IP Library Granted Patent US 9,537,065
Granted Patent B2
US 9,537,065 · App. 14/236,930 · Granted Jan 3, 2017

Light-emitting device with reflective resin

Inventors: Yoshiki Sota (Osaka, JP); Masayuki Ohta (Osaka, JP); Kazuo Tamaki (Osaka, JP); Shinji Yamaguchi (Osaka, JP); Shin Itoh (Osaka, JP); Tomoshi Kimura (Osaka, JP); Masaki Tatsumi (Osaka, JP)
Assignee: Sharp Kabushiki Kaisha
H01L33/507H01L24/83H01L24/85H01L27/156H01L33/60H01L33/62H01L23/49861H01L24/32H01L24/48H01L24/73H01L2224/32245H01L2224/48091H01L2224/48247H01L2224/48257H01L2224/48465H01L2224/73265H01L2224/83012H01L2224/83439H01L2224/85012H01L2224/85439H01L2224/92247H01L2924/00014H01L2924/12041H01L2924/181
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,537,065
App. No.
14/236,930
Granted
Jan 3, 2017
Kind
B2
Abstract

Improves light extraction efficiency. A light emitting device 1 using a white resin molding package 5 integrally molded with lead frames 3, 4 constituting an electrode corresponding to one or a plurality of light emitting element 2 and white resin, wherein an area in a plane view of a white resin surface on a reflective surface that is level with amounting surface of the light emitting element 2 is configured to be larger than total area in a plane view occupied by surfaces of the lead frames 3, 4 and the light emitting element. Further, a step section is formed on the surfaces of lead frames 3, 4 , white resin is filled in the step section, and the area of white resin surface on a reflective surface where the light emitting element 2 is mounted is increased.

Claims (45)

1. A light emitting device comprising:

a white resin molding package comprising a reflective wall, the reflective wall comprising an inner side surface which tapers to define a cavity;

a first lead frame comprising a top surface and a back surface, the top surface including, within the cavity, a light emitting element arrangement region and a first terminal connection region;

a second lead frame located away from the first lead frame in a first direction and comprising a top surface and a back surface, the top surface including, within the cavity, a second terminal connection region; and

a light emitting element mounted on the light emitting element arrangement region of the first lead frame, the light emitting element comprising a first terminal and a second terminal which are respectively connected to the first terminal connection region of the first lead frame and the second terminal connection region of the second lead frame by wire bonding, wherein

the first lead frame comprises, on its top surface side, a first step portion which is receded from the light emitting element arrangement region and the first terminal connection region of the top surface thereof, but which does not penetrate the first lead frame,

the first step portion is provided at least around the light emitting element arrangement region and between the light emitting element arrangement region and the first terminal connection region,

the first step portion is filled with white resin, wherein a surface of the white resin, in the cavity, is level with the light emitting element arrangement region and the first terminal connection region of the top surface of the first lead frame and functions as a reflective surface,

the light emitting element arrangement region and the first terminal connection region of the top surface of the first lead frame, the surface of the white resin level with these regions, and the second terminal connection region of the top surface of the second lead frame define a part of a bottom surface of the cavity of the package,

the reflective wall includes first and second reflective wall sections opposed to each other in the first direction, and third and fourth reflective wall sections opposed to each other in a second direction intersecting with the first direction,

the first terminal connection region of the first lead frame is partially covered with the first reflective wall section, and

the first step portion between the light emitting element arrangement region and the first terminal connection region of the first lead frame extends in the second direction such that the white resin filled in the first step portion extends both to the third reflective wall section and to the fourth reflective wall section.

2. The light emitting device according to claim 1 , wherein the first step portion is provided all around the light emitting element arrangement region such that the light emitting element arrangement region is entirely surrounded by the first step portion.

3. The light emitting device according to claim 1 , wherein the first step portion is also provided all around the first terminal connection region such that the first terminal connection region is entirely surrounded by the first step portion.

4. The light emitting device according to claim 1 , wherein the second lead frame comprises, on its top surface side, a second step portion which is receded from the second terminal connection region of the top surface thereof, but which does not penetrate the second lead frame, and

the second step portion is filled with the white resin, wherein a surface of the white resin, in the cavity, is level with the second terminal connection region of the top surface of the second lead frame and functions as a reflective surface.

5. The light emitting device according to claim 1 , wherein the cavity of the package is filled with an inner resin containing fluorescent material emitting red and green lights by blue light.

6. The light emitting device according to claim 1 , wherein each of the first lead frame and the second lead frame comprises at least one hanger lead, the at least one hanger lead is embedded in the white resin, and a cut surface, or end face of the hanger lead is consistent with an outer side surface of the package.

7. The light emitting device according to claim 6 , wherein the first step portion is provided in all regions of the top surface of the first lead frame other than the light emitting element arrangement region, the first terminal connection region, the hanger lead, and a base section of the hanger lead.

