Patterning method
A patterning method is provided. Mask structures including first mask layers and first photoresist layers are formed sequentially on a material layer. A second mask layer covering the mask structures is conformally formed on the material layer. First sacrificed layers are formed between the mask structures. Parts of the second mask layer are removed to expose the first photoresist layers and form first U-shape mask layers. The first photoresist layers and the first sacrificed layers are removed. A third mask layer having first surfaces and second surfaces lower than the first surfaces is conformally formed on the material layer. Second sacrificed layers are formed on the second surfaces. Parts of the third mask layer are removed to expose protrusions of the first U-shape mask layers and form second U-shape mask layers. The material layer is patterned by using protrusions of the second U-shape mask layers as masks.
1. A patterning method, comprising:
providing a material layer;
forming a plurality of mask structures on the material layer, wherein each of the mask structures comprises a first mask layer and a first photoresist layer in sequence starting at the material layer;
conformally forming a second mask layer covering the mask structures on the material layer;
forming a first sacrificed layer at least on the second mask layer between the mask structures;
removing a part of the first sacrificed layer and a part of the second mask layer to expose the first photoresist layer, so as to form a first U-shape mask layer between the adjacent mask structures;
removing the first photoresist layer and the first sacrificed layer;
conformally forming a third mask layer on the first mask layer and the first U-shape mask layer, wherein the third mask layer has a first surface and a second surface, and the first surface is higher than the second surface;
forming a second sacrificed layer at least on the second surface of the third mask layer;
removing a part of the second sacrificed layer and a part of the third mask layer to expose protrusions of the first U-shape mask layer, so as to form a second U-shape mask layer between the protrusions of the first U-shape mask layer; and
removing the protrusions of the first U-shape mask layer and the second sacrificed layer by using the protrusions of the second U-shape mask layer as a mask; and
removing the second U-shape mask layer located between the protrusions of the second U-shape mask layer, the first mask layer, the first U-shape mask layer and the material layer not covered by the protrusions of the second U-shape mask layer.
2. The patterning method as claimed in claim 1 , wherein a method of forming the mask structures on the material layer comprises:
forming a first mask material layer and the first photoresist layer in sequence on the material layer; and
removing a part of the first mask material layer by using the first photoresist layer as a mask.
3. The patterning method as claimed in claim 1 , wherein a material of the first mask layer and a material of the second mask layer are the same.
4. The patterning method as claimed in claim 1 , wherein a material of the third mask layer is different from a material of the first mask layer and a material of the second mask layer.
5. The patterning method as claimed in claim 1 , wherein a shape of the protrusions of the first U-shape mask layer and a shape of the protrusions of the second U-shape mask layer comprise a rectangular shape.
6. The patterning method as claimed in claim 1 , wherein a method for forming the first mask layer, the second mask layer and the third mask layer comprises chemical vapour deposition or atomic layer deposition respectively.
7. The patterning method as claimed in claim 1 , wherein a method for forming the first sacrificed layer and the second sacrificed layer comprises spin coating respectively.
8. The patterning method as claimed in claim 1 , wherein a method for removing the part of the second mask layer and removing the part of the third mask layer comprises dry etching respectively.
9. The patterning method as claimed in claim 1 , wherein a method for removing the first photoresist layer, the first sacrificed layer and the second sacrificed layer comprises wet etching, dry etching or plasma cleaning respectively.