Electronic component implementing structure intermediate body, electronic component implementing structure body and manufacturing method of electronic component implementing structure body
View Patent ↗An implementing structure intermediate body including: a first chip having a first connection terminal; a second chip having a second connection terminal in a face that faces the first chip; and a film wiring substrate having a third connection terminal in one face, which is arranged between the first chip and the second chip, is loaded on a chip loading substrate having a fifth connection terminal so that another one face of the first chip is confronted thereby. In the film wiring substrate, there is a portion that is located outside any of the first chip and the second chip, at the tip part, is provided a fourth connection terminal connected to the third connection terminal by wiring, one part of the first connection terminal is connected with the second connection terminal, the third connection terminal is connected with another one part of the first connection terminal, and the fifth connection terminal is connected to the fourth connection terminal.
1. An electronic component implementing structure body, comprising:
an electronic component implementing structure intermediate body; and a chip loading substrate, wherein the electronic component implementing structure intermediate body comprises:
a first semiconductor chip that has a first connection terminal on one face;
a second semiconductor chip that has a second connection terminal on a face which faces the one face of the first semiconductor chip; and
a film wiring substrate that is allowed to be divided into 4 pieces, has flexibility, has a third connection terminal at least on one face, and is arranged between the first semiconductor chip and the second semiconductor chip,
at least one part of the first connection terminal is connected with at least one part of the second connection terminal,
the third connection terminal is connected at least with either of another one part of the first connection terminal and another one part of the second connection terminal,
on the film wiring substrate, there is a portion that is located outside any end parts of the first semiconductor chip and the second semiconductor chip,
at a tip part of the portion, is provided a fourth connection terminal that is connected to the third connection terminal by wiring,
the chip loading substrate has a fifth connection terminal, on which the electronic component implementing structure intermediate body is loaded so that another one face of the first semiconductor chip is confronted by the chip loading substrate,
the fifth connection terminal is connected to the fourth connection terminal of the film wiring substrate, and
the film wiring substrate is curved between the third connection terminal and the fifth connection terminal.
2. An electronic component implementing structure body according to claim 1 , wherein
on the film wiring substrate, is provided a hole part, and
the at least one part of the first connection terminal, and the at least one part of the second connection terminal are connected via the hole part.
3. An electronic component implementing structure body according to claim 1 , wherein
on at least one spot of an outer fringe part of the film wiring substrate, there is a notch.
4. An electronic component implementing structure body according to claim 1 , wherein
the first semiconductor chip and the second semiconductor chip are arranged so as to be opposing, and a difference in length between each correspondingly opposing side of the first semiconductor chip and the second semiconductor chip is within ±5%.
5. A manufacturing method of an electronic component implementing structure body, comprising:
a semiconductor chip loading step of loading, onto a chip loading substrate, a first semiconductor chip with a first connection terminal formed on one face so that a face on which the first connection terminal is not formed is confronted by the chip loading substrate;
a first terminal connecting step of electrically connecting one part of the first connection terminal of the first semiconductor chip, and a third connection terminal formed on one face of a film wiring substrate that is allowed to be divided into 4 pieces;
a second terminal connecting step of, from a side where connection of the film wiring substrate of the first semiconductor chip has been carried out, overlaying and laminating a second semiconductor chip with a second connection terminal formed on one face, and then electrically connecting a first connection terminal that is not connected to the third connection terminal, and the second connection terminal; and
a third terminal connecting step of electrically connecting, to a fifth connection terminal that is formed on the chip loading substrate, a fourth connection terminal that is connected to the third connection terminal and is formed at a tip portion of a portion of the film wiring substrate, the portion being located outside any end parts of the first semiconductor chip and the second semiconductor chip, wherein
the film wiring substrate is curved between the third connection terminal and the fifth connection terminal.
6. A manufacturing method of an electronic component implementing structure body according to claim 5 , wherein
processing of the first terminal connecting step, the second terminal connecting step, the semiconductor chip loading step, and the third terminal connecting step are carried out in that order.
7. A manufacturing method of an electronic component implementing structure body according to claim 5 , wherein
processing of the first terminal connecting step, the semiconductor chip loading step, the third terminal connecting step, and the second terminal connecting step are carried out in that order.
8. A manufacturing method of an electronic component implementing structure body according to claim 5 , wherein
processing of the semiconductor chip loading step, the first terminal connecting step, the second terminal connecting step, and the third terminal connecting step are carried out in that order.