IP Library Granted Patent US 8,933,475
Granted Patent B2
US 8,933,475 · App. 13/609,726 · Granted Jan 13, 2015

Light emitting device

Inventors: Katsutoshi Nakagawa (Yokohama, JP); Yasumasa Ooya (Chigasaki, JP); Yoshitaka Funayama (Yokohama, JP); Daichi Usui (Yokohama, JP)
Assignees: Kabushiki Kaisha Toshiba; Toshiba Materials Co., Ltd.
H01L33/501H01S5/02296H01L33/02H01L33/504H01L33/505H01S5/005H01S5/02228H01L33/56
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Quick Facts
Patent No.
US 8,933,475
App. No.
13/609,726
Granted
Jan 13, 2015
Kind
B2
Abstract

A light emitting device 1 according to an embodiment includes a planar alumina substrate, a semiconductor light-emitting element mounted on the alumina substrate, and a phosphor layer. The phosphor layer includes a silicone resin layer provided to cover an upper surface and a side surface of the semiconductor light-emitting element and a phosphor emitting visible light by being excited with light emitted from the semiconductor light-emitting element. The phosphor is dispersed in the silicone resin layer. The alumina substrate has a water absorption rate of 5% or more and 60% or less, and an adhesion strength between the alumina substrate and the silicone resin layer is 1 N or more.

Claims (24)

1. A light emitting device, comprising:

a planar alumina substrate;

a semiconductor light-emitting element mounted on the alumina substrate;

a first silicone resin layer with transparency provided on the alumina substrate to cover an upper surface and a side surface of the semiconductor light-emitting element; and

a phosphor layer including a second silicone resin layer provided on the alumina substrate to cover an outer surface of the first silicone resin layer, and a phosphor, dispersed in the second silicone resin layer, emitting visible light by being excited with light emitted from the semiconductor light-emitting element,

wherein the alumina substrate has a water absorption rate of 5% or more and 60% or less, and each of an adhesion strength between the alumina substrate and the first silicone resin layer and an adhesion strength between the alumina substrate and the second silicone resin layer is 1 N or more,

wherein the first silicone resin layer does not contain the phosphor, and is configured to inhibit absorption of the light emitted from the semiconductor light-emitting element, and

wherein an external surface of the phosphor layer has a semispherical shape, a columnar shape, or an oval cylindrical shape so that the visible light is emitted from a whole external surface of the phosphor layer to an outside of the light emitting device.

2. The light emitting device according to claim 1 ,

wherein the semiconductor light-emitting element emits the light of which peak wavelength is in a range of 360 nm or more and 440 nm or less.

3. The light emitting device according to claim 2 ,

wherein the phosphor layer includes a blue phosphor, a green phosphor and a red phosphor, and emits white light by being excited with the light emitted from the semiconductor light-emitting element.

4. The light emitting device according to claim 1 ,

wherein the semiconductor light-emitting element emits the light of which peak wavelength is in a range of 360 nm or more and 410 nm or less.

5. The light emitting device according to claim 1 ,

wherein the semiconductor light-emitting element is a light-emitting diode or a laser diode.

6. The light emitting device according to claim 1 ,

wherein a thickness of the phosphor layer on the upper surface of the semiconductor light-emitting element is in a range of 0.1 mm or more and 2 mm or less.

7. The light emitting device according to claim 1 ,

wherein plural semiconductor light-emitting elements are mounted on the alumina substrate.

8. The light emitting device according to claim 1 ,

wherein a thickness of the first silicone resin layer on the upper surface of the semiconductor light-emitting element is in a range of 0.5 mm or more and 5 mm or less.

9. The light emitting device according to claim 1 , wherein the external surface of the phosphor layer has the semispherical shape.

10. The light emitting device according to claim 1 , wherein the whole external surface of the phosphor layer except a contact surface with the alumina substrate is exposed toward the outside of the light emitting device.

Assignments (3)
NUNC PRO TUNC ASSIGNMENT Recorded Nov 26, 2021
From: TOSHIBA MATERIALS CO.,LTD.
To: SEOUL SEMICONDUCTOR CO.,LTD.
Reel/Frame 058251/0316 →
NUNC PRO TUNC ASSIGNMENT Recorded Jun 21, 2021
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MATERIALS CO., LTD.
Reel/Frame 057436/0701 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 21, 2012
From: NAKAGAWA, KATSUTOSHI; OOYA, YASUMASA; FUNAYAMA, YOSHITAKA; USUI, DAICHI
To: KABUSHIKI KAISHA TOSHIBA; TOSHIBA MATERIALS CO., LTD.
Reel/Frame 029334/0874 →
Priority Claims (1)
JP 2010-054418 · Mar 11, 2010 · national
Continuity (2)
Continuation PCTJP2011001178 · Mar 1, 2011
Related Publication 20130240915A1 · Sep 19, 2013