Templates having high contrast alignment marks
View Patent ↗Described are systems and methods for formation of templates having alignment marks with high contrast material. High contrast material may be positioned within recesses of alignment marks.
1. A method of patterning an imprint nano-lithography substrate, comprising the steps of:
(a) forming a plurality of protrusions and recessions onto an alignment area and a feature area of the substrate;
(b) depositing high contrast material on the alignment area;
(c) forming a layer on the alignment and feature areas;
(d) removing a portion of the formed layer from the alignment area, such that the remaining portion of the formed layer remains only in the recessions of the alignment area;
(e) removing a portion of the high contrast material from the alignment area, such that the remaining portion of the high contrast material remains only in the recessions of the alignment area; and
(g) removing the remaining portion of the of the formed layer in the recessions of the alignment area to expose the high contrast material remaining in the recessions of the alignment area.
2. The method of claim 1 further comprising depositing high contrast material on the feature area.
3. The method of claim 2 further comprising removing the high contrast material from the feature area.
4. The method of claim 1 further comprising removing the formed layer from the feature area.
5. The method of claim 4 wherein the formed layer has a first thickness over the alignment area and a second thickness over the feature area, and where the first thickness is greater than the second thickness.
6. The method of claim 1 wherein the formed layer is formed by dispensing a polymerizable material on the substrate, contacting the polymerizable material with an imprint template, and solidifying the polymerizable material.
7. The method of claim 1 wherein the formed layer is formed by a spin-on process.
8. The method of claim 1 wherein the formed layer is patterned.
9. The method of claim 1 wherein the formed layer further comprises at least two different layers having different etching rates.
10. The method of claim 9 wherein one of the different layers is a planarized layer and another of the two different layers is a patterned layer.
11. The method of claim 9 further comprising a hard mask disposed between at least two of the different layers.
12. The method of claim 11 wherein one of the different layers is a planarized layer and another of the two different layers is a patterned layer.
13. A method of patterning an imprint nano-lithography substrate, comprising the steps of:
(a) forming a plurality of protrusions and recessions onto an alignment area and a feature area of the substrate;
(b) depositing high contrast material on the alignment area;
(c) forming a layer on the alignment area by dispensing a polymerizable material on the substrate, contacting the polymerizable material with an imprint template in superimposition with the alignment and feature areas, the imprint template being transparent at that area of the template in superimposition with the alignment area and substantially opaque at that area of the template in superimposition with the feature area, and irradiating the polymerizable material to solidify the polymerizable material on the alignment area;
(d) removing a portion of the formed layer from the alignment area, such that the remaining portion of the formed layer remains only in the recessions of the alignment area;
(e) removing a portion of the high contrast material from the alignment area, such that the remaining portion of the high contrast material remains only in the recessions of the alignment area; and
(g) removing the remaining portion of the of the formed layer in the recessions of the alignment area to expose the high contrast material remaining in the recessions of the alignment area.
14. The method of claim 13 further comprising depositing high contrast material on the feature area.
15. The method of claim 14 further comprising removing the high contrast material from the feature area.
16. The method of claim 13 wherein the formed layer further comprises at least two different layers having different etching rates.
17. The method of claim 16 further comprising adding a hard mask between at least two of the different layers.