Internal electrical contact for enclosed MEMS devices
A method of fabricating electrical connections in an integrated MEMS device is disclosed. The method comprises forming a MEMS wafer. Forming a MEMS wafer includes forming one cavity in a first semiconductor layer, bonding the first semiconductor layer to a second semiconductor layer with a dielectric layer disposed between the first semiconductor layer and the second semiconductor layer, and etching at least one via through the second semiconductor layer and the dielectric layer and depositing a conductive material on the second semiconductor layer and filling the at least one via. Forming a MEMS wafer also includes patterning and etching the conductive material to form one standoff and depositing a germanium layer on the conductive material, patterning and etching the germanium layer, and patterning and etching the second semiconductor layer to define one MEMS structure. The method also includes bonding the MEMS wafer to a base substrate.
1. A method of fabricating electrical connections in an integrated MEMS device comprising:
forming a MEMS substrate comprising:
depositing a dielectric layer on a handle layer;
patterning and etching the dielectric layer to form at least one via to the handle layer;
depositing a silicon layer on the dielectric layer and into the at least one via;
patterning and etching the silicon layer to define one or more MEMS structures;
etching the dielectric layer to release the MEMS structures; and
bonding the MEMS substrate to a base substrate.
2. The method of claim 1 , further comprising depositing a conductive layer on the silicon layer.
3. The method of claim 2 , wherein the conductive layer comprises germanium.
4. The method of claim 1 , further comprising depositing conductive pads on the base substrate.
5. The method of claim 4 , where in the bond is an eutectic bond between the germanium and the conductive pads.
6. The method of claim 1 , further comprises patterning and etching the silicon layer to form at least one stand-off.
7. The method of claim 6 , where in the standoff is bonded to the base substrate.
8. The method of claim 1 , wherein the base substrate comprises one of a semiconductor substrate and a CMOS substrate.
9. The method of claim 1 , wherein the bonding provide electrical connection between the handle layer and the base substrate via the device layer.