Modification of surface energy via direct laser ablative surface patterning
Surface energy of a substrate is changed without the need for any template, mask, or additional coating medium applied to the substrate. At least one beam of energy directly ablates a substrate surface to form a predefined topographical pattern at the surface. Each beam of energy has a width of approximately 25 micrometers and an energy of approximately 1-500 microJoules. Features in the topographical pattern have a width of approximately 1-500 micrometers and a height of approximately 1.4-100 micrometers.
1. A method of adhesively bonding a first surface to a second surface, comprising the steps of:
providing a substrate comprising substrate material defining an ablation threshold;
determining a topographical pattern including areas from which material is to be removed;
directly laser treating selected portions of a completely uncovered first surface of said substrate corresponding to the areas using at least one beam of energy having sufficient energy to supersede said ablation threshold of said substrate material to form a laser surface treated area comprising the predefined topographical pattern at said first surface, said at least one beam of energy having a width of approximately 25 micrometers and an energy of approximately 1-500 microJoules, wherein features in said predefined topographical pattern have a width of approximately 1-500 micrometers and a height of approximately 1.4-100 micrometers;
utilizing adhesive to adhesively bond said laser surface treated area of said first surface to a second surface.
2. The method of claim 1 , wherein said substrate is selected from the group consisting of metals, metal alloys, ceramics, polymers, fiber-reinforced composites thereof, and combinations thereof.
3. The method of claim 1 , wherein said substrate comprises a metal alloy selected from the group consisting of titanium alloys and aluminum alloys.
4. The method of claim 1 , wherein said substrate comprises a polymer material selected from the group consisting of polyimide, copoly(imide siloxane), copoly(imide butadiene), copoly(imide butadiene acrylonitrile), polycarbonate, poly(arylene ether), fluoropolymer, epoxy resins and polyphenylene.
5. The method of claim 1 , wherein said substrate comprises a carbon fiber-reinforced epoxy matrix composite material.
6. The method of claim 1 , wherein the ablating step further comprises the step of controlling parameters consisting of beam size, laser power, laser frequency, scan speed, number of pattern iterations, and combinations thereof.
7. The method of claim 1 , wherein said surface treated area of said first surface is coated with at least one of a primer and a coupling agent prior to adhesively bonding said surface treated area of said first surface to a second surface.
8. The method of claim 1 , wherein said at least one beam of energy comprises a laser beam.
9. The method of claim 8 , wherein said laser beam is pulsed.
10. The method of claim 8 , wherein said laser beam is continuous.
11. A method of adhesively bonding a first surface to a second surface, comprising the steps of:
providing a substrate comprising a substrate material defining an ablation threshold;
determining a topographical pattern including areas from which material is to be removed;
utilizing at least one laser beam of energy having sufficient energy to supersede said ablation threshold of said substrate material to directly laser surface treat areas of an uncovered substrate corresponding to the areas to form a laser surface treated area comprising the predefined topographical pattern at said first surface, said at least one laser having a width of approximately 25 micrometers and an energy of approximately 1-200 microJoules, wherein features in said topographical pattern have a width of approximately 10-250 micrometers and a height of approximately 1.4-50 micrometers, and wherein said substrate is selected from the group consisting of metals, metal alloys, ceramics, polymers, fiber-reinforced composites thereof, and combinations thereof;
utilizing adhesive to adhesively bond said laser surface treated area of said first surface to a second surface.
12. The method of claim 11 , wherein said surface treated area of said first surface is coated with at least one of a primer and a coupling agent prior to adhesively bonding said surface treated area of said first surface to a second surface.
13. The method of claim 11 , wherein the ablating step further comprises the step of controlling parameters selected from the group consisting of beam size, laser power, laser frequency, scan speed, number of pattern iterations, and combinations thereof.
14. A method of adhesively bonding a first surface to a second surface, the method comprising:
providing a substrate comprising a substrate material defining an ablation threshold;
determining a pattern that includes predefined areas from which material is to be removed;
utilizing at least one laser beam having sufficient energy to supersede said ablation threshold of said substrate material to directly laser surface treat selected portions of an uncovered first surface of said substrate corresponding to the predefined areas to form a laser surface treated area comprising a predefined topographical pattern at said first surface, said at least one laser beam having a width of approximately 25 micrometers and an energy of approximately 3-175 microJoules, wherein features in said topographical pattern have a width of approximately 15-100 micrometers and a height of approximately 10-30 micrometers;
utilizing adhesive to adhesively bond said laser surface treated area of said first surface to a second surface.
15. The method of claim 14 , wherein said surface treated area of said first surface is coated with at least one of a primer and a coupling agent prior to adhesively bonding said surface treated area of said first surface to a second surface.
16. A method of reducing the surface energy of a substrate to promote abhesion the method comprising:
providing a substrate comprising a substrate material defining an ablation threshold, said substrate having a surface defining a first surface energy;
transcribing a predefined pattern onto said surface of said substrate to form a treated surface by directly ablating said surface of said substrate using at least one beam of energy having sufficient energy to supersede said ablation threshold of said substrate material to form a predefined topographical pattern at said treated surface, said at least one beam of energy having a width of approximately 25 micrometers and an energy of approximately 1-500 microJoules, wherein said treated surface has a surface defining a second surface energy that is significantly lower than said first surface energy.
17. The method of claim 16 , wherein:
features in said predefined topographical pattern have a width of approximately 1-500 micrometers and a height of approximately 1.4-100 micrometers.
18. The method of claim 17 , wherein the topographical pattern comprises a crosshatch pattern having a plurality of pillars defining gaps therebetween.
19. The method of claim 18 , wherein the topographical pattern comprises a 0°/90° crosshatch pattern.