IP Library Granted Patent US 9,062,191
Granted Patent B2
US 9,062,191 · App. 13/459,617 · Granted Jun 23, 2015

Polyphenylene ether-based resin composition and molded product using the same

Inventors: Jin-Young Huh (Uiwang-si, KR); Doo-Han Ha (Uiwang-si, KR)
Assignee: Cheil Industries Inc.
C08L23/0869C08L71/123C08J5/005C08L77/00B82Y30/00C08L23/08C08K3/04C08K7/24C08L51/06C08L53/02C08J2371/12C08J2377/00C08J2423/08C08J2471/12
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Quick Facts
Patent No.
US 9,062,191
App. No.
13/459,617
Granted
Jun 23, 2015
Kind
B2
Abstract

Disclosed is a polyphenylene ether-based resin composition that includes (A) a base resin including (A-1) polyphenylene ether-based resin and (A-2) polyamide resin, (B) carbon nanotubes, (C) a styrene-based copolymer, and (D) an olefin-based copolymer.

Claims (19)

1. A polyphenylene-ether-based resin composition, consisting essentially of:

(A) a base resin including (A-1) about 5 to about 95 wt % of a polyphenylene ether-based resin and (A-2) about 5 to about 95 wt % of a polyamide resin;

(B) about 0.01 to about 5 parts by weight of carbon nanotube, based on about 100 parts by weight of the base resin;

(C) about 1 to about 20 parts by weight of a styrene-based copolymer, based on about 100 parts by weight of the base resin;

(D) about 1 to about 20 parts by weight of an olefin-based copolymer, based on about 100 parts by weight of the base resin; and

(E) optionally a reactive monomer.

2. The polyphenylene-ether-based resin composition of claim 1 , wherein the polyphenylene ether-based resin (A-1) is a polyphenylene ether resin, or a mixture of a polyphenylene ether and a vinyl aromatic polymer.

3. The polyphenylene-ether-based resin composition of claim 2 , wherein the polyphenylene ether resin is poly(2,6-dimethyl-1,4-phenylene)ether, poly(2,6-diethyl-1,4-phenylene)ether, poly(2,6-dipropyl-1,4-phenylene)ether, poly(2-methyl-6-ethyl-1,4-phenylene)ether, poly(2-methyl-6-propyl-1,4-phenylene)ether, poly(2-ethyl-6-propyl-1,4-phenylene)ether, poly(2,6-diphenyl-1,4-phenylene)ether, a copolymer of poly(2,6-dimethyl-1,4-phenylene)ether and poly (2,3,6-trimethyl-1,4-phenylene)ether, a copolymer of poly (2,6-dimethyl-1,4-phenylene)ether and poly(2,3,6-triethyl-1,4-phenylene)ether, or a combination thereof.

4. The polyphenylene-ether-based resin composition of claim 1 , wherein the polyamide resin (A-2) is polycaprolactam (polyamide 6), poly(11-aminoundecanoic acid) (polyamide 11), polylauryllactam (polyamide 12), polyhexamethylene adipamide (polyamide 66), polyhexamethylene azelamide (polyamide 69), polyhexamethylene sebacamide (polyamide 610), polyhexamethylene dodecanodiamide (polyamide 612), a copolymer thereof, or a combination thereof.

5. The polyphenylene-ether-based resin composition of claim 1 , wherein the carbon nanotubes (B) have a diameter of about 0.5 to about 100 nm, and a length of about 0.01 to about 100 μm.

6. The polyphenylene-ether-based resin composition of claim 1 , wherein the styrene-based copolymer (C) is an AB-type diblock copolymer, a ABA-type triblock copolymer, a radical block copolymer, or a combination thereof.

7. The polyphenylene-ether-based resin composition of claim 1 , wherein the styrene-based copolymer (C) is a copolymer of a vinyl aromatic monomer, and a diene comprising a hydrogenated unsaturated diene, a partially hydrogenated unsaturated diene, an unsaturated diene without hydrogenation, or a combination thereof.

8. The polyphenylene-ether-based resin composition of claim 1 , wherein the olefin-based copolymer (D) is a copolymer polymerized with different olefin-based monomers, or a copolymer of an olefin-based monomer and an acrylic-based monomer.

9. The polyphenylene-ether-based resin composition of claim 1 , wherein the olefin-based copolymer (D) comprises a reactive group capable of reacting with the polyamide resin.

10. The polyphenylene-ether-based resin composition of claim 9 , wherein the reactive group comprises a maleic anhydride group, an epoxy group, or a combination thereof.

11. The polyphenylene-ether-based resin composition of claim 1 , wherein the reactive monomer (E) is present in an amount of about 0.5 to about 2 parts by weight based on about 100 parts by weight of the base resin.

12. The polyphenylene-ether-based resin composition of claim 11 , wherein the reactive monomer (E) comprises an unsaturated carboxylic acid or an anhydride group thereof.

13. The polyphenylene-ether-based resin composition of claim 11 , wherein the reactive monomer (E) is citric acid anhydride, maleic anhydride, maleic acid, itaconic anhydride, fumaric acid, (meth)acrylic acid, (meth)acrylic acid ester, or a combination thereof.

14. A molded product made using the polyphenylene-ether-based resin composition of claim 1 .

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2017
From: SAMSUNG SDI CO., LTD.
To: LOTTE ADVANCED MATERIALS CO., LTD.
Reel/Frame 042114/0895 →
MERGER Recorded Jul 14, 2016
From: CHEIL INDUSTRIES INC.
To: SAMSUNG SDI CO., LTD.
Reel/Frame 039360/0858 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 30, 2012
From: HUH, JIN-YOUNG; HA, DOO-HAN
To: CHEIL INDUSTRIES INC.
Reel/Frame 028127/0419 →
Priority Claims (1)
KR 10-2009-0105149 · Nov 2, 2009 · national
Continuity (2)
Continuation In Part PCTKR2009007915 · Dec 29, 2009
Related Publication 20120214932A1 · Aug 23, 2012