and a first protruding portion, the first protruding portion protruding from an upper surface of the second overflow-proof structure, the protruding member being disposed in the first hole, a lower surface of the second overflow-proof structure and a lower surface of the first overflow-proof structure being coplanar.

2. The heat dissipating device of claim 1 , wherein there are two flat surfaces on opposite sides of the second overflow-proof structure, and the protruding member is engaged in the first hole by the two flat surfaces in a tight fitting manner.

3. The heat dissipating device of claim 1 , wherein the base comprises a pillar, a second hole is formed on the lower surface of the second overflow-proof structure and is deep into the first protruding portion, and the pillar is accommodated in the second hole.

4. The heat dissipating device of claim 3 , wherein the protruding member further comprises an engaging structure located in the second hole.

5. The heat dissipating device of claim 4 , wherein the engaging structure is a screw thread.

6. The heat dissipating device of claim 1 , wherein the protruding member further comprises a second protruding portion protruding from the lower surface of the second overflow-proof structure and fixed in the base, an engaging structure is formed on a surface of the second protruding portion, and a third hole is formed on the fixing portion and used for accommodating the second protruding portion.

7. The heat dissipating device of claim 6 , wherein the engaging structure is a screw thread, an oblique thread, a meshed thread and a straight thread.

8. The heat dissipating device of claim 1 , wherein the base comprises a substrate and a box, the substrate and the box are formed integrally, and the box has an accommodating space therein.

9. The heat dissipating device of claim 8 , wherein the base further comprises a flange protruding from a periphery of the box.

10. The heat dissipating device of claim 1 further comprising a plurality of heat pipes disposed in the base.

11. The heat dissipating device of claim 1 , wherein the width of the first overflow-proof structure is larger than a width of the fixing portion.

12. The heat dissipating device of claim 11 , wherein a length of the first overflow-proof structure protruded from the fixing portion is between 1 mm and 10 mm.

13. The heat dissipating device of claim 1 , wherein the heat dissipating fin further comprises a recess structure formed on the fixing portion.

14. The heat dissipating device of claim 13 , wherein the heat dissipating fin further comprises a hook structure formed in the recess structure.

15. The heat dissipating device of claim 1 , wherein the heat dissipating fin further comprises a protruding structure protruded from one end of the fixing portion.

16. The heat dissipating device of claim 1 , wherein the heat dissipating fin further comprises an extending structure extended from the first overflow-proof structure toward the fixing portion.

17. The heat dissipating device of claim 16 , wherein the first overflow-proof structure and the extending structure are formed as U-shape.

Assignments (2)
CHANGE OF NAME Recorded Jan 18, 2014
From: COOLER MASTER CO., LTD.
To: COOLER MASTER DEVELOPMENT CORPORATION
Reel/Frame 032088/0149 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 16, 2012
From: LIN, CHIA-YU; TSAI, YEN
To: COOLER MASTER CO., LTD.
Reel/Frame 028213/0956 →
Priority Claims (1)
TW 101205834 A · Mar 30, 2012 · national
Continuity (1)
Related Publication 20130255927A1 · Oct 3, 2013