IP Library Granted Patent US 8,927,419
Granted Patent B2
US 8,927,419 · App. 14/078,104 · Granted Jan 6, 2015

Chip comprising an integrated circuit, fabrication method and method for locally rendering a carbonic layer conductive

Inventor: Uwe Hoeckele (Regensburg, DE)
Assignee: Infineon Technologies AG
H01L21/76886H01L45/149H01L21/0237H01L21/02527H01L21/02444H01L23/53276H01L21/76823H01L21/76838H01L21/76867H01L2221/1094Y10S977/81
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Quick Facts
Patent No.
US 8,927,419
App. No.
14/078,104
Granted
Jan 6, 2015
Kind
B2
Abstract

A method can be used for locally rendering a carbonic isolating layer conductive. In one embodiment, a laser beam is directed onto the carbonic isolating layer so as to convert amorphous carbon of the carbonic isolating layer into graphite-like carbon. In another embodiment, the carbonic layer is heated so as to form a conducting portion of the layer so that a lateral path through the conducting portion connects two circuit elements of the integrated circuit.

Claims (4)

1. A method for locally rendering a carbonic isolating layer conductive, the method comprising:

directing a laser beam onto the carbonic isolating layer so as to convert amorphous carbon of the carbonic isolating layer into graphite-like carbon.

2. The method of claim 1 , wherein directing the laser beam comprises forming a lateral conducting path within the graphite-like carbon portion such that an isolating portion that comprises amorphous carbon surrounds and abuts the graphite-like carbon.

3. The method of claim 1 , wherein directing the laser beam onto the carbonic isolating layer is performed so that the laser beam travels through a further layer before impinging onto the carbonic isolating layer.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 71984 FRAME: 618. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Aug 19, 2025
From: INFINEON TECHNOLOGIES AG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 072496/0759 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 11, 2025
From: INFINEON TECHNOLOGIES AG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 071984/0618 →
Continuity (2)
Division 13184346 · Jul 15, 2011
Related Publication 20140073132A1 · Mar 13, 2014