IP Library › Granted Patent US 9,066,444
Granted Patent B2
US 9,066,444 · App. 13/665,273 · Granted Jun 23, 2015

Power supply unit with articulating fan assembly

Inventors: Jason D. Adrian (Cedar Park, TX); Kevin W. Mundt (Austin, TX)
Assignee: Dell Products, LP
H05K7/20172H05K7/20736H05K7/20909
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Quick Facts
Patent No.
US 9,066,444
App. No.
13/665,273
Filed
Oct 31, 2012
Granted
Jun 23, 2015
Kind
B2
Art Unit
2835
USPC
361/679.48
Abstract

A fan assembly is flexibly attached to an electronic device enclosure. The fan assembly is configured to pivot with respect to the electronic device enclosure from a horizontal position to an angled position during insertion of the enclosure into the chassis. The horizontal position is to facilitate insertion of the electronic device enclosure into a chassis. The angled position is maintained when the electronic device enclosure is fully inserted into the chassis.

Claims (33)

1. A system comprising:

a chassis;

an electronic device enclosure to mount within the chassis; and

a fan assembly flexibly attached to the electronic device enclosure, the fan assembly to pivot with respect to the electronic device enclosure from a first position to a second position in response to inserting the electronic device enclosure into the chassis, the first position to facilitate insertion of the electronic device enclosure into the chassis, the second position maintained when the electronic device enclosure is fully inserted into the chassis;

wherein the fan assembly includes a guide feature that engages with a corresponding feature of the chassis, the guide feature to translate the fan assembly from the first position to the second position during insertion of the electronic device enclosure into the chassis; and

wherein a rotational plane of a fan blade of the fan assembly is parallel to a depth dimension of the electronic device enclosure in the first position and is not parallel to the depth dimension of the electronic device enclosure in the second position.

2. The system of claim 1 , wherein the fan assembly includes a latch to maintain the fan assembly at the first position prior to insertion of the electronic device enclosure into the chassis, and wherein insertion of the electronic device enclosure into the chassis releases the latch so that the fan can pivot to the second position.

3. The system of claim 1 , wherein the electronic device enclosure is perforated to allow air to flow through the enclosure.

4. The system of claim 1 , wherein the second position comprises an angle of between 10 degrees and 90 degrees with respect to the first position.

5. The system of claim 1 , wherein the chassis includes a gasket affixed to the chassis to make contact with the fan assembly when the electronic device enclosure is fully inserted within the chassis.

6. The system of claim 1 , further comprising a data processing device to mount within the chassis vertically adjacent to the electronic device enclosure, wherein the fan assembly is to provide air circulation to the electronic device enclosure and to the data processing device.

7. The system of claim 6 , wherein the data processing device includes an attached gasket to make contact with an adjacent portion of the fan assembly when the electronic device enclosure is fully inserted within the chassis.

8. The system of claim 1 , further comprising:

a data storage device to mount within the chassis horizontally adjacent to the electronic device enclosure; and

wherein the chassis is to receive for installation the electronic device enclosure and fan assembly from a first side of the chassis and to receive the data storage device for installation from a second side of the chassis, the second side opposite the first side, and wherein the fan assembly is located between the electronic device enclosure and the data storage device when the electronic device enclosure is fully inserted into the chassis.

9. The system of claim 1 , wherein the fan assembly is flexibly attached to the electronic device enclosure using a hinge, and wherein the hinge includes material to dampen the propagation of vibration from the fan assembly to the electronic device enclosure.

10. A device comprising:

an electronic device enclosure to mount within a chassis; and

a fan assembly flexibly attached to the electronic device enclosure and to progressively pivot with respect to the electronic device enclosure from a first position to a second position in response to incremental insertion of the electronic device enclosure into the chassis, the first position to facilitate insertion of the electronic device enclosure into a chassis, the second position maintained when the electronic device enclosure is fully inserted into the chassis;

wherein the fan. assembly includes a guide feature that engages with a corresponding feature of the chassis, the guide feature to translate the fan assembly from the first position to the second position during insertion of the electronic device enclosure into the chassis; and

wherein a rotational plane of a fan blade of the fan assembly is parallel to a depth dimension of the electronic device enclosure in the first position and is not parallel to the depth dimension of the electronic device enclosure in the second position.

11. The device of claim 10 , wherein the fan assembly includes a latch to maintain the fan assembly at the first position prior to insertion of the electronic device enclosure into the chassis, and wherein insertion of the electronic device enclosure into a cavity of the chassis releases the latch so that the fan can pivot to the second position.

12. The device of claim 10 , wherein the second position comprises an angle of between 10 degrees and 90 degrees with respect to the first position.

13. A method comprising:

providing a power supply, the power supply to mount within a chassis, the power supply having a fan assembly flexibly attached to the power supply, the fan assembly to pivot with respect to the power supply from a first position to a second position in response to inserting the electronic device enclosure into the chassis, the first position to facilitate insertion of the power supply into the chassis, the second position maintained when the power supply is fully inserted into the chassis, wherein a rotational plane of a fan blade of the fan assembly is parallel to a depth dimension of the power supply in the first position and is not parallel to the depth dimension of the power supply in the second position,

wherein the fan assembly includes a guide feature that engages with a corresponding feature of the chassis, the guide feature to translate the fan assembly from the first position to the second position during insertion of the power supply into the chassis.

14. The method of claim 13 , wherein the fan assembly includes a latch to maintain the fan assembly at the first position prior to insertion of the power supply into the chassis, and wherein insertion of the power supply into a cavity of the chassis releases the latch so that the fan can pivot to the second position.

15. The method of claim 13 , wherein the power supply includes an enclosure, the enclosure perforated to allow air to flow through the enclosure.

16. The method of claim 13 , wherein the second position comprises an angle of between 10 degrees and 90 degrees with respect to the first position.

17. The method of claim 13 , wherein the fan assembly is to make contact with a gasket when the power supply is fully inserted into the chassis, the gasket to reduce conduction of vibration from the fan assembly to the chassis.

18. The device of claim 10 , wherein the chassis includes a gasket affixed to the chassis to make contact with the fan assembly when the electronic device enclosure is fully inserted within the chassis.

19. The method of claim 13 , wherein the chassis includes a gasket affixed to the chassis to make contact with the fan assembly when the electronic device enclosure is fully inserted within the chassis.

20. The method of claim 13 , wherein the fan assembly is flexibly attached to the electronic device enclosure using a hinge, and wherein the hinge includes material to dampen the propagation of vibration from the fan assembly to the electronic device enclosure.

Assignments (15)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045455/0001) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061753/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040136/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061324/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL, L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058216/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 040136/0001 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040134/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 14, 2016
From: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040065/0618 →
RELEASE OF SECURITY INTEREST Recorded Sep 14, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040040/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 13, 2016
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLANT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040065/0216 →
PATENT SECURITY AGREEMENT (ABL) Recorded Jan 2, 2014
From: DELL INC.; APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 031898/0001 →
PATENT SECURITY AGREEMENT (TERM LOAN) Recorded Jan 2, 2014
From: DELL INC.; APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031899/0261 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Jan 2, 2014
From: APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS FIRST LIEN COLLATERAL AGENT
Reel/Frame 031897/0348 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 5, 2012
From: ADRIAN, JASON D.; MUNDT, KEVIN W.
To: DELL PRODUCTS, LP
Reel/Frame 029240/0366 →
Continuity (1)
Related Publication 20140118937A1 · May 1, 2014