Non-contact switch
The present disclosure relates to a non-contact switch. More particularly, the non-contact switch includes a button which is disposed at a predetermined position of a housing and operated by an external pressure while being formed, at one end portion thereof, with a magnetic substance; a magnetic field sensor device which is accommodated in the housing to face the magnetic substance and generates an induced voltage depending on an interval between the magnetic field sensor device and the magnetic substance; and a semiconductor device which is driven by the induced voltage generated at the magnetic field sensor device to switch power supplied from a separate battery to a separate load.
1. A non-contact switch for controlling a current supplied from a separate battery B to a separate load L, comprising:
a button which is disposed at a predetermined position of a housing H and operated by an external pressure while being formed, at one end portion thereof, with a magnetic substance;
a magnetic field sensor device which is accommodated in the housing H to face the magnetic substance and generates an induced voltage depending on an interval between the magnetic field sensor device and the magnetic substance; and
a semiconductor device which is driven by the induced voltage generated at the magnetic field sensor device to switch power supplied from the separate battery B to the separate load L.
2. The non-contact switch according to claim 1 , wherein the magnetic field sensor device is any one of a hall device, a reed switch, an AMR (Anisotropic Magneto-Resistive) sensor, and a GMR (Giant Magneto-Resistive) sensor.
3. The non-contact switch according to claim 1 , wherein the semiconductor device is any one of a FET (Field Effect Transistor), a transistor, an electromagnetic relay, an IPS (Intelligent Power Switching) device, a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), and an IGBT (Insulated Gate Bipolar Transistor).
4. The non-contact switch according to claim 1 , wherein the button is operated in a push manner by an external pressure at a predetermined position of the housing H, or in a sliding manner by an external pressure at a predetermined position of the housing H.
5. The non-contact switch according to claim 1 , wherein the magnetic field sensor device is disposed on a PCB (Printed Circuit Board).
6. The non-contact switch according to claim 1 , wherein the semiconductor device is disposed on a PCB.
7. The non-contact switch according to claim 1 , wherein the power is any one of a current and a voltage.