Power MOSFETs with improved efficiency for multi-channel class D audio amplifiers and packaging therefor
A stereo class-D audio system includes a first die including four monolithically integrated NMOS high-side devices and a second a second die including, four monolithically integrated PMOS low-side devices. The audio system also includes a set of electrical contacts for connecting the high and low-side devices to components within the a stereo class-D audio system, the set of electrical contacts including at least one supply contact for connecting the drains of the high-side devices to a supply voltage (Vcc) and at least one ground contact for connecting the drains of the low-side devices to ground, the electrical contacts also including respective contacts for each source of the high and low-side devices allowing the source of each high-side device to be connected to the source of a respective low-side device to form two H-bridge circuits.
1. A stereo class-D audio amplifier comprising:
a plurality of high-side vertical power MOSFETs:
a corresponding plurality of low-side vertical power MOSFETs corresponding to each high-side vertical power MOSFET of the plurality of high-side vertical power MOSFETs;
an interconnection between each respective high-side vertical power MOSFET and the corresponding low-side vertical power MOSFET forming a respective half-bridge output of the stereo class-D audio amplifier, each of the plurality of high-side vertical power MOSFETs being formed on a first die and each of the corresponding plurality of low-side vertical power MOSFETs being formed on a second die; and
a plurality of complementary bootstrap power supply circuits corresponding to each of the plurality of high-side vertical power MOSFETs, each respective complementary bootstrap power supply circuit including a first floating gate buffer connected to a respective high-side vertical power MOSFET of the plurality of high-side vertical power MOSFETs and a second floating gate buffer connected to the corresponding low-side vertical power MOSFET of the corresponding plurality of low-side vertical power MOSFETs.
2. The stereo class-D audio amplifier of claim 1 wherein each respective high-side vertical power MOSFET and the corresponding low-side vertical power MOSFET forms a complementary follower.
3. The stereo class-D audio amplifier of claim 1 wherein each low-side vertical power MOSFET of the corresponding plurality of low-side vertical power MOSFETs is a P-channel MOSFET having a drain terminal connected to a backside of the second die.
4. The stereo class-D audio amplifier of claim 3 wherein the backside of the second die is electrically connected to a conductive die pad that is common to the drain terminal of each of the corresponding plurality of low-side P-channel vertical power MOSFETs.
5. The stereo class-D audio amplifier of claim 1 wherein each high-side vertical power MOSFET of the plurality of high-side vertical power MOSFETs is an N-channel MOSFET having a drain terminal connected to a backside of the first die.
6. The stereo class-D audio amplifier of claim 5 wherein the backside of the first die is electrically connected to a conductive die pad that is common to the drain terminal of each of the plurality of high-side N-channel vertical power MOSFETs.
7. The stereo class-D audio amplifier of claim 5 wherein each low-side vertical power MOSFET of the corresponding plurality of low-side vertical power MOSFETs is a P-channel MOSFET having a drain terminal connected to a backside of the second die.
8. The stereo class-D audio amplifier of claim 7 wherein the plurality of high-side N-channel vertical power MOSFETs includes at least 4 MOSFETs and the corresponding plurality of low-side P-channel vertical power MOSFETs includes at least 4 MOSFETs.
9. The stereo class-D audio amplifier of claim 8 wherein the backside of the first die is electrically connected to a first conductive die pad that is common to the drain terminal of each of the plurality of high-side N-channel vertical power MOSFETs and the backside of the second die is electrically connected to a second conductive die pad that is common to the drain terminal of each of the corresponding plurality of low-side P-channel vertical power MOSFETs.
10. The stereo class-D audio amplifier of claim 9 wherein the stereo class-D audio amplifier is packaged in a single integrated circuit and the first conductive die pad is electrically connected to at least one power supply contact of the integrated circuit.
11. The stereo class-D audio amplifier of claim 10 wherein the second conductive die pad is electrically connected to at least one ground contact of the integrated circuit.
12. The stereo class-D audio amplifier of claim 9 wherein the first conductive die pad and the second conductive die pad have an H-shape.
13. The stereo class-D audio amplifier of claim 8 wherein each of the plurality of high-side vertical power MOSFETs and each of the corresponding plurality of low-side vertical power MOSFETs is a DMOS MOSFET.
14. The stereo class-D audio amplifier of claim 1 further comprising a plurality of break-before-make buffers corresponding to each of the plurality of high-side vertical power MOSFETs, each respective break-before-make buffer being connected to a respective one of the plurality of high-side vertical power MOSFETs and the corresponding low-side vertical power MOSFET.
15. A stereo class-D audio amplifier comprising:
a first conductive die pad having at least one supply contact to connect to a supply voltage;
a second conductive die pad having at least one ground contact to connect to a ground reference voltage; and
a plurality half-bridge circuits, each respective half bridge circuit of the plurality of half-bridge circuits including a vertical N-channel MOSFET formed on a first die and a vertical P-channel MOSFET formed on a second die, an interconnection of the vertical P-channel MOSFET and the vertical N-channel MOSFET forming an output of the respective half-bridge circuit, a drain of the vertical N-channel MOSFET of each of the plurality of half-bridge circuits being electrically connected to the first conductive die pad, and a drain of the vertical P-channel MOSFET of each of the plurality of half-bridge circuits being electrically connected to the at least one ground contact; and
a plurality of complementary bootstrap power supply circuits corresponding to each of the plurality of half-bridge circuits, each respective complementary bootstrap power supply circuit including a first floating gate buffer connected to the vertical N-channel MOSFET of the respective half-bridge circuit and a second floating gate buffer connected to the vertical P-channel MOSFET of the respective half-bridge circuit.
16. The stereo class-D audio amplifier of claim 15 wherein the vertical N-channel MOSFET and the vertical P-channel MOSFET of each of the plurality of half-bridge circuits is a DMOS MOSFET.
17. The stereo class-D audio amplifier of claim 16 wherein the plurality of half-bridge circuits includes at least 4 half-bridge circuits and the stereo class-D audio amplifier is packaged in a single integrated circuit.