IP Library Granted Patent US 9,159,205
Granted Patent B1
US 9,159,205 · App. 14/198,386 · Granted Oct 13, 2015

Tamper-evident seals having adhesive-free areas to minimize rework time

Inventors: Shahriar A. Tafreshi (Fremont, CA); Yu-Min Lee (Saratoga, CA)
Assignee: Western Digital Technologies, Inc.
G08B5/00G11B33/123
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Quick Facts
Patent No.
US 9,159,205
App. No.
14/198,386
Granted
Oct 13, 2015
Kind
B1
Abstract

Various aspects of the present disclosure provide tamper-evident seals and methods for indicating tampering with an apparatus using the tamper-evident seals. One such tamper-evident seal includes a base layer and a pattern-release layer on a periphery area of the base layer. In such case, the pattern-release layer includes a first adhesive configured to leave a residue on the printed circuit board assembly, and the base layer has a central area that is surrounded by the periphery area and free of the first adhesive.

Claims (83)

1. A tamper-evident seal for indicating tampering with a printed circuit board assembly, the tamper-evident seal comprising:

a base layer;

a pattern-release layer on a periphery area of the base layer; and

a central area of the base layer having a perimeter defined by the periphery area,

wherein the pattern-release layer comprises a first adhesive configured to leave a residue on the printed circuit board assembly, and

wherein the central area is free of adhesive.

2. The tamper-evident seal of claim 1 , wherein the central area comprises at least one opening.

3. The tamper-evident seal of claim 2 , wherein the at least one opening comprises a gas vent.

4. The tamper-evident seal of claim 2 , wherein the at least one opening is configured to release gas trapped between the tamper-evident seal and a surface to which the tamper-evident seal is adhered.

5. The tamper-evident seal of claim 2 , wherein the periphery area comprises at least one opening.

6. The tamper-evident seal of claim 1 , wherein the pattern-release layer is configured to produce a tamper-evident pattern when the tamper-evident seal is removed from a surface to which the tamper-evident seal is adhered to by the first adhesive.

7. The tamper-evident seal of claim 6 , wherein the tamper-evident pattern comprises a predetermined pattern.

8. The tamper-evident seal of claim 6 , wherein the tamper-evident pattern comprises a checkered pattern or two or more rows of alternating blocks.

9. The tamper-evident seal of claim 1 , wherein the first adhesive is configured to leave a residue on the printed circuit board assembly throughout the periphery area of the base layer.

10. A printed circuit board assembly comprising:

a printed circuit board (PCB); and

a tamper-evident seal adhered to a surface of the PCB, comprising:

a base layer;

a pattern-release layer on a periphery area of the base layer; and

a central area of the base layer having a perimeter defined by the periphery area,

wherein the pattern-release layer comprises a first adhesive configured to leave a residue on the printed circuit board assembly, and

wherein the central area is free of adhesive.

11. The printed circuit board assembly of claim 10 , wherein the central area comprises at least one opening.

12. The printed circuit board assembly of claim 11 , wherein the at least one opening comprises a gas vent.

13. The printed circuit board assembly of claim 10 , wherein the PCB is a component of a hard disk drive and forms a portion of an outer cover of the hard disk drive.

14. The printed circuit board assembly of claim 13 , wherein the tamper-evident seal comprises a first portion adhered to the surface of the PCB, and a second portion folded around an edge of the hard disk drive and adhered to a surface of the hard disk drive that is substantially perpendicular to the surface of the PCB.

15. The printed circuit board assembly of claim 14 , wherein the second portion is configured to prevent tampering with components located inside of the hard disk drive.

16. The printed circuit board assembly of claim 14 , wherein the second portion is configured to prevent tampering with at least one connector located along the surface of the hard disk drive.

17. The printed circuit board assembly of claim 10 , wherein the first adhesive is configured to leave a residue on the printed circuit board assembly throughout the periphery area of the base layer.

18. A method of indicating tampering with a printed circuit board assembly comprising a printed circuit board (PCB), comprising:

covering a surface of the PCB with a tamper-evident seal,

wherein the tamper-evident seal comprises:

a base layer;

a pattern-release layer on a periphery area of the base layer; and

a central area of the base layer having a perimeter defined by the periphery area,

wherein the pattern-release layer comprises a first adhesive configured to leave a residue on the printed circuit board assembly,

wherein the central area is free of adhesive, and

wherein the pattern-release layer is configured to leave a tamper-evident pattern on the surface of the PCB when the seal is removed.

