IP Library Granted Patent US 8,937,243
Granted Patent B2
US 8,937,243 · App. 12/615,383 · Granted Jan 20, 2015

Structures and methods for high-efficiency pyramidal three-dimensional solar cells

Inventors: Pawan Kapur (Burlingame, CA); Mehrdad M. Moslehi (Los Altos, CA)
Assignee: Solexel, Inc.
H01L31/022425H01L31/068H01L31/1896H01L31/02363H01L31/02366H01L31/03529H01L31/182Y02E10/547Y02E10/546
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Quick Facts
Patent No.
US 8,937,243
App. No.
12/615,383
Granted
Jan 20, 2015
Kind
B2
Abstract

The present disclosure enables high-volume cost effective production of three-dimensional thin film solar cell (3-D TFSC) substrates. First, the present disclosure discloses pyramid-like unit cell structure 16 and 50 which enable epitaxial growth through their open pyramidal structure. The present disclosure than gives four 3-D TFSC embodiments 70, 82, 100 , and 110 which may combined as necessary. A basic 3-D TFSC having a substrate, emitter, oxidation on the emitter, front and back metal contacts allows simple processing. Other embodiments disclose a selective emitter, selective backside metal contact, and front-side SiN ARC layers. Several processing methods including process flows 150, 200, 250, 300 , and 350 enable production of these 3-D TFSC. Further, the present disclosure enables higher throughput through the use of dual sided template 400 . By processing the substrate in the template, the present disclosure increases yield and reduces processing steps.

Claims (50)

1. A pyramidal three-dimensional thin film solar cell (3-D TFSC) having enhanced processing properties, comprising:

a p-type epitaxial 3-D TFSC substrate comprising a plurality of pyramidal unit cells, wherein said unit cells comprise:

tapered sidewalls having different crystallographic planes including the <111> plane, said tapered sidewalls forming an open pyramid-like structure;

a substantially flat top-ridge having a crystallographic <100> plane, said top-ridge associated with said tapered sidewalls; and

said tapered sidewalls having a backside surface; and

said 3-D TFSC substrate further comprising a back P+ doped layer;

a single phosphorous diffusion emitter layer formed in said tapered sidewalls and said top-ridge;

an oxide passivation layer formed on said emitter layer, said oxide passivation layer formed on said tapered sidewalls;

a blanket metal contact layer formed on said back surface; and

front metal contacts formed on said emitter layer, said front metal contacts formed on said top-ridge.

2. The 3-D TFSC of claim 1 wherein said P+ doped layer further comprises in-situ doped P+ layer.

3. The 3-D TFSC substrate of claim 1 , wherein said p-type epitaxial substrate doping is varied.

4. The 3-D TFSC substrate of claim 1 , wherein said p-type epitaxial substrate doping is constant.

5. The 3-D TFSC substrate of claim 1 , further comprising a silicon substrate.

6. The 3D TFSC substrate of claim 1 , wherein the n+ dopant layer comprises of the in-situ emitter.

7. A pyramidal three-dimensional thin film solar cell (3-D TFSC) having enhanced processing properties, comprising:

a p-type epitaxial 3-D TFSC substrate comprising a plurality of pyramidal unit cells, wherein said unit cells comprise:

tapered sidewalls having a crystallographic <111> plane, said tapered sidewalls forming an open pyramid-like structure;

a substantially flat top-ridge having a crystallographic <100> plane, said top-ridge associated with said tapered sidewalls; and

said tapered sidewalls having a back surface; and

said 3-D TFSC substrate further comprising a back P+ doped layer;

a phosphorous diffusion emitter layer formed in said tapered sidewalls;

a phosphorous diffusion selective emitter layer formed in said top-ridge;

an oxide passivation layer formed on said emitter layer, said oxide passivation layer formed on said tapered sidewalls;

a blanket metal contact layer formed on said backside surface; and

front metal contacts formed on said emitter layer, said front metal contacts formed on said top-ridge.

