System and method of optimizing a composite system

1. A method of characterizing a resin reference signature, the method comprising:

locating an open circuit within a resinous member;

applying a direct current to the open circuit;

subjecting the resinous member and the open circuit to a curing cycle such that the resinous member contacts and bridges the open circuit as the resinous member melts, thereby providing conductive path through the open circuit;

measuring the direct current traveling through resinous member during the curing cycle; and

customizing a heating rate during the curing cycle so that the resinous member has a certain ductility at the end of the cure cycle;

wherein the open circuit is interdigitated having a plurality of adjacent conductor tracks.

2. The method according to claim 1 , wherein the step of measuring the direct current traveling through resinous member is achieved by measuring a voltage across a resistor.

3. The method according to claim 1 , further comprising:

locating a filter adjacent the open circuit to prevent conductive particulate matter from shorting the open circuit;

wherein each conductor track is adjacent to one side of the filter.

4. The method according to claim 3 , wherein the filter is a scrim fabric.

5. The method according to claim 1 , wherein the resinous member is a pre-preg material.

6. The method according to claim 1 , wherein the resinous member is an adhesive film.

7. The method according to claim 1 , further comprising:

graphically representing the resin reference signature.

8. The method according to claim 1 , further comprising:

taking a derivative of the resin reference signature to derive a change in a physiological behavior of the resinous member throughout the cure cycle.

9. The method according to claim 8 , further comprising:

identifying the change in the physiological behavior of the resinous member as at least one of:

a melting point;

a catalyst point;

a peak minimum viscosity point;

a cure finalization point; and

a plateau point.

10. A method of manufacturing a composite part, the method comprising:

assembling a composite preform with a resinous material and an open circuit,

wherein the open circuit is located within the composite preform; and

wherein the open circuit is interdigitated having a plurality of adjacent conductor tracks;

subjecting the composite preform to a curing cycle such that the resinous member contacts and bridges the open circuit as the resin in the resinous material melts and closes the open circuit;

electrically monitoring a current through the resin during the curing cycle; and

selectively controlling a manufacturing variable in response to the step of electrically monitoring the current through the resin;

terminating the curing cycle when the current through resin indicates the curing of the resin has reached a plateau.

11. The method according to claim 10 , wherein the current is a direct current.

12. The method according to claim 10 , wherein the resinous material is a pre-preg material.

13. The method according to claim 10 , wherein the step of assembling a composite preform with a resinous material and an open circuit further includes locating a filter adjacent the circuit to prevent conductive particulate matter from shorting the open circuit;

wherein each conductor track is adjacent to one side of the filter.

14. The method according to claim 10 , wherein the step of selectively controlling a manufacturing variable in response to the step of electrically monitoring the current through the resin includes:

applying mechanical pressure to composite preform when the current through the resin indicates a viscosity of the resin has reached a certain threshold.

15. The method according to claim 10 , wherein the step of selectively controlling a manufacturing variable in response to the step of electrically monitoring the current through the resin includes:

decreasing a heating rate during the curing cycle when the current through the resin indicates that the resin is curing too quickly.

16. The method according to claim 10 , wherein the step of selectively controlling a manufacturing variable in response to the step of electrically monitoring the current through the resin includes:

increasing a heating rate during the curing cycle when the current through the resin indicates that the resin is curing too slowly.

17. The method according to claim 10 , wherein the step of selectively controlling a manufacturing variable in response to the step of electrically monitoring the current through the resin includes:

customizing a heating rate during the curing cycle so that the resin has a certain ductility at the end of the cure cycle.

18. The method according to claim 10 , wherein the step of selectively controlling a manufacturing variable in response to the step of electrically monitoring the current through the resin includes:

applying vacuum pressure to composite preform when the current through the resin indicates a viscosity of the resin has reached a certain threshold.

19. The method according to claim 10 , wherein the step of selectively controlling a manufacturing variable in response to the step of electrically monitoring the current through the resin includes:

changing a rate of a mechanical pressure being applied to the composite preform when the current through the resin indicates a real-time viscosity of the resin is different than predicted.