Manufacturing method of solder transfer substrate, solder precoating method, and solder transfer substrate
An adhesive layer forming step of forming an adhesive layer on a surface of a substrate; a solder layer forming step of forming a solder layer on the adhesive layer by loading plural solder powders with in-between spaces; and a filler supplying step of supplying fillers to the in-between spaces of the solder powders that have been formed on the adhesive layer are included.
1. A method, which uses a solder transfer substrate manufactured by a manufacturing method that comprises:
an adhesive layer forming step of forming an adhesive layer on a surface of a substrate;
a solder layer forming step of dividing the adhesive layer into a first region and a second region and forming a solder layer on the adhesive layer by loading plural solder powders with in-between spaces, so that the solder powders are denser on the first region compared with the second region; and
a filler supplying step of supplying fillers to the in-between spaces of the solder powders,
and a solder precoating method comprising:
a solder joining step of superposing the solder transfer substrate and a work that has a layer with an electrode formed thereon so that a face on which the solder layer is formed faces a face on which the electrode is formed, and carrying out heating and pressurization, thereby allowing the solder powders on the first region to be diffused and joined to the electrode; and
a transfer substrate peeling-off step of peeling off, after cooling, the solder transfer substrate from the work with the fillers being allowed to become initial points of the peeling-off, wherein
a melting point of the fillers is higher than a melting point of the solder powders.
2. A method, which uses a solder transfer substrate manufactured by a manufacturing method that comprises:
an adhesive layer forming step of forming an adhesive layer on a surface of a substrate;
a solder layer forming step of dividing the adhesive layer into a first region and a second region and forming a solder layer on the adhesive layer by loading plural solder powders with in-between spaces, so that the solder powders are denser on the first region compared with the second region;
a flux supplying step of supplying a flux so that the solder powders are covered with the flux; and
a filler supplying step of supplying fillers to the in-between spaces of the solder powders,
and a solder precoating method comprising:
a solder joining step of superposing the solder transfer substrate and a work that has a layer with an electrode formed thereon so that a face on which the solder layer is formed faces a face on which the electrode is formed, and carrying out heating and pressurization, thereby allowing the solder powders on the first region to be diffused and joined to the electrode; and
a transfer substrate peeling-off step of peeling off, after cooling, the solder transfer substrate from the work with the fillers being allowed to become initial points of the peeling-off, wherein
a melting point of the fillers is higher than a melting point of the solder powders.