8. The light emitting device according to claim 1 , wherein the light emitting element comprises an installation surface which is installed on the light emitting element arrangement region of the first lead frame, and the light emitting element arrangement region has a size equal to or smaller than a size of the installation surface of the light emitting element.

9. The light emitting device according to claim 1 , wherein the second terminal connection region of the second lead frame is partially covered with the second reflective wall section.

10. The light emitting device according to claim 1 , wherein the white resin is silicone resin.

11. A light emitting device comprising:

a white resin molding package comprising a reflective wall, the reflective wall comprising an inner side surface which tapers to define a cavity;

a first lead frame having a top surface and a back surface, the top surface including, within the cavity, a light emitting element arrangement region and a first terminal connection region;

a second lead frame located away from the first lead frame in a first direction and having a top surface and a back surface, the top surface including, within the cavity, a second terminal connection region; and

a light emitting element mounted on the light emitting element arrangement region of the first lead frame, the light emitting element comprising a first terminal and a second terminal which are respectively connected to the first terminal connection region of the first lead frame and the second terminal connection region of the second lead frame by wire bonding, wherein

the first lead frame comprises, on its top surface side, a first step portion which is receded from the light emitting element arrangement region and the first terminal connection region of the top surface thereof, but which does not penetrate the first lead frame,

the first step portion is provided at least around the light emitting element arrangement region and between the light emitting element arrangement region and the first terminal connection region,

the first step portion is filled with white resin, wherein a surface of the white resin, in the cavity, is level with the light emitting element arrangement region and the first terminal connection region of the top surface of the first lead frame and functions as a reflective surface,

the light emitting element arrangement region and the first terminal connection region of the top surface of the first lead frame, the surface of the white resin level with these regions, and the second terminal connection region of the top surface of the second lead frame define a part of a bottom surface of the cavity of the package,

the reflective wall includes first and second reflective wall sections opposed to each other in the first direction, and third and fourth reflective wall sections opposed to each other in a second direction intersecting with the first direction,

the first terminal connection region of the first lead frame is partially covered with the first reflective wall section,

the first step portion between the light emitting element arrangement region and the first terminal connection region of the first lead frame extends in the second direction such that the white resin filled in the first step portion extends both to the third reflective wall section and to the fourth reflective wall section, and

as the bottom surface of the cavity is viewed from above, the top surface of the first lead frame is not or almost not exposed between the light emitting element mounted on the light emitting element arrangement region and the white resin surrounding the light emitting element.

12. The light emitting device according to claim 11 , wherein the first step portion is provided all around the light emitting element arrangement region such that the light emitting element arrangement region is entirely surrounded by the first step portion.

13. The light emitting device according to claim 11 , the first step portion is also provided all around the first terminal connection region such that the first terminal connection region is entirely surrounded by the first step portion.

14. The light emitting device according to claim 11 , wherein the second lead frame comprises, on its top surface side, a second step portion which is receded from the second terminal connection region of the top surface thereof, but which does not penetrate the second lead frame, and

the second step portion is filled with the white resin, wherein a surface of the white resin, in the cavity, is level with the second terminal connection region of the top surface of the second lead frame and functions as a reflective surface.

15. The light emitting device according to claim 11 , wherein the cavity of the package is filled with an inner resin containing fluorescent material emitting red and green lights by blue light.

16. The light emitting device according to claim 11 , wherein each of the first lead frame and the second lead frame comprises at least one hanger lead, the at least one hanger lead is embedded in the white resin, and a cut surface, or end face of the hanger lead is consistent with an outer side surface of the package.

17. The light emitting device according to claim 16 , wherein the first step portion is provided in all regions of the top surface of the first lead frame other than the light emitting element arrangement region, the first terminal connection region, the hanger lead, and a base section of the hanger lead.

18. The light emitting device according to claim 1 , wherein the light emitting element comprises an installation surface which is installed on the light emitting element arrangement region of the first lead frame, and the light emitting element arrangement region has a size equal to or smaller than a size of the installation surface of the light emitting element.

19. The light emitting device according to claim 11 , wherein the second terminal connection region of the second lead frame is partially covered with the second reflective wall section.

20. The light emitting device according to claim 11 , wherein the white resin is silicone resin.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2018
From: SHARP KABUSHIKI KAISHA
To: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
Reel/Frame 047331/0728 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2014
From: SOTA, YOSHIKI; OHTA, MASAYUKI; TAMAKI, KAZUO; YAMAGUCHI, SHINJI; ITOH, SHIN; KIMURA, TOMOSHI; TATSUMI, MASAKI
To: SHARP KABUSHIKI KAISHA
Reel/Frame 032129/0775 →
Priority Claims (1)
JP 2011-177323 · Aug 12, 2011 · national
Continuity (1)
Related Publication 20140159076A1 · Jun 12, 2014