IP Library Granted Patent US 9,101,075
Granted Patent B2
US 9,101,075 · App. 14/101,026 · Granted Aug 4, 2015

Substrate with built-in component

Inventors: Masaki Naganuma (Tokyo, JP); Kazuaki Ida (Gunma, JP); Tatsuro Sawatari (Tokyo, JP); Hiroshi Nakamura (Tokyo, JP)
Assignee: Taiyo Yuden Co., Ltd
H05K1/186H05K1/185
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Quick Facts
Patent No.
US 9,101,075
App. No.
14/101,026
Granted
Aug 4, 2015
Kind
B2
Abstract

There is provided a substrate with built-in component, including a metal core layer having a cavity for storing a component; a wiring layer that is laminated on the core layer and has a plurality of vias for an interlayer connection, the vias being formed at regions opposing to the cavity; and an electronic component including a plurality of terminals electrically connected to the plurality of vias, and a component body that is stored in the cavity and has a support surface for supporting the plurality of terminals, the plurality of terminals being disposed eccentrically from a center of the support surface to a first direction, and the component body being disposed eccentrically from a center of the cavity to a second direction opposite to the first direction.

Claims (7)

1. A substrate with built-in component, comprising:

a metal core layer having a cavity for storing a component, the cavity being formed by a single aperture;

a wiring layer that is laminated on the core layer and has a plurality of vias for an interlayer connection, the vias being formed at regions opposing to the cavity; and

an electronic component including a plurality of terminals electrically connected to the plurality of vias, and a component body that is stored in the cavity and has a support surface for supporting the plurality of terminals, the plurality of terminals being disposed eccentrically from a center of the support surface to a first direction, and the component body being disposed eccentrically from a center of the cavity to a second direction opposite to the first direction;

wherein the cavity has a first aperture portion having an approximate rectangular shape, the support surface has an approximate rectangular planar shape, the plurality of terminals are disposed along a peripheral of the support surface; and

the cavity has a plurality of second aperture portions formed at four corners of the first aperture portion and protruded outward from the four corners.

2. The substrate with built-in component according to claim 1 , wherein the component body is composed of a ceramic material.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2013
From: NAGANUMA, MASAKI; IDA, KAZUAKI; SAWATARI, TATSURO; NAKAMURA, HIROSHI
To: TAIYO YUDEN CO., LTD.
Reel/Frame 031743/0507 →
Priority Claims (1)
JP 2013-189176 · Sep 12, 2013 · national
Continuity (1)
Related Publication 20150070862A1 · Mar 12, 2015