Heat-curable resin composition
The present invention can provide a heat-curable resin composition which is excellent in insulation property, heat resistance, and preservation stability. The heat-curable resin composition includes (A) cyanate ester compound having at least two cyanate groups in a molecule, (B) phenol curing agent including a resorcinol type phenol resin represented by the formula (1), (In the formula, n represents an integer from 0 to 10, each of R 1 and R 2 independently represents a monovalent group selected from a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an allyl group, and a vinyl group.), and (C) at least one compound selected from a tetraphenylborate of a tetra-substituted phosphonium compound and a tetraphenylborate represented by the formula (2). (In the formula, R 3 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group, and n represents an integer from 1 to 3).
1. A heat-curable resin composition comprising:
(A) a cyanate ester compound having at least two cyanate groups in a molecule,
(B) a phenol curing agent comprising a resin represented by the following formula (1)
wherein n represents an integer from 0 to 10, each of R 1 and R 2 independently represents a hydrogen atom or a monovalent group selected from an alkyl group having 1 to 10 carbon atoms, an allyl group, and a vinyl group, and
(C) at least one compound selected from
a tetraphenylborate of a tetra-substituted phosphonium compound and
a tetraphenylborate represented by the following formula (2):
wherein R 3 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group, and n represents an integer from 1 to 3.
2. The heat-curable resin composition according to claim 1 , wherein an amount of the phenol curing agent (B) is an amount at which cyanate groups in the cyanate ester compound (A) are in an amount of 1 to 100 equivalents with respect to an amount of a hydroxyl group (OH group) in the resin represented by the formula (1).
3. The heat-curable resin composition according to claim 1 , wherein the cyanate ester compound (A) is in the liquid form at 80° C.
4. The heat-curable resin composition according to claim 1 , wherein the component (C) comprises a tetraphenylborate of 1,8-diazabicyclo[5.4.0]undec-7-ene derivative represented by the following formula (3), and a tetraphenylborate of 1,5-diazabicyclo[4.3.0]non-5-ene derivative represented by the following formula (4):
wherein R 4 and R 5 represent a hydrogen atom or a monovalent group selected from a saturated hydrocarbon group having 1 to 30 carbon atoms, or an unsaturated hydrocarbon group having 2 to 30 carbon atoms.