Interconnection structure in electromagnetic shielding
A panel for an electromagnetic shield includes a light-weight, porous, electrically-conductive, fluid-permeable planar core layer defined between generally parallel first and second surfaces and a first face sheet laminated to the first surface of the core layer with rigidity properties superior to the rigidity properties of the core layer. The thickness of the first face sheet is substantially less than the thickness of the core layer. The core layer is made of metallic foam or a metal coating on an electrically-nonconductive, porous, nonmetallic substrate chosen from among nonwoven fibrous matting, paper, and open-cell nonmetallic foam. Also, the core layer may also may be made up of liberated branching metal nanostrands or a plurality of electrically-coupled, electrically-conductive particles, each taking the from of an electrically-nonconductive, nonmetallic substrate with a metal coating. The first face sheet includes a cured layer of resin and, distributed throughout the resin, electrically-conductive elements selected from among liberated branched metal nanostrands, metal wires, and metal meshes, in addition to fibers, woven fabric, nonwoven matting, or paper that are metal-coated.
1. An interconnection structure in an electromagnetic shield to exhibit broadband shielding capability including low frequencies, the interconnection structure comprising:
(a) a first electromagnetic shield panel bounded at a periphery thereof by a joint edge, the first panel comprising:
(i) a first core layer that is light-weight, porous, electrically-conductive, and planar, the first core layer comprising a nonmetallic, electrically-nonconductive substrate with a metallic coating having nickel as a component, the first core layer having generally parallel inner and outer surfaces on opposite sides thereof and being bounded at a periphery thereof by a joint edge coincident with the joint edge of the first panel; and
(ii) a first outer face sheet laminated to the outer surface of the first core layer, the first outer face sheet being electrically-conductive and having rigidity properties superior to the rigidity properties of the first core layer and being bounded at a periphery thereof by a joint edge coincident with the joint edge of the first panel;
(b) a second electromagnetic shield panel bounded at a periphery thereof by a joint edge, the second panel comprising:
(i) a second light-weight, porous, electrically-conductive planar core layer having generally parallel inner and outer surfaces on opposite sides thereof and being bounded at a periphery thereof by a joint edge coincident with the joint edge of the second panel; and
(ii) a second outer face sheet laminated to the outer surface of the second core layer, the second outer face sheet having rigidity properties superior to the rigidity properties of the second core layer and being bounded at a periphery thereof by a joint edge coincident with the joint edge of the second panel; and
(c) joinder means for securing the joint edge of the first panel to the joint edge of the second panel with electrically-conductive components of the first panel in electrical communication with electrically-conductive components of the second panel.
2. An interconnection structure as recited in claim 1 , wherein the joinder means comprises a butt joint between the joint edge of the first panel and the joint edge of the second panel.
3. An interconnection structure as recited in claim 1 , wherein the joinder means comprises a lap joint between overlapping portions of the first and second panels located adjacent, respectively, to the joint edges thereof.
4. An interconnection structure as recited in claim 1 , wherein the interconnection structure further comprises:
(a) a first outer electrically-conductive adhesive layer between the outer surface of the first core layer and the first outer face sheet; and
(b) a second outer electrically-conductive adhesive layer between the outer surface of the second core layer and the second outer face sheet.
5. An interconnection structure as recited in claim 1 , further comprising:
(a) an electrically-conductive first inner face sheet having rigidity properties superior to the rigidity properties of the first core layer and being bounded at a periphery thereof by a joint edge coincident with the joint edge of the first panel;
(b) a first inner electrically-conductive adhesive layer between the inner surface of the first core layer and the first inner face sheet;
(c) an electrically-conductive second inner face sheet having rigidity properties superior to the rigidity properties of the second core layer and being bounded at a periphery thereof by a joint edge coincident with the joint edge of the second panel; and
(d) a second inner electrically-conductive adhesive layer between the inner surface of the second core layer and the second inner face sheet.
6. An interconnection structure as recited in claim 1 , wherein the second core layer comprises nickel as a component.
7. An interconnection structure as recited in claim 6 , wherein the second outer face sheet is electrically-conductive.
8. An interconnection structure as recited in claim 7 , wherein the interconnection structure further comprises:
(a) a first outer electrically-conductive adhesive layer between the outer surface of the first core layer and the first outer face sheet; and
(b) a second outer electrically-conductive adhesive layer between the outer surface of the second core layer and the second outer face sheet.
9. An interconnection structure as recited in claim 1 , wherein the first core layer is fluid permeable.
10. An interconnection structure as recited in claim 1 , wherein the second core layer is fluid permeable.
11. An interconnection structure as recited in claim 1 , wherein the first electromagnetic shield panel shields from electromagnetic signals in excess of eighty decibels below a frequency of one megahertz.
12. An interconnection structure as recited in claim 1 , wherein the second electromagnetic shield panel shields from electromagnetic signals in excess of eighty decibels below a frequency of one megahertz.