Display device and methods for producing the same
A display device includes a bonding layer between a display module and a cover. An ink layer and a fluorescent layer are disposed between the cover and the bonding layer. A method for producing a display device includes applying a fluorescent layer on at least one end of a cover; applying an ink layer on the fluorescent layer, with the ink layer not contacting the cover; forming a bonding layer on the ink layer and the cover; and coupling a display module to the cover via the bonding layer. In another approach, a method includes applying an ink layer on at least one end of a cover; applying a fluorescent layer on the cover at a location other than the ink layer; forming a bonding layer on the ink layer, the fluorescent layer, and the cover; and coupling a display module to the cover via the bonding layer.
1. A display device comprising a display module, a cover, and a bonding layer configured between the display module and the cover; wherein an ink layer and a fluorescent layer are disposed between at least a portion of the cover and the bonding layer.
2. The display device as claimed in claim 1 , wherein the ink layer and the fluorescent layer overlap the same portion of the cover and the bonding layer, and the portion is toward an end of the cover and the bonding layer.
3. The display device as claimed in claim 2 , wherein the fluorescent layer is disposed between the ink layer and the portion of the cover.
4. The display device as claimed in claim 3 , wherein a total thickness of the ink layer and the fluorescent layer is 5-7 μm.
5. The display device as claimed in claim 1 , wherein the ink layer is disposed on a first portion of the cover, the fluorescent layer is disposed on a second portion of the cover, and the first portion is different from the second portion.
6. The display device as claimed in claim 5 , wherein each of the ink layer and the fluorescent layer has a thickness of 5-7 μm.
7. The display device as claimed in claim 1 , wherein the display module includes a first indium tin oxide film, a second indium tin oxide film, and a module bonding layer disposed between the first indium tin oxide film and the second indium tin oxide.
8. The display device as claimed in claim 2 , wherein the display module includes a first indium tin oxide film, a second indium tin oxide film, and a module bonding layer disposed between the first indium tin oxide film and the second indium tin oxide.
9. The display device as claimed in claim 3 , wherein the display module includes a first indium tin oxide film, a second indium tin oxide film, and a module bonding layer disposed between the first indium tin oxide film and the second indium tin oxide.
10. The display device as claimed in claim 4 , wherein the display module includes a first indium tin oxide film, a second indium tin oxide film, and a module bonding layer disposed between the first indium tin oxide film and the second indium tin oxide.
11. The display device as claimed in claim 5 , wherein the display module includes a first indium tin oxide film, a second indium tin oxide film, and a module bonding layer disposed between the first indium tin oxide film and the second indium tin oxide.
12. The display device as claimed in claim 6 , wherein the display module includes a first indium tin oxide film, a second indium tin oxide film, and a module bonding layer disposed between the first indium tin oxide film and the second indium tin oxide.
13. A method for producing a display device, comprising:
applying a fluorescent layer on a portion of a cover;
applying an ink layer on the fluorescent layer;
forming a bonding layer on the ink layer and the cover; and
coupling a display module to the cover via the bonding layer, such that the fluorescent layer and the ink layer are disposed between the portion of the cover and the display module.
14. The method as claimed in claim 13 , wherein a total thickness of the ink layer and the fluorescent layer is 5-7 μm.
15. A method for producing a display device, comprising:
applying an ink layer and a fluorescent layer on separate portions of a cover;
forming a bonding layer on the ink layer, the fluorescent layer, and the cover; and
coupling a display module to the cover via the bonding layer, such that the ink layer and the fluorescent layer are disposed between the portions of the cover and the display module.
16. The method as claimed in claim 15 , wherein a thickness of each of the ink layer and the fluorescent layer is 5-7 μm.