Modular electronics chassis
An apparatus for removing a modular electronic device from a chassis and a method for assembling thereof are provided. The apparatus for removing the modular electronic device from the chassis includes a door pivotally coupled to the chassis, a sliding element in slidable engagement with the door, an ejection actuator including a spring member connected to the ejection actuator and to the rear of the chassis, and a linkage element connecting the sliding element with the ejection actuator. Additionally, the apparatus for removing the modular electronic device from the chassis includes a guide rail disposed in the chassis enclosure to guide the modular electronic device and to guide the ejection actuator along the chassis enclosure.
1. An apparatus for removing a modular electronic device from a chassis, comprising:
a door pivotally coupled to the chassis in front of a chassis enclosure and along an axis pivotal coupling, the axis of pivotal coupling extending through the door, the chassis enclosure configured to enclose the modular electronic device;
a sliding element in slidable engagement with the door, the sliding element configured to move along the door;
an ejection actuator disposed in a rear of the chassis enclosure, the ejection actuator including a spring member, wherein the spring member has a first spring member end and a second spring member end, the first spring member end being connected to the ejection actuator, and the second spring member end being connected to the rear of the chassis; and
a flexible linkage element having a first linkage element end and a second linkage element end, the flexible linkage element being connected, by the first linkage element end, to the sliding element and connected, by the second linkage element end, to the ejection actuator, wherein the flexible linkage element passes around the axis of pivotal coupling of the door to the chassis.
2. The apparatus of claim 1 , wherein the door is configured to rotate between a closed position and an open position, wherein in the closed position the door covers the chassis enclosure to prevent the modular electronic device from being removed from the chassis, and wherein in the open position the door allows removal of the modular electronic device from the chassis.
3. The apparatus of claim 1 , wherein the ejection actuator is configured to move along the chassis enclosure and remove the modular electronic device from the chassis.
4. The apparatus of claim 1 , further comprising at least one guide rail disposed in the chassis enclosure to guide the modular electronic device, the at least one guide rail extending from about an opening of the chassis enclosure to the rear of the chassis enclosure.
5. The apparatus of claim 4 , wherein the ejection actuator is configured to move along the guide rail.
6. The apparatus of claim 1 , wherein the spring member is configured to restore the ejection actuator to an initial position in the chassis enclosure.
7. The apparatus of claim 1 , wherein the ejection actuator includes an angle bracket.
8. The apparatus of claim 1 , wherein a length of the door is variable to regulate a force of ejection of the modular electronic device.
9. The apparatus of claim 1 , wherein the ejection actuator is mechanized with an electric motor.
10. The apparatus of claim 1 , wherein the ejection actuator is electronically coupled to at least one sensor configured to alert a user to a complete or an incomplete insertion or a removal of the modular electronic device.
11. The apparatus of claim 10 , wherein the alert is facilitated by one or more Light Emitting Diodes (LEDs) associated with the chassis.
12. The apparatus of claim 1 , wherein the sliding element includes a locking member configured to lock the door in an engaged position with the chassis.
13. The apparatus of claim 12 , wherein the locking member includes a latch.
14. The apparatus of claim 13 , wherein the modular electronic device includes a hard disk drive (HDD), a solid state disk (SSD), a disk array, a compact disk, and a flash memory module.
15. A method for assembling an apparatus for removing a modular electronic device from a chassis, comprising:
slidably engaging a sliding element with a door;
pivotally coupling the door to the chassis in front of a chassis enclosure, and analog an axis of pivotal coupling, the axis of pivotal coupling extending through the door, wherein the chassis enclosure is configured to enclose the modular electronic device;
disposing an ejection actuator in a rear of the chassis enclosure;
connecting a spring member having a first spring member end and a second spring member end, by the first spring member end, to the ejection actuator and, by the second spring member end, to the rear of the chassis;
connecting a flexible linkage element having a first linkage element end and a second linkage element end, by the first linkage element end, to the sliding element and, by the second linkage element end, to the ejection actuator; and
laying the flexible linkage element around the axis of pivotal coupling of the door to the chassis.
16. The method of claim 15 , further comprising disposing at least one guide rail in the chassis enclosure to guide the modular electronic device.
17. The method of claim 15 , further comprising varying a length of the door to regulate a force of ejection of the modular electronic device.
18. The method of claim 15 , further comprising electronically coupling the ejection actuator to at least one sensor configured to alert a user to a complete or an incomplete insertion or a removal of the modular electronic device.
19. The method of claim 15 , further comprising mechanizing the ejection actuator with an electric motor.
20. An apparatus for removing a modular electronic device from a chassis, comprising:
a door pivotally coupled to the chassis in front of a chassis enclosure and along an axis of pivotal coupling, the axis of pivotal coupling extending through the door, the chassis enclosure configured to enclose the modular electronic device;
wherein the door is configured to rotate between a closed position and an open position, wherein in the closed position the door covers the chassis enclosure to prevent the modular electronic device from being removed from the chassis, and wherein in the open position the door allows removal of the modular electronic device from the chassis;
a sliding element in slidable engagement with the door, the sliding element configured to move along the door;
wherein the apparatus includes a locking member configured to secure an engaged position with the chassis;
at least one guide rail disposed in the chassis enclosure to guide the modular electronic device, the at least one guide rail extending from about an opening of the chassis enclosure to a rear of the chassis enclosure;
an ejection actuator disposed in a rear of the chassis enclosure, the ejection actuator including a spring member, wherein the spring member has a first spring member end and a second spring member end, the first spring member end being connected to the ejection actuator and the second spring member end being connected to the rear of the chassis;
wherein the spring member is configured to restore the ejection actuator to an initial position in the chassis enclosure;
wherein the ejection actuator includes an angle bracket;
wherein the ejection actuator is configured to move along the at least one guide rail and remove the modular electronic device from the chassis; and
a flexible linkage element having a first linkage element end and a second linkage element end, the flexible linkage element being connected, by the first linkage element end, to the sliding element and connected, by the second linkage element end, to the ejection actuator, wherein the flexible linkage element passes around the axis of pivotal coupling of the door to the chassis.