Curing agents for epoxy resins
The present invention relates to new mixtures containing cyanamide and a urea derivative, to liquid curing agents for curing polymer resins, in particular epoxy resins, and to epoxy resin compositions comprising liquid curing agents for producing fibre composite materials.
1. A liquid curing agent for curing polymer resins, comprising:
a) cyanamide; and,
b) at least one urea derivative of formula (I) or formula (II)
wherein the following, in each case simultaneously or independently of one another, apply to the residues and at least one residue R 1 R 2 , or R 3 is not hydrogen;
R 1 R 2 , simultaneously or independently of one another, are hydrogen, C1 to C15 alkyl or C3 to C 15 cycloalkyl; or R 1 and R 2 together are C3 to C 10 alkylene, thereby forming a ring;
R 3 is hydrogen, C1 to C15 alkyl, C3 to C15 cycloalkyl, aryl, aryl alkyl, C1 to C15 alkyl substituted with —NHC(O)NR 1 R 2 , C3 to C15 cycloalkyl substituted with —NHC(O)NR 1 R 2 , aryl substituted with —NHC(O)NR 1 R 2 or aryl alkyl substituted with —NHC(O)NR 1 R 2 ;
R 4 , R 5 , R 6 , R 7 , R 8 , simultaneously or independently of one another, are hydrogen, C1 to C15 alkyl, C3 to C15 cycloalkyl, aryl, aryl alkyl, —CF 3 , —NHC(O)NR 1 R 2 , C1 to C15 alkyl substituted with —NHC(O)NR 1 R 2 , aryl substituted with —NHC(O)NR 1 R 2 or aryl alkyl substituted with —NHC(O)NR 1 R 2 ;
and wherein the liquid curing agent comprises cyanamide and at least one urea derivative of formula (I) or formula (II) in a cyanamide:urea derivative molar ratio of 1:1 to 4:1, and wherein the liquid curing agent is liquid at 20-25° C.
2. The liquid curing agent of claim 1 , wherein the curing agent does not comprise any solvents or solubilisers in addition to cyanamide and the at least one urea derivative, or is solvent-free or solubiliser-free.
3. The liquid curing agent of claim 1 , wherein the at least one urea derivative of formula (I) or formula (II) comprises at least two different urea derivatives.
4. The liquid curing agent of claim 1 , wherein the curing agent comprises a urea derivative of formula (I), wherein the following, in each case simultaneously or independently of one another, apply to the residues:
R 1 , R 2 are hydrogen, or C1 to C15 alkyl;
R 3 is hydrogen, C1 to C15 alkyl, C3 to C15 cycloalkyl, C1 to C15 alkyl substituted with —NHC(O)NR 1 R 2 , C3 to C15 cycloalkyl substituted with —NHC(O)NR 1 R 2 , or aryl substituted with —NHC(O)NR 1 R 2 .
5. The liquid curing agent of claim 1 , wherein the at least one urea derivative of formula (I) or formula (II) is selected from the group consisting of 1, 1-dimethylurea, 3 -phenyl -1, 1-dimethylurea, 1,1′ -(methylenedi-p-phenylene)-bis-(3 ,3 -dimethylurea), 1,1′ -(2-methyl-m-phenylene)-bis-(3,3 -dimethylurea) and/or 1,1′ -(4-methyl-m -phenylene)-bis-(3,3-dimethylurea).
6. An epoxy resin composition comprising:
a) at least one epoxy resin; and,
b) at least one liquid curing agent of claim 1 .
7. A polyurethane resin composition comprising:
a) at least one polyurethane resin; and,
b) at least one liquid curing agent of claim 1 .
8. A method of curing a composition comprising at least one epoxy resin comprising curing the composition with liquid curing agent of claim 1 .
9. A method of curing a composition comprising at least one polyurethane resin comprising curing the composition with liquid curing agent of claim 1 .
10. A method of curing a composition comprising an impregnated fibrous material, an impregnated woven fabric, an impregnated kitted fabric, or an impregnated braided fabric comprising curing the composition with liquid curing agent of claim 1 .
11. The liquid curing agent of claim 1 , wherein the polymer resins are epoxy resins.
12. The liquid curing agent of claim 1 , wherein the liquid curing agent has a melting point S m of <20° C. at normal pressure.
13. The liquid curing agent of claim 12 , wherein the liquid curing agent is liquid at a temperature of 20° C. at normal pressure and has a viscosity of less than 1 Pa*s.
