Ceramic circuit board and process for producing same
According to one embodiment, a ceramic circuit board includes a ceramic substrate, a copper circuit plate and a brazing material protrudent part. The copper circuit plate is bonded to at least one surface of the ceramic substrate through a brazing material layer including Ag, Cu, and Ti. The brazing material protrudent part includes a Ti phase and a TiN phase by 3% by mass or more in total, which is different from the total amount of a Ti phase and a TiN phase in the brazing material layer that is interposed between the ceramic substrate and the copper circuit plate. The number of voids each having an area of 200 μm 2 or less in the brazing material protrudent part is one or less (including zero).
1. A method for the production of a ceramic circuit board, comprising:
providing a first masking on a part other than an area to be a copper circuit pattern and a brazing material protrudent part on a ceramic substrate;
forming a brazing material layer comprising Ag, Cu and Ti on an area other than the first masking on the ceramic substrate;
mounting a copper plate on the brazing material layer and bonding the ceramic substrate and the copper plate by heating;
providing a second masking on an area to be a copper circuit pattern on the copper plate; and
forming a copper circuit pattern by etching.
2. The method for the production of a ceramic circuit board according to claim 1 ,
wherein an etchant of ferric chloride or cupric chloride is used in the etching.
3. The method for the production of a ceramic circuit board according to claim 1 ,
wherein markings for position alignment are provided to the ceramic substrate and the copper plate.
4. The method for the production of a ceramic circuit board according to claim 1 ,
wherein a material for the first masking and second masking is a printable organic ink resist.