Photosensitive polyimides
The present invention relates to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemistry resistance, and flexibility, and can be used as a liquid photo resist or dry film resist, or used in a solder resist, coverlay film, or printed wiring board.
1. A photosensitive polyimide of the following(I):
wherein:
A and C can be the same or different and each represent a tetravalent organic group;
B represents a divalent organic group containing at least one of the following radicals;
with the proviso that B does not comprise
where R represents either a vinyl-group containing unsaturated radical or a radical of the following:
wherein R1 represents a substituted or unsubstituted C1-C20 saturated or unsaturated organic radical, and
R2 represents a vinyl-group containing unsaturated radical;
D represents a divalent organic group;
n is an integer of more than 0; and
m is an integer of 0 or more.
2. The photosensitive polyimide of claim 1 , wherein the vinyl-group containing unsaturated radical is selected from the group consisting of:
wherein:
R4 and R5 each represent H or a substituted or unsubstituted C1-C5 alkyl group, and
R6 represents a covalent bond or a substituted or unsubstituted C1-C20 organic radical.
3. The photosensitive polyimide of claim 1 , wherein the vinyl-group containing unsaturated radical is selected from the group consisting of:
wherein z represents an integer from 0 to 6.
4. The photosensitive polyimide of claim 1 , wherein R1 represents a radical selected from the group consisting of:
wherein:
o, p, q, and r each represent an integer of 0 or more;
R4 and R5 each represent H or substituted or unsubstituted C1-C5 alkyl group, and
R6 represents a covalent bond or a substituted or unsubstituted C1-C20 organic radical;
R7 represents H or a substituted or unsubstituted C1-C12 organic radical; and
R8 represents a covalent bond or organic radical selected from the group consisting of:
5. The photosensitive polyimide of claim 4 , wherein R1 is selected from the group consisting of:
6. The photosensitive polyimide of claim 1 , wherein A and C are independently selected from the group consisting of:
7. The photosensitive polyimide of claim 1 , wherein the divalent organic group B is selected from the group consisting of:
wherein R′ is an organic group containing
R9 represents H, methyl, or ethyl;
s is an integer of 1 to 4;
t is an integer of 0 to 5;
u is an integer of 0 or more;
v is an integer of more than 0; and
R11 represents a covalent bond or a radical selected from the group consisting of:
wherein w and x each represent an integer of more than 0, and R12 represents a covalent bond or a substituted or unsubstituted C1-C18 organic radical, and wherein R is as defined in claim 1 .
8. The photosensitive polyimide of claim 7 , wherein the divalent organic group B is selected from the group consisting of:
wherein R′ is as defined in claim 7 .
9. the photosensitive polyimide of claim 1 , wherein group D is selected from the group consisting of:
wherein:
R″ represents H, C—C4 alkyl, C1-C4 perfluoroalkyl, methoxy, ethoxy, a halogen, OH, COOH, NH2, or SH;
R9 represents H, methyl, or ethyl;
s is an integer of 1 to 4;
t is an integer of 0 to 5;
u is an integer of 0 or more;
v is an integer of more than 0; and
R11 represents a covalent bond or a radical selected from the group consisting of:
wherein w and x each represent an integer of more than 0, and R12 represents a covalent bond or substituted or unsubstituted C1-C18 organic radical;
c is an integer of 0 to 4;
a is an integer of more than 0, and
b is an integer of more than 0.
10. The photosensitive polyimide of claim 9 , wherein group D is selected from the group consisting of:
wherein y is an integer of 1 to 12.
11. A photosensitive composition comprising at least 1% by weight, based on the total weight of the composition, of the photosensitive polyimide of claim 1 and at least one photoinitiator.
12. The photosensitive composition of claim 11 , further comprising a reactive monomer or oligomer.
13. A liquid photo resist or dry film resist comprising the photosensitive composition of claim 11 .
14. A liquid photo resist or dry film resist comprising the photosensitive composition of claim 12 .
15. A photosensitive polyimide of the following formula (I):
wherein:
A and C can be the same or different and each represent a tetravalent organic group;
B represents a divalent organic group containing the radical;
where R represents a radical of the following:
wherein R1 represents a substituted or unsubstituted C1-C20 saturated or unsaturated organic radical, and
R2 represents a vinyl-group containing unsaturated radical;
D represents a divalent organic group;
n is integer of more than 0; and
m is an integer of 0 or more.
16. A photosensitive polyimide of the following formula (I):
wherein:
A and C can be the same or different and each represent a tetravalent organic group;
B represents a divalent organic group containing the following radical:
where R represents a radical of the following:
wherein R1 represents a substituted or unsubstituted C1-C20 saturated or unsaturated organic radical, and
R2 represents a vinyl-group containing unsaturated radical;
D represents a divalent organic group;
n is an integer of more than 0; and
m is an integer of 0 or more.
17. The photosensitive polyimide of claim 1 , wherein B represents a divalent organic group containing at least one of the following radicals:
18. The photosensitive polyimide of claim 1 , wherein R represents a radical selected from the group consisting of: