Image sensor module and camera module using same
An image sensor module includes a ceramic substrate, an image sensor, a conductive film, and a bottom plate. The ceramic substrate includes an upper surface, a lower surface opposite to the upper surface, a side surface connected between the upper surface and the lower surface. The ceramic substrate has a through hole through the upper and lower surfaces, a receiving recess on the lower surface, and an air hole on the side surface. The through hole communicates with the receiving recess, and the air hole communicates with the receiving recess. The image sensor is received in the receiving recess and is electrically connected to the ceramic substrate. The bottom plate is positioned on the lower surface and electrically connected to the ceramic substrate by the conductive film.
1. An image sensor module, comprising:
a ceramic substrate comprising an upper surface, a lower surface opposite to the upper surface, a side surface connected between the upper surface and the lower surface; the ceramic substrate defining a through hole through the upper and lower surfaces, a receiving recess on the lower surface, and an air hole on the side surface; the through hole communicating with the receiving recess, the air hole communicating with the receiving recess;
an image sensor received in the receiving recess and electrically connected to the ceramic substrate;
a conductive film; and
a bottom plate positioned on the lower surface of the ceramic substrate and electrically connected to the ceramic substrate by the conductive film, the bottom plate comprising a flexible printed circuit board (FPCB), an adhesive layer, and a stiffening plate, and the adhesive layer adhered between the FPCB and the stiffening plate.
2. The image sensor module of claim 1 , wherein the receiving recess comprises a connecting surface parallel with the upper surface, a plurality of first pads positioned on the connecting surface, and a plurality of second pads positioned on the lower surface; the first pads are correspondingly connected to the second pads.
3. The image sensor module of claim 2 , wherein the image sensor comprises an image surface and a plurality of pins adjacent to the image surface, the pins are electrically connected to the first pads.
4. The image sensor module of claim 1 , wherein the air hole passes all the way through the lower surface.
5. A camera module, comprising:
an image sensor module, comprising:
a ceramic substrate comprising an upper surface, a lower surface opposite to the upper surface, a side surface connected between the upper surface and the lower surface; the ceramic substrate defining a through hole through the upper and lower surfaces, a receiving recess on the lower surface, and an air hole on the side surface; the through hole communicating with the receiving recess, the air hole communicating with the receiving recess;
an image sensor received in the receiving recess and electrically connected to the ceramic substrate;
a conductive film; and
a bottom plate positioned on the lower surface of the ceramic substrate and electrically connected to the ceramic substrate by the conductive film, the bottom plate comprising a flexible printed circuit board (FPCB), an adhesive layer, and a stiffening plate, and the adhesive layer adhered between the FPCB and the stiffening plate; and
a lens module, comprising:
a lens holder positioned on the upper surface of the ceramic substrate; and
a lens unit received in the lens holder.
6. The camera module of claim 5 , wherein the receiving recess comprises a connecting surface parallel with the upper surface, a plurality of first pads positioned on the connecting surface, and a plurality of second pads positioned on the lower surface; the first pads are correspondingly connected to the second pads.
7. The camera module of claim 6 , wherein the image sensor comprises an image surface and a plurality of pins adjacent to the image surface, the pins are electrically connected to the first pads.
8. The camera module of claim 5 , wherein the air hole passes all the way through the lower surface.