Light emitting diode and manufacturing method thereof

1. A manufacturing method for a light emitting diode (LED), comprising following steps:

providing an LED wafer, wherein an electrically conductive layer is disposed on the LED wafer, and the LED wafer comprises a substrate and an epitaxial layer on the substrate, the electrically conductive layer being located on the epitaxial layer;

providing a photoresist layer on the electrically conductive layer;

roughening a lateral surface of the electrically conductive layer by wet etching;

forming a depression in the LED wafer by dry etching and roughening a sidewall of the LED wafer defining the depression, the depression being recessed in the epitaxial layer without reaching the substrate; and

disposing two pads respectively in the depression and on the electrically conducting layer to electrically connect with different layers of the epitaxial layer;

wherein the roughened sidewall of the LED wafer by the dry etching process is flush with the roughened lateral surface of the electrically conductive layer by the wet etching process.

2. The manufacturing method for the LED as claimed in claim 1 , wherein the epitaxial layer of the LED wafer comprises an N-type gallium nitride (GaN) layer on the substrate, a light emitting layer on the N-type GaN layer and a P-type GaN layer on the light emitting layer, the electrically conductive being on the P-type GaN layer.

3. The manufacturing method for the LED as claimed in claim 2 , wherein the electrically conductive layer is disposed on the P-type GaN layer.

4. The manufacturing method for the LED as claimed in claim 3 , wherein the electrically conductive layer is made of indium tin oxide (ITO) by vapor deposition.

5. The manufacturing method for the LED as claimed in claim 1 , in the step of providing the photoresist layer on the electrically conductive layer, wherein a portion of a top surface of the electrically conductive layer is exposed from the photoresist layer.

6. The manufacturing method for the LED as claimed in claim 1 , in the step of roughening the lateral surface of the electrically conductive layer by wet etching, wherein the lateral surface of the electrically conductive layer is flush with a lateral surface of the photoresist layer.

7. The manufacturing method for the LED as claimed in claim 6 , wherein the wet etching process makes use of potassium hydroxide (K.OH), hydrochloric acid (H.Cl) or phosphoric acid (H3{PO}4).

8. The manufacturing method for the LED as claimed in claim 1 , wherein the step of roughening the sidewall of the LED wafer defining the depression sequentially follows the step of roughening the lateral surface of the electrically conductive layer by wet etching.

9. The manufacturing method for the LED as claimed in claim 8 , wherein a degree of roughness of the lateral surface of the electrically conductive layer is equal to a degree of roughness of the sidewall of the depression.

10. The manufacturing method for the LED as claimed in claim 1 , wherein the dry etching process makes use of inductively coupled plasma (ICP), reactive ion etching (RIE) or high density plasma (HDP).

11. The manufacturing method for the LED as claimed in claim 1 , wherein the photoresist layer is removed from the electrically conductive layer before the step of disposing the two pads respectively in the depression and on the electrically conducting layer.

12. The manufacturing method for the LED as claimed in claim 1 , wherein the two pads comprises an N-type electrode disposed in the depression and a P-type electrode disposed on the electrically conducting layer.

13. The manufacturing method for the LED as claimed in claim 12 , wherein the two pads are alloy of gold (Au) and chromium (Cr).

14. The manufacturing method for the LED as claimed in claim 1 , wherein a degree of roughness of the roughened sidewall of the LED wafer defining the depression is measurable in micrometers (μm).