Metal card
A method and apparatus for treating a selected region of a metal layer, used to form a metal card, by annealing the selected metal region so the selected region becomes soft and ductile, while the rest of the metal layer remains stiff. The softened, ductile, selected metal region can be embossed with reduced power and with reduced wear and tear on the embossing equipment. Alternatively, the annealed metal layer can undergo additional processing steps to form an assembly which can then be embossed. The method may include the use of a fixture for holding the metal layer, with the fixture having a window region for enabling heat to be applied to soften the region of the metal layer within the window region. The fixture includes apparatus for cooling the portion of the metal layer outside of the window region and for preventing the temperature of the metal layer outside the window region from rising above predetermined limits.
1. A method for forming a metalized card, comprising the steps of:
selecting a non-annealed metal layer suitable for use in forming a metallized card;
annealing a selected portion of the metal layer wherein the selected portion is less than the entire metalized card and rendering the metal within the selected portion ductile and susceptible to being embossed so as to reduce the power needed to emboss the selected portion of the metal layer and to reduce the wear and tear on the embossing equipment;
wherein annealing includes the steps of placing the metal layer within a fixture having a window region for enabling sufficient heat to be applied to the metal layer within the window region to only anneal soften the region of the metal layer within the window region;
heating the selected portion of the metal layer to above the recrystallization temperature and maintaining a suitable temperature, and then cooling;
controlling the heat of the non selected portions of the metal layer to prevent the non selected portions of the metal layer from being softened when heat is being applied to the selected portion;
embossing the selected portion of the metal layer with selected information; and
processing said metal layer to form said metalized card.
2. A method as claimed in claim 1 , wherein the heat applied to the selected portion is of a nature to fully anneal the selected portion.
3. A method as claimed in claim 2 , wherein controlling the heat of the non selected portion of the metal layer includes applying a heat sink to cool the non selected portions of the metal layer.
4. A method as claimed in claim 2 , wherein said metal layer has a surface area and wherein the heat sink is applied to cool the entire surface area of the metal layer except for the selected portion of the metal layer.
5. A method as claimed in claim 1 wherein the fixture includes means for cooling the portion of the metal layer outside of the window region and preventing the temperature of the metal layer outside the window region from rising above predetermined limits.
6. A method as claimed in claim 1 , only the selected portion of the metal layer to be embossed has sufficient heat applied to it to anneal the selected portion and the regions of the metal layer which are not to be embossed are not subjected to such heat as would cause them to lose their stiffness.
7. A method as claimed in claim 1 wherein an additional layer of a soft material is added to the metal layer.
8. A method as claimed in claim 1 wherein at least one additional layer of a soft material is added to the metal layer after it has undergone the annealing process to form an assembly; and wherein the assembly is then embossed with desired information.
9. A method for embossing a metal layer used in forming a metalized card comprising the steps of:
selecting an un-annealed metal layer suitable for use in forming a metallized card;
placing the metal layer in a fixture for holding the metal layer, said fixture having a window region for enabling heat to be applied to selected portions of the metal layer within the window region;
annealing the selected portions of the metal layer and softening the metal within the selected portions so it can be embossed with reduced wear and tear on the embossing equipment; wherein annealing includes the steps of heating the selected portion of the metal layer to above the recrystallization temperature and maintaining a suitable temperature, and then cooling;
controlling the heat applied to a non selected portions of the metal layer being outside the window region to prevent the non selected portions of the card from being softened when heat is being applied to the selected portions; and
embossing the selected portions of the metal layer with desired information.
10. A method as claimed in claim 9 , wherein controlling the heat applied to non selected portions of the metal layer includes applying a heat sink to the non selected portions of the metal card.
11. A method as claimed in claim 10 , wherein said metal layer has a surface area and wherein the heat sink cools the entire surface area of the metal layer except for the selected portions of the metal layer.
12. A method as claimed in claim 9 , wherein the fixture includes means for cooling the portion of the metal layer outside of the window region and preventing the temperature of the metal layer outside the window region from rising above predetermined limits.
13. A method as claimed in claim 9 , including using a fixture to ensure that only the selected portion of the metal layer to be embossed has heat applied to it and the regions of the metal layer which are not to be embossed are not subjected to the heat treatment, whereby these regions remain hard and stiff and not subjected to bending.
14. A method as claimed in claim 9 , wherein the metal layer is part of a metal sheet.