Additive manufacturing
View Patent ↗Methods of additive manufacturing a superalloy component are disclosed. In one method a powder bed of superalloy powder is selectively scanned with a focused laser beam in a line-by-line manner; and the spacing between adjacent scan lines is no more than twice the layer thickness being formed. In another method a compressive stress treatment is applied to the surface of the final component prior to separation of said component from the substrate. In a further method a superalloy component is formed on a substrate and the method includes Hot Isostatic Processing of the component wherein the mass of the substrate is reduced prior to the Hot Isostatic Processing. The methods may be combined in a multi-step process.
1. A method of additive manufacturing a superalloy component, the method comprising the steps of:
i. providing a powder bed of superalloy powder on a substrate;
ii. scanning the powder with a laser to create a melt pool and thereby selectively fuse the powder into a desired shape, thereby forming a first layer of the component;
iii. replenishing the powder bed and scanning the powder with the laser so as to form a subsequent layer of the component onto the first layer; and
iv. repeating step (iii) as required until a final desired three dimensional component is formed;
wherein scanning the powder with a laser comprises
selective scanning of a focused laser beam across the surface of the powder bed in a line-by-line manner; and wherein
the spacing between adjacent scan lines is no more than twice the layer thickness being formed.
2. The method of claim 1 wherein the laser is an Ytterbium doped fibre laser.
3. The method of claim 1 , wherein the scan spacing is approximately 1.5 times the thickness of the layer being formed.
4. The method of claim 1 , wherein the layer thickness is approximately 0.02 mm and the scan spacing is 0.03 mm.
5. The method of claim 1 wherein adjacent scan lines overlap.
6. The method of claim 5 wherein the scan lines overlap by between 60% and 90%.
7. The method of claim 1 , wherein the laser scan speed is greater than 3 m/s.
8. The method of claim 1 , wherein the laser dwell time is less than 40 μs.
9. The method of claim 1 , wherein the scanning across the surface of the powder bed in a line-by-line manner is arranged to melt the selected areas of the powder to form a layer followed by at least two remelts of that layer by adjacent scans of the laser beam.
10. The method of claim 1 , wherein the laser has a nominal spot size of no more than 0.1 mm.
11. The method of claim 1 , wherein the method comprises the further step of applying a compressive stress treatment to the final three dimensional component.
12. The method of claim 1 wherein the method comprises a scan spacing distance no greater than a heat affected distance from the melt pool wherein that heat affected distance suppresses crack formation.
13. A method of additive manufacturing a superalloy component, the method comprising:
i. providing a powder bed of superalloy powder on a substrate;
ii. scanning the powder with a laser to form a melt pool and there selectively fuse the powder into a desired shape, thereby forming a first layer of the component;
iii. replenishing the powder bed and scanning the powder with the laser so as to form a subsequent layer of the component onto the first layer; and
iv. repeating step (iii) as required until a final three dimensional component is formed;
wherein the method further comprises: applying a compressive stress treatment to the surface of the final three dimensional component prior to separation of the final three dimensional component from the substrate.
14. The method of claim 13 , wherein the compressive stress treatment comprises mechanical impact or liquid or gaseous fluid transmitted impact.
15. The method of claim 13 , wherein the method comprises the further step of treating the final three dimensional component prior to compressive stress treatment to remove loose powder.
16. The method of claim 13 , wherein the method comprises the further step of Hot Isostatic Processing the final three dimensional component before separating the final three dimensional component from the substrate.
17. The method of claim 16 wherein the compressive stress treatment precedes the Hot Isostatic Processing.
18. The method of claim 16 wherein the mass of the substrate is reduced prior to the Hot Isostatic Processing.
19. The method of claim 18 wherein the mass of the subtrate attached to any individual component is reduced by cutting the substrate around each component.
20. The method of claim 13 , wherein the method comprises the further step of solution heat treatment of the final three dimensional component.
21. The method of claim 13 , wherein the method comprises the further step of precipitate hardening of the final three dimensional component.
22. A method of additive layer manufacturing a superalloy component on a substrate including Hot Isostatic Processing wherein the mass of the substrate is reduced prior to the Hot Isostatic Processing.
23. The method of claim 22 , wherein the mass of the substrate is reduced by at least 50%.
24. The method of claim 22 , wherein the mass of the substrate is reduced by at least 95%.
25. The method of 22 , wherein the mass of the substrate is reduced by milling or drilling.