Thin film deposition method
The subject of the invention is a process for obtaining a substrate coated on at least part of its surface with at least one film of oxide of a metal M the physical thickness of which is 30 nm or less, said oxide film not being part of a multilayer comprising at least one silver film, said process comprising the following steps: at least one intermediate film of a material chosen from the metal M, a nitride of the metal M, a carbide of the metal M and an oxygen-substoichiometric oxide of the metal M is deposited by sputtering, said intermediate film not being deposited above or beneath a titanium-oxide-based film, the physical thickness of said intermediate film being 30 nm or less; and at least part of the surface of said intermediate film is oxidized using a heat treatment, during which said intermediate film is in direct contact with an oxidizing atmosphere, especially air, the temperature of said substrate during said heat treatment not exceeding 150° C.
1. A process for producing a coated substrate, the process comprising:
(I) depositing, by sputtering, at least one material selected from the group consisting of a metal M, a nitride of the metal M, a carbide of the metal M, and an oxygen-substoichiometric oxide of the metal M on at least part of a surface of a substrate, to obtain an intermediate film having a physical thickness of 30 nm or less on the substrate surface, wherein the intermediate film is not deposited above or beneath a titanium-oxide-based film; and
(II) heat treating the intermediate film while directly contacting at least part of a surface of the intermediate film with an oxidizing atmosphere, to obtain oxide film comprising the metal M and having a physical thickness of 30 nm or less on the substrate surface,
wherein a temperature of the substrate during the heat treatment does not exceed 150° C.,
wherein the oxide film is not part of a multilayer comprising a silver film, and
wherein the heat treating is carried out with laser radiation and a power per unit area of the laser radiation at the intermediate film is greater than or equal to 20 kW/cm 2 .
2. The process of claim 1 , wherein the substrate is a sheet comprising glass.
3. The process of claim 1 , wherein the metal M is selected from the group consisting of titanium, tin, zirconium, zinc, tungsten, tantalum, niobium, molybdenum, chromium, nickel, silicon, and aluminum.
4. The process of claim 3 , wherein the intermediate film comprises metallic titanium, and the oxide film is a photocatalytic titanium oxide film.
5. The process of claim 1 , wherein a physical thickness of the oxide film is 20 nm or less.
6. The process of claim 1 , wherein a temperature of the substrate during the heat treatment does not exceed 100° C.
7. The process of claim 1 , wherein the heat treatment is carried out with laser radiation having a wavelength between 500 and 2000 nm.
8. The process of claim 1 , wherein the power per unit area of the laser radiation at the intermediate film is greater than or equal to 30 kW/cm 2 .
9. A process for producing a coated substrate, the process comprising:
(I) depositing, by sputtering, at least one material selected from the group consisting of a metal M, a nitride of the metal M, a carbide of the metal M, and an oxygen-substoichiometric oxide of the metal M on at least part of a surface of a substrate, to obtain an intermediate film having a physical thickness of 30 nm or less on the substrate surface, wherein the intermediate film is not deposited above or beneath a titanium-oxide-based film; and
(II) heat treating the intermediate film while directly contacting at least part of a surface of the intermediate film with an oxidizing atmosphere, to obtain oxide film comprising the metal M and having a physical thickness of 30 nm or less on the substrate surface,
wherein a temperature of the substrate during the heat treatment does not exceed 150° C.,
wherein the oxide film is not part of a multilayer comprising a silver film, and
wherein the heat treating is carried out with laser radiation from a laser beam, which forms a line that simultaneously irradiates all or part of a width of the substrate.
10. The process of claim 9 , wherein the coated substrate and the line formed from the laser beam are moved relative to one another, so that a difference between the respective speeds of the substrate and the laser beam is 4 meters per minute or higher.
11. The process of claim 4 , further comprising, before (II):
depositing a low-E multilayer comprising a silver film on a first side of the substrate,
wherein the intermediate film comprising metallic titanium is on a second side of the substrate, and
wherein the intermediate film is heat treated with laser radiation, to reduce an emissivity or resistivity of the low-E multilayer by at least 3%.
12. A process for producing a coated substrate, the process comprising:
(I) depositing, by sputtering, at least one material selected from the group consisting of a metal M, a nitride of the metal M, a carbide of the metal M, and an oxygen-substoichiometric oxide of the metal M on at least part of a surface of a substrate, to obtain an intermediate film having a physical thickness of 30 nm or less on the substrate surface, wherein the intermediate film is not deposited above or beneath a titanium-oxide-based film; and
(II) heat treating the intermediate film while directly contacting at least part of a surface of the intermediate film with an oxidizing atmosphere, to obtain oxide film comprising the metal M and having a physical thickness of 30 nm or less on the substrate surface,
wherein a temperature of the substrate during the heat treatment does not exceed 150° C.,
wherein the oxide film is not part of a multilayer comprising a silver film, and
wherein only part of the surface of the intermediate film is heat treated, to obtain a pattern.
13. The process of claim 1 , wherein the oxidizing atmosphere is air.
14. The process of claim 1 , wherein a physical thickness of the oxide film is 15 nm or less.
15. The process of claim 1 , wherein a temperature of the substrate during the heat treatment does not exceed 50° C.
16. The process of claim 9 , wherein the laser radiation has a wavelength between 500 and 2000 nm.
17. The process of claim 10 , wherein a difference between the respective speeds of the substrate and the laser beam is 6 meters per minute or higher.
18. The process of claim 9 , wherein the substrate is a sheet comprising glass.
19. The process of claim 9 , wherein the metal M is selected from the group consisting of titanium, tin, zirconium, zinc, tungsten, tantalum, niobium, molybdenum, chromium, nickel, silicon, and aluminum.
20. The process of claim 19 , wherein the intermediate film comprises metallic titanium, and the oxide film is a photocatalytic titanium oxide film.