19. The method of claim 18 , further comprising releasing gas trapped between the seal and the surface of the PCB through at least one opening in the central area of the seal.

20. The method of claim 19 , wherein the at least one opening comprises a gas vent.

21. The method of claim 18 ,

wherein the PCB is a component of a hard disk drive and forms a portion of an outer cover of the hard disk drive, further comprising:

folding a portion of the seal around an edge of the hard disk drive to cover a surface of the hard disk drive so as to prevent tampering with components located inside of the hard disk drive.

22. The method of claim 18 , further comprising:

removing the tamper-evident seal; and

removing a residue corresponding to the tamper-evident pattern from a periphery area of the PCB.

23. The method of claim 18 , wherein the first adhesive is configured to leave a residue on the printed circuit board assembly throughout the periphery area of the base layer.

24. A tamper-evident seal for indicating tampering with a printed circuit board assembly, the tamper-evident seal comprising:

a base layer;

a pattern-release layer on a periphery area of the base layer; and

a central area of the base layer having a perimeter defined by the periphery area,

wherein the pattern-release layer comprises a first adhesive configured to leave a residue on the printed circuit board assembly, and

wherein the central area comprises a second adhesive configured to leave no residue on the printed circuit board assembly.

25. The tamper-evident seal of claim 24 , wherein the pattern-release layer is configured to produce a tamper-evident pattern when the tamper-evident seal is removed from a surface to which the tamper-evident seal is adhered to by the first adhesive.

26. The tamper-evident seal of claim 25 , wherein the tamper-evident pattern comprises a predetermined pattern.

27. The tamper-evident seal of claim 25 , wherein the tamper-evident pattern comprises a checkered pattern or two or more rows of alternating blocks.

28. A printed circuit board assembly comprising:

a printed circuit board (PCB); and

a tamper-evident seal adhered to a surface of the PCB, comprising:

a base layer;

a pattern-release layer on a periphery area of the base layer; and

a central area of the base layer having a perimeter defined by the periphery area,

wherein the pattern-release layer comprises a first adhesive configured to leave a residue on the printed circuit board assembly, and

wherein the central area comprises a second adhesive configured to leave no residue on the printed circuit board assembly.

29. The printed circuit board assembly of claim 28 , wherein the PCB is a component of a hard disk drive and forms a portion of an outer cover of the hard disk drive.

30. The printed circuit board assembly of claim 29 , wherein the tamper-evident seal comprises a first portion adhered to the surface of the PCB, and a second portion folded around an edge of the hard disk drive and adhered to a surface of the hard disk drive that is substantially perpendicular to the surface of the PCB.

31. The printed circuit board assembly of claim 30 , wherein the second portion is configured to prevent tampering with components located inside of the hard disk drive.

32. The printed circuit board assembly of claim 30 , wherein the second portion is configured to prevent tampering with at least one connector located along the surface of the hard disk drive.

33. A method of indicating tampering with a printed circuit board assembly comprising a printed circuit board (PCB), comprising:

covering a surface of the PCB with a tamper-evident seal,

wherein the tamper-evident seal comprises:

a base layer;

a pattern-release layer on a periphery area of the base layer; and

a central area of the base layer having a perimeter defined by the periphery area,

wherein the pattern-release layer comprises a first adhesive configured to leave a residue on the printed circuit board assembly,

wherein the central area comprises a second adhesive configured to leave no residue on the printed circuit board assembly, and

wherein the pattern-release layer is configured to leave a tamper-evident pattern on the surface of the PCB when the seal is removed.

34. The method of claim 33 ,

wherein the PCB is a component of a hard disk drive and forms a portion of an outer cover of the hard disk drive, further comprising:

folding a portion of the seal around an edge of the hard disk drive to cover a surface of the hard disk drive so as to prevent tampering with components located inside of the hard disk drive.

35. The method of claim 34 , further comprising:

removing the tamper-evident seal; and

removing a residue corresponding to the tamper-evident pattern from a periphery area of the PCB.

Assignments (8)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 038744 FRAME 0481 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058982/0556 →
RELEASE OF SECURITY INTEREST Recorded Mar 5, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 045501/0714 →
SECURITY AGREEMENT Recorded May 17, 2016
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038744/0481 →
SECURITY AGREEMENT Recorded May 17, 2016
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038744/0281 →
SECURITY AGREEMENT Recorded May 17, 2016
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038722/0229 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2014
From: TAFRESHI, SHAHRIAR A.; LEE, YU-MIN
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 033346/0909 →
Continuity (1)
Provisional Application 61917839 · Dec 18, 2013