IP Library Granted Patent US 9,357,313
Granted Patent B2
US 9,357,313 · App. 12/424,226 · Granted May 31, 2016

Microphone unit having a plurality of diaphragms and a signal processing unit

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Quick Facts
Patent No.
US 9,357,313
App. No.
12/424,226
Granted
May 31, 2016
Kind
B2
Abstract

A microphone unit includes a microphone substrate. A plurality of diaphragm units are disposed on the microphone substrate. Each of the diaphragm units includes a diaphragm. A plurality of partition walls are disposed on the microphone substrate. Each of the partition walls surrounds the diaphragm so as to define a first area. A signal processor is disposed at a second area outside the first area and is configured to process signals output from the diaphragm units.

Claims (53)

1. A microphone unit comprising:

a microphone substrate;

a plurality of diaphragm units disposed on the microphone substrate, each of the diaphragm units including a diaphragm;

a plurality of partition walls disposed on the microphone substrate, each of the partition walls surrounding the diaphragm so as to define a first area;

a first volume of space surrounded by a first partition wall of the plurality of partition walls and the microphone substrate;

a second volume of space surrounded by a second partition wall of the plurality of partition walls and the microphone substrate;

a signal processor disposed at a second area outside the first area and configured to process signals output from the diaphragm units;

a first electrode terminal provided on the microphone substrate in the first area;

a second electrode terminal provided on the microphone substrate in the second area; and

a third electrode terminal provided on the microphone substrate in a third area,

wherein a height of the partition walls from the microphone substrate is higher than a height of the diaphragm units from the microphone substrate,

wherein each of the diaphragm units includes a holding part that holds the diaphragm and is disposed in direct contact with the microphone substrate,

wherein each of the partition walls surrounds the holding part,

wherein the first volume of space and the second volume of space are equal,

wherein an electrode terminal of a first one of the diaphragm units and the first electrode terminal are electrically connected together in the first area,

wherein an electrode terminal of the signal processor and the second electrode terminal are electrically connected together in the second area,

wherein the first electrode terminal and the second electrode terminal are electrically connected together by a first wiring embedded in the microphone substrate,

wherein an electrode terminal of a second one of the diaphragm units and the third electrode terminal are electrically connected together in the third area,

wherein the third electrode terminal and the second electrode terminal are electrically connected to ether b a second wiring embedded in the microphone substrate, and

wherein the first wiring and the second wiring are equal in length.

2. The microphone unit as set forth in claim 1 , wherein shapes of openings of spaces defined by the partition walls and the microphone substrate are identical each other.

3. The microphone unit as set forth in claim 1 , wherein each of the diaphragm units is fitted into a space defined by the partition walls and the microphone substrate.

4. The microphone unit as set forth in claim 1 , wherein parts of the diaphragm units serve as the partition walls.

5. The microphone unit as set forth in claim 1 , wherein a face of the diaphragm is parallel to an opening of a space defined by the partition walls and the microphone substrate.

6. The microphone unit as set forth in claim 1 , wherein the signal processor is configured to execute a signal processing including generation of a differential signal based on signals output from two of the diaphragm units.

7. The microphone unit as set forth in claim 1 , wherein the signal processor is disposed at a position at which distances from the diaphragms of the diaphragm units are identical each other.

8. The microphone unit as set forth in claim 1 , further comprising:

a cover covering a space defined by the partition walls and the microphone substrate, the cover foamed with a through hole communicating the space defined by the partition walls and the microphone substrate with outside of the cover.

9. The microphone unit as set forth in claim 1 , wherein

the partition walls do not directly contact the diaphragms and respectively surround each of the diaphragms.

10. The microphone unit as set forth in claim 1 , wherein each of the plurality of partition walls are substantially the same shape.

11. A method for manufacturing a microphone unit including a microphone substrate and a plurality of diaphragm units, each of the diaphragm units having a diaphragm, the method comprising:

providing a plurality of partition walls respectively surrounding a plurality of first areas on the microphone substrate;

providing a first volume of space surrounded by a first partition wall of the plurality of partition walls and the microphone substrate;

providing a second volume of space surrounded by a second partition wall of the plurality of partition walls and the microphone substrate;

providing the diaphragm units in an associated one of the first areas respectively;

providing a signal processor at a second area outside the first areas, the signal processor configured to process signals output from the diaphragm units;

providing a first electrode terminal on the microphone substrate in the first area;

providing a second electrode terminal on the microphone substrate in the second area;

providing a third electrode terminal on the microphone substrate in a third area,

wherein a height of the partition walls from the microphone substrate is higher than a height of the diaphragm units from the microphone substrate,

wherein each of the diaphragm units includes a holding part that holds the diaphragm and is disposed in direct contact with the microphone substrate,

wherein each of the partition walls surrounds the holding part, and

wherein the first volume of space and the second volume of space are equal,

wherein an electrode terminal of one of the diaphragm units and the first electrode terminal are electrically connected together in the first area,

wherein an electrode terminal of the signal processor and the second electrode terminal are electrically connected together in the second area,

wherein the first electrode terminal and the second electrode terminal are electrically connected together by a wiring embedded in the microphone substrate,

wherein an electrode terminal of a second one of the diaphragm units and the third electrode terminal are electrically connected together in the third area,

wherein the third electrode terminal and the second electrode terminal are electrically connected together by a second wiring embedded in the microphone substrate, and

wherein the first wiring and the second wiring are equal in length.

12. The method as set forth in claim 11 , wherein

the partition walls do not directly contact the diaphragms and respectively surround each of the diaphragms.

13. The method as set forth in claim 11 , wherein each of the plurality of partition walls are substantially the same shape.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2025
From: FUNAI GROUP CO., LTD
To: FUNAI ELECTRIC CO., LTD.
Reel/Frame 073121/0824 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2025
From: FUNAI ELECTRIC CO., LTD. (F/K/A FE-TECH CO., LTD.)
To: FEC IP LLC
Reel/Frame 073121/0883 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2015
From: FUNAI ELECTRIC ADVANCED APPLIED TECHNOLOGY RESEARCH INSTITUTE INC.
To: FUNAI ELECTRIC CO., LTD.
Reel/Frame 035295/0038 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 12, 2009
From: TANAKA, FUMINORI; HORIBE, RYUSUKE; INODA, TAKESHI; TAKANO, RIKUO; SUGIYAMA, KIYOSHI; FUKUOKA, TOSHIMI; ONO, MASATOSHI
To: FUNAI ELECTRIC CO., LTD.; FUNAI ELECTRIC ADVANCED APPLIED TECHNOLOGY RESEARCH INSTITUTE INC.
Reel/Frame 023092/0904 →