IP Library Granted Patent US 9,359,476
Granted Patent B2
US 9,359,476 · App. 14/655,569 · Granted Jun 7, 2016

Polyamide resin, preparation method therefor, and molded product including same

Inventors: So Young Kwon (Uiwang-si, KR); Jin Kyu Kim (Uiwang-si, KR); Seung Youb Bang (Uiwang-si, KR); Eun Ju Lee (Uiwang-si, KR); Sang Kyun Im (Uiwang-si, KR); Ki Yon Lee (Uiwang-si, KR); Suk Min Jun (Uiwang-si, KR); Sung Chul Choi (Uiwang-si, KR)
Assignee: Cheil Industries Inc.
C08G69/265C08G69/28C08G69/36C08G69/48C08L77/06
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Quick Facts
Patent No.
US 9,359,476
App. No.
14/655,569
Granted
Jun 7, 2016
Kind
B2
Abstract

The polyamide resin of the present invention is a polyamide resin containing an amine group and a carboxyl group, wherein the amine group concentration is about 200 to 300 μeq/g and two to six times as high as the carboxyl group concentration. The polyamide resin has excellent long-thermal stability.

Claims (20)

1. A polyamide resin containing an amine group and a carboxyl group,

wherein the amine group is present at a concentration of about 200 to about 300 μeq/g, and

the concentration of the amine group is about 2 to about 6 times the concentration of the carboxyl group, and

tensile strength maintenance rate of the polyamide resin evaluated by compounding 35 parts by weight of a glass fiber (GF) with respect to 100 parts by weight of the polyamide resin is 45% or more.

2. The polyamide resin of claim 1 , wherein the polyamide resin is obtained by polymerizing (A) a dicarboxylic acid component comprising (a1) an aromatic dicarboxylic acid and (B) a diamine component comprising (b1) an aliphatic diamine.

3. The polyamide resin of claim 2 , wherein the aromatic dicarboxylic acid (a1) comprises at least one of aromatic dicarboxylic acids having 8 to 20 carbon atoms.

4. The polyamide resin of claim 2 , wherein the aliphatic diamine (b1) comprises at least one of aliphatic diamines having 4 to 20 carbon atoms.

5. The polyamide resin of claim 2 , wherein the dicarboxylic acid component (A) further comprises (a2) an amine group-containing dicarboxylic acid.

6. The polyamide resin of claim 5 , wherein the amine group-containing dicarboxylic acid (a2) is represented by the following Formula 1:

wherein R 1 is a hydrogen atom, or a hydrocarbon group having 1 to 10 carbon atoms, and R 2 is a linear, branched or cyclic hydrocarbon group having 1 to 20 carbon atoms, unsubstituted or substituted with a substituent selected from the group consisting of a C 1 -C 10 alkyl group, C 6 -C 18 aryl group, halogen, and a combination thereof.

7. The polyamide resin of claim 5 , wherein the dicarboxylic acid component (A) includes the amine group-containing dicarboxylic acid (a2) in an amount of about 0.1 to about 30 mol %, based on the total amount of the dicarboxylic acid component (A).

8. The polyamide resin of claim 1 , wherein the polyamide resin has an end group capped with an end capping agent comprising at least one of an aliphatic carboxylic acid and/or an aromatic carboxylic acid.

9. The polyamide resin of claim 1 , wherein the polyamide resin has an intrinsic viscosity of about 0.6 to about 1.5 dL/g, as measured in a 25° C. sulfuric acid solution using an Ubbelohde viscometer.

10. The polyamide resin of claim 1 , wherein the polyamide resin has a glass transition temperature (Tg) of about 120° C. or higher.

11. The polyamide resin of claim 1 , wherein the polyamide resin has a melting temperature (Tm) of about 280 to about 320° C., and a crystallization temperature (Tc) of about 260 to about 280° C.

12. A molded article comprising the polyamide resin defined in claim 1 .

13. A method for preparing a polyamide resin, comprising:

polymerizing (A) a dicarboxylic acid component comprising (a1) an aromatic dicarboxylic acid and (B) a diamine component comprising (b1) an aliphatic diamine so that an amine group in the resin is present at a concentration of about 200 to about 300 μeq/g, and the concentration of the amine group is about 2 to about 6 times the concentration of a carboxyl group,

wherein tensile strength maintenance rate of the polyamide resin evaluated by compounding 35 parts by weight of a glass fiber (GF) with respect to 100 parts by weight of the polyamide resin is 45% or more.

14. The method of claim 13 , wherein the dicarboxylic acid component (A) further comprises (a2) an amine group-containing dicarboxylic acid in an amount of about 0.1 to about 30 mol %, based on the total amount of the dicarboxylic acid component (A).

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2017
From: SAMSUNG SDI CO., LTD.
To: LOTTE ADVANCED MATERIALS CO., LTD.
Reel/Frame 042114/0895 →
MERGER Recorded Jul 14, 2016
From: CHEIL INDUSTRIES INC.
To: SAMSUNG SDI CO., LTD.
Reel/Frame 039360/0858 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2015
From: KWON, SO YOUNG; KIM, JIN KYU; BANG, SEUNG YOUB; LEE, EUN JU; IM, SANG KYUN; LEE, KI YON; JUN, SUK MIN; CHOI, SUNG CHUL
To: CHEIL INDUSTRIES INC.
Reel/Frame 035955/0640 →
Priority Claims (1)
KR 10-2012-0157673 · Dec 28, 2012 · national
Continuity (1)
Related Publication 20150353681A1 · Dec 10, 2015