IP Library Granted Patent US 9,409,207
Granted Patent B2
US 9,409,207 · App. 14/164,680 · Granted Aug 9, 2016

Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus

Inventor: Yasunori Onishi (Nagano, JP)
Assignee: Seiko Epson Corporation
B06B1/0622B06B3/00G10K11/30G01N29/0654
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,409,207
App. No.
14/164,680
Granted
Aug 9, 2016
Kind
B2
Abstract

Provided is an ultrasonic device including: an ultrasonic element array substrate having a plurality of ultrasonic elements that each include a piezoelectric body; an acoustic lens secured via an acoustic matching layer to a surface, formed with the ultrasonic elements, of the ultrasonic element array substrate; and a support member secured to a surface, opposite to the surface formed with the ultrasonic elements, of the ultrasonic element array substrate, wherein the support member is formed to have a larger area, in plan view in the thickness direction of the ultrasonic element array substrate, and a higher bending stiffness than the ultrasonic element array substrate, and the acoustic lens is formed to have a lower bending stiffness than the ultrasonic element array substrate. The above-described ultrasonic device further includes an acoustic matching layer filled between the ultrasonic element array substrate and the acoustic lens.

Claims (69)

1. An ultrasonic device comprising:

an ultrasonic element array substrate having a plurality of ultrasonic elements that each include a piezoelectric body and perform at least one of transmission and reception of ultrasound;

an acoustic lens secured via an acoustic matching layer to a surface, formed with the ultrasonic elements, of the ultrasonic element array substrate, the acoustic lens having a lens portion that focuses the ultrasound; and

a support member secured to a surface, opposite to the surface formed with the ultrasonic elements, of the ultrasonic element array substrate, wherein

the support member is formed to have a larger area, in plan view in the thickness direction of the ultrasonic element array substrate, and a higher bending stiffness than the ultrasonic element array substrate, and

the acoustic lens is formed to have a lower bending stiffness than the ultrasonic element array substrate.

2. The ultrasonic device according to claim 1 , further comprising:

an acoustic matching layer filled between the ultrasonic element array substrate and the acoustic lens, wherein

the acoustic matching layer is formed of a resin secured to the ultrasonic element array substrate and the acoustic lens.

3. The ultrasonic device according to claim 1 , wherein

the acoustic lens has a plurality of first projections in contact with the ultrasonic element array substrate.

4. The ultrasonic device according to claim 3 , wherein

the first projections are provided in a peripheral portion of the acoustic lens in the plan view.

5. An ultrasonic probe comprising:

the ultrasonic device according to claim 3 ; and

a housing supporting the ultrasonic device.

6. Electronic equipment comprising:

the ultrasonic device according to claim 3 ; and

a processing circuit that is connected to the ultrasonic device and processes an output of the ultrasonic device.

7. An ultrasonic imaging apparatus comprising:

the ultrasonic device according to claim 3 ;

a processing circuit that is connected to the ultrasonic device and processes an output of the ultrasonic device so as to generate an image; and

a display that displays the image.

8. The ultrasonic device according to claim 1 , further comprising:

a flexible printed circuit board connected to the surface, formed with the ultrasonic elements, of the ultrasonic element array substrate, wherein

the flexible printed circuit board is electrically connected to the ultrasonic element array substrate, and

a part of the flexible printed circuit board is secured to the support member.

9. The ultrasonic device according to claim 8 , wherein

the support member includes an angled portion provided at a part of its outer edge, and

the flexible printed circuit board is secured to the angled portion.

10. The ultrasonic device according to claim 8 , wherein

the acoustic lens has a plurality of the second projections, in contact with the flexible printed circuit board, pressing the flexible printed circuit board against the ultrasonic element array substrate.

11. The ultrasonic device according to claim 10 , wherein

the flexible printed circuit board is electrically connected with the ultrasonic element array substrate at a position between the second projections of the acoustic lens and the ultrasonic elements, in plan view in the thickness direction of the ultrasonic element array substrate.

12. An ultrasonic probe comprising:

the ultrasonic device according to claim 10 ; and

a housing supporting the ultrasonic device.

13. Electronic equipment comprising:

the ultrasonic device according to claim 10 ; and

a processing circuit that is connected to the ultrasonic device and processes an output of the ultrasonic device.

14. An ultrasonic probe comprising:

the ultrasonic device according to claim 8 ; and

a housing supporting the ultrasonic device.

15. Electronic equipment comprising:

the ultrasonic device according to claim 8 ; and

a processing circuit that is connected to the ultrasonic device and processes an output of the ultrasonic device.

16. An ultrasonic imaging apparatus comprising:

the ultrasonic device according to claim 8 ;

a processing circuit that is connected to the ultrasonic device and processes an output of the ultrasonic device so as to generate an image; and

a display that displays the image.

17. The ultrasonic device according to claim 1 , wherein

the ultrasonic element array substrate includes:

a base substrate provided with a plurality of openings arranged in an array;

a vibrating membrane formed to cover the openings, the vibrating membrane being displaceable in the film thickness direction; and

a piezoelectric body provided on the vibrating membrane, and

the piezoelectric body includes:

a first electrode provided on the vibrating membrane;

a piezoelectric layer provided to cover at least part of the first electrode; and

a second electrode provided to cover at least part of the piezoelectric layer.

18. An ultrasonic probe comprising:

the ultrasonic device according to claim 1 ; and

a housing supporting the ultrasonic device.

19. Electronic equipment comprising:

the ultrasonic device according to claim 1 ; and

a processing circuit that is connected to the ultrasonic device and processes an output of the ultrasonic device.

20. An ultrasonic imaging apparatus comprising:

the ultrasonic device according to claim 1 ;

a processing circuit that is connected to the ultrasonic device and processes an output of the ultrasonic device so as to generate an image; and

a display that displays the image.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 27, 2014
From: ONISHI, YASUNORI
To: SEIKO EPSON CORPORATION
Reel/Frame 032051/0530 →
Priority Claims (1)
JP 2013-012946 · Jan 28, 2013 · national
Continuity (1)
Related Publication 20140208853A1 · Jul 31, 2014