IP Library Granted Patent US 9,466,621
Granted Patent B2
US 9,466,621 · App. 14/166,257 · Granted Oct 11, 2016

Array substrates and optoelectronic devices

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Quick Facts
Patent No.
US 9,466,621
App. No.
14/166,257
Granted
Oct 11, 2016
Kind
B2
Abstract

Disclosed is a method of forming array substrates having a peripheral wiring area and a display area. The method is processed by only three lithography processes with two multi-tone photomasks and one general photomask. In the peripheral wiring area, the top conductive line directly contacts the bottom conductive line without any other conductive layer. The conventional lift-off process is eliminated, thereby preventing a material (not dissolved by a stripper) from suspending in the stripper or remaining on the array substrate surface.

Claims (27)

1. An array substrate, comprising:

a substrate;

a first conductive layer disposed on the substrate, wherein the first conductive layer comprises a gate electrode in a display region and a bottom conductive line in a peripheral region;

a second conductive layer disposed on the first conductive layer, wherein the second conductive layer comprises a source electrode and a drain electrode in the display region and a top conductive line in the peripheral region;

an insulation layer disposed between the first conductive layer and the second conductive layer; and

a semiconductor layer disposed between the second conductive layer and the insulation layer;

wherein the top conductive line connects to the bottom conductive line through a first contact hole,

wherein the source electrode, the drain electrode, and the top conductive line are composed of a same material.

2. The array substrate as claimed in claim 1 , wherein the second conductive layer is disposed on the bottom and the sidewall of the first contact hole.

3. The array substrate as claimed in claim 2 , wherein the second conductive layer disposed on the sidewall of the first contact hole contacts the insulation layer and the semiconductor layer.

4. The array substrate as claimed in claim 1 , wherein the first conductive layer comprises a bottom electrode in the display region, the second conductive layer comprises a top electrode in the display region, and the top electrode overlaps the bottom electrode.

5. The array substrate as claimed in claim 4 , wherein the insulation layer is disposed between the top electrode and the bottom electrode.

6. The array substrate as claimed in claim 5 , wherein the semiconductor layer is disposed between the top electrode and the insulation layer.

7. The array substrate as claimed in claim 1 , further comprising:

a passivation layer disposed on the second conductive layer; and

a pixel electrode disposed on the passivation layer;

wherein the pixel electrode connects to the source electrode or the drain electrode through a second contact hole.

8. The array substrate as claimed in claim 7 , wherein the pixel electrode is disposed on the bottom and the sidewall of the second contact hole.

9. The array substrate as claimed in claim 8 , wherein the pixel electrode disposed on the sidewall of the second contact hole contacts the passivation layer.

10. The array substrate as claimed in claim 7 , wherein the first conductive layer comprises a bottom electrode in the display region, and the second conductive layer comprises a top electrode in the display region, and the top electrode overlaps the bottom electrode.

11. The array substrate as claimed in claim 10 , wherein the pixel electrode connects to the top electrode through a third contact hole.

12. The array substrate as claimed in claim 11 , wherein the pixel electrode is disposed on the bottom and the sidewall of the third contact hole.

13. The array substrate as claimed in claim 12 , wherein the pixel electrode disposed on the sidewall of the third contact hole contacts the passivation layer.

14. The array substrate as claimed in claim 1 , wherein a channel of the semiconductor layer is disposed between the gate electrode, the source electrode, and the drain electrode.

15. The array substrate as claimed in claim 14 , wherein the channel of the semiconductor layer comprises metal oxide.

16. The array substrate as claimed in claim 1 , wherein one of the first conductive layer and the second conductive layer comprises aluminum or copper.

17. The array substrate as claimed in claim 1 , wherein the first conductive layer comprises a gate line contacted to the gate electrode, and the second conductive layer comprises a data line contacted to one of the source electrode or the drain electrode.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2024
From: INNOLUX CORPORATION
To: RED OAK INNOVATIONS LIMITED
Reel/Frame 069206/0903 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2014
From: CHOU, CHENG-HSN
To: INNOLUX CORPORATION
Reel/Frame 032064/0715 →