Electronic device
View Patent ↗An electronic device 100 includes a casing 101 configured to accommodate electronic components. The casing 101 includes an outer layer member 131 formed by a metal and exposed to an outside, and an inner layer member 132 formed by a metal and spaced from an inner surface of the outer layer member 131 . Conductive projections 140 a and 140 b are each formed between the inner layer member 132 and the outer layer member 131 , and are each configured to extend like a line on a surface of one of the inner layer member 132 and the outer layer member 131 and have a top end that contacts with the other of the inner layer member 132 and the outer layer member 131 , to electrically connect between the inner layer member 132 and the outer layer member 131.
1. An electronic device, comprising:
a casing configured to accommodate electronic components, wherein
the casing includes an outer layer member formed by a metal and exposed to an outside, and an inner layer member formed by a metal and spaced from an inner surface of the outer layer member,
a conductive projection is formed between the inner layer member and the outer layer member, and is configured to extend in a line on a surface of one of the inner layer member and the outer layer member and have a top end that contacts with the other of the inner layer member and the outer layer member, to electrically connect between the inner layer member and the outer layer member,
the casing further includes an adhesive layer formed between the outer layer member and the inner layer member that adheres the outer layer member and the inner layer member to each other, and
the adhesive layer is adhered to one of side surfaces of the conductive projection or formed close to one of the side surfaces of the conductive projection.
2. The electronic device according to claim 1 , wherein the conductive projection is formed on an outer surface of the inner layer member, so as to extend in a line on the outer surface, and the top end of the conductive projection contacts with the inner surface of the outer layer member to electrically connect between the inner layer member and the outer layer member.
3. The electronic device according to claim 1 , wherein
the outer layer member is formed by aluminium, and
the inner layer member is formed by magnesium.
4. An electronic device, comprising:
a casing configured to accommodate electronic components, wherein
the casing includes an outer layer member formed by a metal and exposed to an outside, and an inner layer member formed by a metal and spaced from an inner surface of the outer layer member, and
a conductive projection is formed between the inner layer member and the outer layer member, and is configured to extend in a line on a surface of one of the inner layer member and the outer layer member and have a top end that contacts with the other of the inner layer member and the outer layer member, to electrically connect between the inner layer member and the outer layer member,
the conductive projection is formed on an outer surface of the inner layer member, so as to extend in a line on the outer surface, and the top end of the conductive projection contacts with the inner surface of the outer layer member to electrically connect between the inner layer member and the outer layer member, and
a surface of the outer layer member other than an area that contacts with the conductive projection is covered with a non-conductive film.
5. The electronic device according to claim 1 , wherein
the casing has a main surface, and an outer circumferential surface that extends from an outer circumference of the main surface in a thickness direction of the casing, and
the adhesive layer and the conductive projection are formed in a main plate-shaped portion of the casing, which includes the main surface.
6. The electronic device according to claim 5 , wherein
a gap is formed in the outer circumferential surface of the casing such that a space between the outer layer member and the inner layer member communicates with an outside through the gap, and
the adhesive layer is formed, with respect to the conductive projection, on a side opposite to a side on which the gap closest to the conductive projection is formed.
7. An electronic device, comprising:
a casing configured to accommodate electronic components, wherein
the casing includes an outer layer member formed by a metal and exposed to an outside, and an inner layer member formed by a metal and spaced from an inner surface of the outer layer member,
a conductive projection is formed between the inner layer member and the outer layer member, and is configured to extend in a line on a surface of one of the inner layer member and the outer layer member and have a top end that contacts with the other of the inner layer member and the outer layer member, to electrically connect between the inner layer member and the outer layer member, and
the casing comprises a first casing member having the outer layer member and the inner layer member, and having the conductive projection formed between the inner layer member and the outer layer member, and
a second casing member connected to a far side portion of the first casing such that the electronic device is openable and closable.
8. The electronic device according to claim 7 , wherein
the first casing member further includes an adhesive layer that is formed between the outer layer member and the inner layer member and adheres the outer layer member and the inner layer member to each other, and
the adhesive layer is adhered to one of side surfaces of the conductive projection or formed close to one of the side surfaces of the conductive projection.
9. The electronic device according to claim 8 , wherein the adhesive layer and the conductive projection are formed in a plate-shaped portion of the first casing member, which includes a top side surface of the first casing member.
10. The electronic device according to claim 9 , wherein
a gap is formed in an outer circumferential surface on a near side of the first casing member such that a space between the outer layer member and the inner layer member communicates with an outside through the gap, and
the conductive projection extends along the outer circumferential surface on the near side of the first casing member in a region forward of the adhesive layer, in the plate-shaped portion of the first casing member.
11. The electronic device according to claim 10 , wherein
the plate-shaped portion of the first casing member has a palm rest portion located forward of a keyboard,
the adhesive layer is formed in the palm rest portion, and
the conductive projection is formed, forward of the adhesive layer, in the palm rest portion.
12. The electronic device according to claim 11 , wherein the conductive projection is formed in a region on a near side in the palm rest portion among the region on the near side in the palm rest portion and in a region on a far side in the palm rest portion.