14. A liquid curing agent for curing polymer resins, consisting essentially of:
a) cyanamide; and,
b) at least one urea derivative of formula (I) or formula (II)
wherein the following, in each case simultaneously or independently of one another, apply to the residues and at least one residue R 1 , R 2 , or R 3 is not hydrogen;
R 1 , R 2 , simultaneously or independently of one another, are hydrogen, C1to C15 alkyl or C3 to C15 cycloalkyl; or R 1 and R 2 together are C3 to C 10 alkylene, thereby forming a ring;
R 3 is hydrogen, C1 to C15 alkyl, C3 to C15 cycloalkyl, aryl, aryl alkyl, C1 to C15 alkyl substituted with —NHC(O)NR 1 R 2 , C3 to C15 cycloalkyl substituted with —NHC(O)NR 1 R 2 , aryl substituted with —NHC(O)NR 1 R 2 or aryl alkyl substituted with —NHC(O)NR 1 R 2 ;
R 4 , R 5 , R 6 , R 7 , R 8 , simultaneously or independently of one another, are hydrogen, C1 to C15 alkyl, C3 to C15 cycloalkyl, aryl, aryl alkyl, —CF 3 , —NHC(O)NR 1 R 2 , C1 to C15 alkyl substituted with —NHC(O)NR 1 R 2 , aryl substituted with —NHC(O)NR 1 R 2 or aryl alkyl substituted with —NHC(O)NR 1 R 2 ,
wherein the liquid curing agent comprises cyanamide and at least one urea derivative of formula (I) or formula (II) in a cyanamide : urea derivative molar ratio of 1:1 to 4:1, and wherein the curing agent is liquid at 20-25° C.
15. The liquid curing agent of claim 14 , wherein the curing agent does not comprise any solvents or solubilisers in addition to cyanamide and the at least one urea derivative, or is solvent-free or solubiliser-free.
16. An epoxy resin composition comprising:
a) at least one epoxy resin; and,
b) at least one liquid curing agent of claim 14 .
17. A polyurethane resin composition comprising:
a) at least one polyurethane resin; and,
b) at least one liquid curing agent of claim 14 .
18. The liquid curing agent of claim 14 , wherein the polymer resins are epoxy resins.
19. The liquid curing agent of claim 14 , wherein the liquid curing agent has a melting point S m of <20° C. at normal pressure.
20. The liquid curing agent of claim 14 , wherein the liquid curing agent is liquid at a temperature of 20° C. at normal pressure and has a viscosity of less than 1 Pa*s.
21. A liquid curing agent for curing polymer resins, comprising:
(a) cyanamide; and
(b) at least one urea derivative of formula (III) or formula (IV)
wherein the following, in each case simultaneously or independently of one another, apply to the residues:
R 1 , R 2 , simultaneously or independently of one another, are hydrogen, C1 to C15 alkyl or C3 to C15 cycloalkyl; or R 1 and R 2 together are C3 to C10 alkylene, thereby forming a ring;
R 4 , R 4 , R 5 , R 5′ , R 6 , R 6′ , R 7 , R 7′ , R 8 , R 8′ simultaneously or independently of one another, are hydrogen, halogen, C1 to C15 alkyl, C3 to C10 cycloalkyl, aryl, aryl alkyl, —CF 3 , —NHC(O)NR 1 R 2 or C1 to C15 alkyl substituted with —NHC(O)NR 1 R 2 , aryl substituted with —NHC(O)NR 1 R 2 or aryl alkyl substituted with —NHC(O)NR 1 R 2 ,
wherein the liquid mixture comprises cyanamide and at least one urea derivative of formula (III) or formula (IV) in a cyanamide : urea derivative molar ratio of 1:1 to 4:1,
and wherein the liquid curing agent is liquid at 20-25° C.
22. The liquid curing agent of claim 21 , wherein the curing agent does not comprise any solvents or solubilisers in addition to cyanamide and the at least one urea derivative, or is solvent-free or solubiliser-free.
23. An epoxy resin composition comprising:
a) at least one epoxy resin; and, b) at least one liquid curing agent of claim 21 .
24. A polyurethane resin composition comprising:
a) at least one polyurethane resin; and, b) at least one liquid curing agent of claim 21 .
25. The liquid curing agent of claim 21 , wherein the polymer resins are epoxy resins.
26. The liquid curing agent of claim 21 , wherein the liquid curing agent has a melting point S m of <20° C. at normal pressure.
27. The liquid curing agent of claim 21 , wherein the liquid curing agent is liquid at a temperature of 20° C. at normal pressure and has a viscosity of less than 1 Pa*s.