Semiconductor device
A semiconductor device includes a semiconductor chip, a resin mold portion sealing a component in which the semiconductor chip is included, and a bonding layer disposed between the resin mold portion and the component. The bonding layer is made of an organic resin that is disposed at an obverse side of the component, and includes a first layer bonded to the component and a second layer bonded to the resin mold portion. A loss coefficient tan δ of the first layer is smaller than a loss coefficient tan δ of the second layer within a temperature range of 200° C. to 250° C.
1. A semiconductor device comprising:
a semiconductor chip having an obverse side and a reverse side, the semiconductor chip including a semiconductor element;
a resin mold portion sealing a component in which the semiconductor chip is included; and
a bonding layer disposed between the resin mold portion and the component, wherein
the bonding layer is made of an organic resin that is disposed at an obverse side of the component,
the bonding layer has a double-layered structure including a first layer bonded to the component and a second layer bonded to the resin mold portion, and
a loss coefficient tan δ of the first layer is smaller than a loss coefficient tan δ of the second layer within a temperature range of 200° C. to 250° C.
2. The semiconductor device according to claim 1 ,
wherein the first layer is made of an organic resin that has a loss coefficient δ satisfying 0<tan δ≦0.3 within a temperature range of 200° C. to 250° C.
3. The semiconductor device according to claim 2 ,
wherein the organic resin of the first layer is provided by one of polyimide, polyamide-imide, or polyimide silicon.
4. The semiconductor device according to claim 1 ,
wherein the second layer is made of an organic resin that has a loss coefficient δ satisfying 1.0≦tan δ<2 within a temperature range of 200° C. to 250° C.
5. The semiconductor device according to claim 4 ,
wherein the organic resin of the second layer is provided by one of polyimide or polyamide-imide.
6. The semiconductor device according to claim 1 , wherein
the component includes:
a first heat sink connected to an obverse side of the semiconductor chip; and
a second heat sink connected to a reverse side of the semiconductor chip,
the first heat sink and the second heat sink are sealed in the resin mold portion by exposing a surface of each of the first heat sink and the second heat sink,
the exposed surface of the first heat sink is opposite to the semiconductor chip and the exposed surface of the second heat sink is opposite to the semiconductor chip, and
the exposed surface of the first heat sink and the exposed surface of the second heat sink radiate heat generated by the semiconductor chip toward outside.