IP Library Granted Patent US 9,518,849
Granted Patent B2
US 9,518,849 · App. 14/928,543 · Granted Dec 13, 2016

Acoustic sensor apparatus

Inventors: Hui Sung Lee (Gunpo-si, KR); Kwang Myung Oh (Daejeon, KR); Sung Jin Sah (Suwon-si, KR); Sung-Min Park (Seoul, KR)
Assignee: HYUNDAI MOTOR COMPANY
G01D11/245
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Quick Facts
Patent No.
US 9,518,849
App. No.
14/928,543
Granted
Dec 13, 2016
Kind
B2
Abstract

An acoustic sensor apparatus mounted to a medium is disclosed. The acoustic sensor apparatus includes: a sensor unit processing an input acoustic signal; and a housing including a body unit having an accommodation groove in which the sensor unit is accommodated, a cap unit formed to close an opening of the accommodation groove, and a coupling unit formed to mechanically couple the body unit or the cap unit to a medium.

Claims (52)

1. An acoustic sensor apparatus comprising:

a sensor unit configured to process an input acoustic signal; and

a housing comprising:

a body unit having an accommodation groove in which the sensor unit is accommodated,

a cap unit formed to close an opening of the accommodation groove, and

a coupling unit configured to mechanically couple the body unit or the cap unit to a medium,

wherein one surface of the sensor unit is spaced apart from the accommodation groove and a vibration space in which air vibrates by vibration of the housing is formed in the vicinity of the sensor unit.

2. The acoustic sensor apparatus according to claim 1 , wherein the coupling unit comprises any one of a bolt, a screw, and a rivet.

3. The acoustic sensor apparatus according to claim 2 , wherein the coupling unit is configured to mechanically couple a first medium to a second medium.

4. The acoustic sensor apparatus according to claim 1 , wherein the sensor unit comprises an input unit configured to receive an acoustic signal

the vibration space is formed in a vicinity of the input unit.

5. The acoustic sensor apparatus according to claim 1 , further comprising:

a connection unit configured to electrically couple the sensor unit to an external part.

6. The acoustic sensor apparatus according to claim 5 , wherein one side of the connection unit is electrically coupled to the sensor unit and other side thereof is exposed to outside of the housing.

7. The acoustic sensor apparatus according to claim 6 , wherein the sensor unit further comprises:

an input unit configured to receive an acoustic signal;

a circuit unit configured to process an output signal of the input unit; and

a substrate, one surface of which is connected to the input unit, the circuit unit, and the connection unit,

wherein one surface of the substrate is spaced apart from the cap unit, and the vibration space is formed in a vicinity of the input unit.

8. The acoustic sensor apparatus according to claim 6 , wherein the sensor unit comprises an input unit configured to receive an acoustic signal, and the vibration space formed in a vicinity of the input unit, the housing comprising an air introduction hole through which the vibration space communicates with an external part, and the connection unit being exposed to outside through the air introduction hole.

9. The acoustic sensor apparatus according to claim 1 , wherein the sensor unit further comprises:

an input unit configured to receive an acoustic signal;

a circuit unit configured to process an output signal of the input unit; and

a substrate, one surface of which is connected to the input unit and the circuit unit and another surface of which is electrically coupled to an external part.

10. The acoustic sensor apparatus according to claim 9 , wherein

one surface of the substrate is spaced apart from the accommodation groove, and the vibration space is formed in a vicinity of the input unit.

11. The acoustic sensor apparatus according to claim 10 , wherein the substrate is seated on the bottom surface of the accommodation groove.

12. The acoustic sensor apparatus according to claim 1 , wherein the sensor unit comprises an input unit configured to receive an acoustic signal, and the vibration space formed in a vicinity of the input unit; and

the housing includes an air introduction hole through which the vibration space communicates with an external part.

13. An acoustic sensor apparatus, comprising:

a sensor unit configured to process an acoustic signal;

a housing comprising a housing portion and a coupling portion configured to connect the housing portion to a medium, an inner surface of the housing portion forming an opening configured to accommodate the sensor unit; and

a cap unit configured to close the opening,

wherein a part of the inner surface of the housing portion is spaced apart from the sensor unit or the cap unit, forming a vibration space in which air vibrates by vibration of the housing, and the vibration space formed in the vicinity of the sensor unit.

14. The acoustic sensor apparatus according to claim 13 , wherein the sensor unit comprises:

an input unit configured to receive the acoustic signal;

a circuit unit configured to process an output signal of the input unit; and

a substrate connected to the input unit, the circuit unit, the substrate electrically coupled to an external part.

15. An acoustic sensor apparatus comprising:

a sensor unit configured to process an input acoustic signal; and

a housing comprising:

a body unit having an accommodation groove in which the sensor unit is accommodated,

a cap unit formed to close an opening of the accommodation groove, and

a coupling unit configured to mechanically couple the body unit or the cap unit to a medium,

wherein the sensor unit further comprises:

an input unit configured to receive an acoustic signal,

a circuit unit configured to process an output signal of the input unit, and

a substrate, one surface of which is connected to the input unit and the circuit unit and another surface of which is electrically coupled to an external part,

wherein one surface of the substrate is spaced apart from the accommodation groove, and a vibration space in which air vibrates by vibration of the housing is formed in a vicinity of the input unit,

wherein the substrate is seated on a bottom surface of the accommodation groove, a connection unit electrically coupled to the sensor unit comprises a space concaved inward at one surface contacting the substrate, and at least one of the input unit or the circuit unit is accommodated in the concaved space of the connection unit.

16. The acoustic sensor apparatus according to claim 15 , wherein the housing comprises an air introduction hole through which the vibration space communicates with an external part.

17. The acoustic sensor apparatus according to claim 16 , wherein the connection unit is exposed to outside through the air introduction hole.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 17, 2016
From: LEE, HUI SUNG; OH, KWANG MYUNG; SAH, SUNG JIN; PARK, SUNG-MIN
To: HYUNDAI MOTOR COMPANY
Reel/Frame 040034/0338 →
Priority Claims (1)
KR 10-2015-0009315 · Jan 20, 2015 · national
Continuity (1)
Related Publication 20160209249A1 · Jul 21, 2016