Backlight module
A backlight module including a light guide plate, a circuit layer and at least one light source. The light guide plate includes a first surface, a second surface parallel and opposite to the first surface, and a recess disposed at a side edge of the light guide plate and including a third surface parallel to the first surface and the second surface. The circuit layer is integrated with the third surface. The at least one light source is disposed on the third surface to be embedded in the recess and electrically connected to the circuit layer.
1. A backlight module, comprising:
a light guide plate comprising a first surface, a second surface parallel and opposite to the first surface, and a recess disposed at a side edge of the light guide plate and comprising a third surface parallel to the first surface and the second surface;
a circuit layer integrated with the third surface; and
at least one light source disposed on the third surface to be embedded in the recess and electrically connected to the circuit layer.
2. The backlight module in claim 1 , wherein the light source is a flip chip light-emitting diode (LED).
3. The backlight module in claim 1 , wherein the light source is a LED chip scale package (CSP).
4. The backlight module in claim 1 , wherein the recess is a groove parallel to a short axis of the light guide plate.
5. The backlight module in claim 1 , further comprising a tapering portion located at a side of the recess and protruded from the first surface.
6. The backlight module in claim 5 , wherein a side surface of the tapering portion is coplanar with a light incident surface of the recess.
7. A backlight module, comprising:
a light guide plate comprising a first surface, a second surface parallel and opposite to the first surface, and a recess disposed on the first surface of the light guide plate and comprising a third surface parallel to the first surface and the second surface;
a circuit layer integrated with the third surface; and
at least one light source disposed on the third surface to be embedded in the recess and electrically connected to the circuit layer.
8. The backlight module in claim 7 , wherein the recess is disposed at a middle point of a long axis of the light guide plate.
9. The backlight module in claim 7 , wherein the recess is a groove crossing the first surface and parallel to a short axis of the light guide plate.
10. The backlight module in claim 7 , wherein the light source is a flip chip light-emitting diode (LED).
11. The backlight module in claim 7 , wherein the light source is a LED chip scale package (CSP).
12. The backlight module in claim 7 , further comprising at least one tapering portion located on at least one side of the recess and protruded from the first surface.
13. The backlight module in claim 12 , wherein a side surface of the tapering portion is coplanar with a light incident surface of the recess.
14. A backlight module, comprising:
a light guide plate comprising a first surface, a second surface parallel and opposite to the first surface, and at least one recess disposed on a side edge of the light guide plate and comprising a third surface parallel to a normal direction of the first surface and the second surface;
a circuit layer integrated with the third surface; and
at least one light source disposed on the third surface to be embedded in the recess and electrically connected to the circuit layer.
15. The backlight module in claim 14 , wherein the recess is a groove crossing a side surface of the light guide plate and connecting the first surface and the second surface.
16. The backlight module in claim 14 , wherein the number of the recess is plural and the number of the light source is plural, the recesses are arranged along a short axis of the light guide plate with predetermined intervals, and the light sources are disposed in the recesses respectively.
17. The backlight module in claim 14 , wherein the light source is a flip chip light-emitting diode (LED).
18. The backlight module in claim 14 , wherein the light source is a LED chip scale package (CSP).
19. The backlight module in claim 14 , further comprising a tapering portion located on a side of the recess and protruded from the first surface.
20. The backlight module in claim 19 , wherein a side surface of the tapering portion is coplanar with a light incident surface of the recess.