8. The 3-D TFSC substrate of claim 7 , wherein said selective emitter layer is doped less heavily than said emitter layer.

9. The 3-D TFSC substrate of claim 7 , wherein said P+ doped layer is in-situ doped.

10. The 3-D TFSC substrate of claim 7 , wherein said p-type epitaxial substrate doping is varied.

11. The 3-D TFSC substrate of claim 7 , wherein said p-type epitaxial substrate doping is constant.

12. The 3-D TFSC substrate of claim 7 , further comprising a silicon substrate.

13. The 3-D TFSC substrate of claim 7 , further comprising a SiN ARC layer formed on said oxide passivation layer.

14. A pyramidal three-dimensional thin film solar cell (3-D TFSC) having enhanced processing properties, comprising:

a p-type epitaxial 3-D TFSC substrate comprising a plurality of pyramidal unit cells, wherein said unit cells comprise:

tapered sidewalls having a crystallographic <111> plane, said tapered sidewalls forming an open pyramid-like structure;

a substantially flat top-ridge having a crystallographic <100> plane, said top-ridge associated with said tapered sidewalls; and

said tapered sidewalls having a backside surface; and

said 3-D TFSC substrate further comprising a back P+ doped layer;

a phosphorous diffusion emitter layer formed in said tapered sidewalls and said top-ridge;

an oxide passivation layer formed on said emitter layer, said oxide passivation layer formed on said tapered sidewalls;

a complete passivation layer formed at least partially on said backside surface;

a selective metal contact layer formed on said complete passivation layer on said back surface, said selective metal contact at least partially contacting said p-type epitaxial 3-D TFSC; and

front metal contacts formed on said emitter layer, said front metal contacts formed on said top-ridge.

15. The 3-D TFSC substrate of claim 14 , wherein said emitter layer further comprises a selective emitter layer formed in said top-ridge.

16. The 3-D TFSC substrate of claim 15 , wherein said selective emitter layer is doped less heavily than said emitter layer.

17. The 3-D TFSC substrate of claim 14 , wherein said P+ doped layer further comprises an in-situ doped P+ layer.

18. The 3-D TFSC substrate of claim 14 , wherein said p-type epitaxial substrate doping is varied.

19. The 3-D TFSC substrate of claim 14 , wherein said p-type epitaxial substrate doping is constant.

20. The 3-D TFSC substrate of claim 14 , further comprising a silicon substrate.

21. The 3-D TFSC substrate of claim 14 , further comprising a SiN ARC layer formed on said oxide passivation layer.

Assignments (6)
ASSIGNMENT OF LOAN DOCUMENTS Recorded Sep 29, 2017
From: OPUS BANK
To: OB REALTY, LLC
Reel/Frame 044062/0383 →
CHANGE OF NAME Recorded Jul 28, 2017
From: SOLEXEL, INC.
To: BEAMREACH SOLAR, INC.
Reel/Frame 043367/0649 →
RECORDATION OF FORECLOSURE OF PATENT PROPERTIES Recorded Jul 27, 2017
From: OB REALTY, LLC
To: OB REALTY, LLC
Reel/Frame 043350/0822 →
CHANGE OF NAME Recorded Jul 26, 2017
From: SOLEXEL, INC.
To: BEAMREACH SOLAR, INC.
Reel/Frame 043342/0439 →
SECURITY INTEREST Recorded Jan 7, 2015
From: SOLEXEL, INC.
To: OPUS BANK
Reel/Frame 034731/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 23, 2010
From: KAPUR, PAWAN; MOSLEHI, MEHRDAD
To: SOLEXEL, INC.
Reel/Frame 023978/0267 →
Continuity (4)
Continuation 11868494 · Oct 6, 2007
Provisional Application 60828678 · Oct 9, 2006
Provisional Application 60886303 · Jan 24, 2007
Related Publication 20110108098A1 · May 12, 2011