Switching element
In a switching element, a first region that is exposed on an upper surface of a semiconductor substrate, a second region that is exposed on the upper surface of the substrate and extends to below the first region, and a third region that is formed below the second region, are formed on the substrate. A trench is formed in the upper surface of the substrate. A gate electrode has a first portion that extends from a depth of the first region to a depth of the third region at at least a portion in the trench formed in an area where the first region is exposed, and a second portion that is formed to a depth of the second region, and does not reach the depth of the third region, at at least a portion in the trench formed in an area where the second region is exposed.
1. A switching element comprising:
a semiconductor substrate having a first region of a first conduction type that is exposed on an upper surface of the semiconductor substrate, a second region of a second conduction type that is exposed on the upper surface of the semiconductor substrate and extends to below the first region, and a third region of the first conduction type that is formed below the second region and is separated from the first region by the second region;
an upper electrode that is formed on the upper surface of the semiconductor substrate and is electrically connected to the first region and the second region;
a trench that is formed in the upper surface of the semiconductor substrate and is formed extending between a region where the first region is exposed and a region where the second region is exposed; and
a gate electrode that includes a first portion that is formed in the trench, and extends from a depth of the first region to a depth of the third region at at least a portion in the trench formed in an area where the first region is exposed when the upper surface of the semiconductor substrate is viewed from above, and a second portion that is formed in the trench, and extends from a depth of the first region to a depth of the second region, and does not reach the depth of the third region, at at least a portion in the trench formed in an area where the second region is exposed when the upper surface of the semiconductor substrate is viewed from above, the gate electrode being insulated from the semiconductor substrate by an insulating film.
2. The switching element according to claim 1 , further comprising a shield electrode that is formed below the first portion, and that is insulated from the gate electrode and the semiconductor substrate by an insulating film.
3. The switching element according to claim 2 , wherein the shield electrode is formed to below the second portion.
4. The switching element according to claim 3 , wherein the shield electrode below the second portion extends from the depth of the second region to the depth of the third region.
5. The switching element according to claim 2 , wherein the shield electrode is electrically connected to the upper electrode.