IP Library Granted Patent US 9,537,097
Granted Patent B2
US 9,537,097 · App. 14/036,858 · Granted Jan 3, 2017

Substrate for organic electronic device

Inventors: Yeon Keun Lee (Daejeon, KR); Kyoung Sik Moon (Daejeon, KR); Seong Soo Jang (Daejeon, KR); Yong Sik Ahn (Seoul, KR); Jung Doo Kim (Daejeon, KR); Min Choon Park (Daejeon, KR); Jung Bum Kim (Daejeon, KR)
Assignee: LG DISPLAY CO., LTD.
H01L51/0023H01L51/003H01L51/0096H01L51/5268H01L51/42H01L51/50H01L51/5212H01L51/5228H01L51/5262Y02E10/549Y02P70/521
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,537,097
App. No.
14/036,858
Granted
Jan 3, 2017
Kind
B2
Abstract

The present invention relates to a substrate for an organic electrode device, a manufacturing method thereof, and an organic electronic device. An exemplary substrate of the invention, if an organic light emitting element is formed on an upper part of the substrate, can obtain luminance with high emission and uniformity by efficiently controlling the surface resistance of an electrode even when the device is configured into larger sizes.

Claims (21)

1. A method of manufacturing a substrate for an OED, comprising:

forming a conductive pattern directly on a release surface of a releasable substrate;

forming a precursor material layer for an adhesive layer directly on the conductive pattern and a surface of the releasable substrate having the conductive pattern, the precursor material layer comprising a high refractive coating solution comprising an organic or inorganic binder and scattering particles;

laminating a second substrate directly on the precursor material layer; and

converting the precursor material layer into an adhesive layer,

wherein the conductive pattern is formed to be exposed to a surface of the adhesive layer opposite to a surface of the adhesive layer attached to the second substrate, and the surface of the adhesive layer, which includes the exposed conductive pattern, is a planarized surface having a maximum height roughness of 1 μm or less, and

wherein the conductive pattern is formed to have a ratio of an area of the conductive pattern exposed to the planarized surface to be 0.1% to 40% of a total area of the planarized surface, for the substrate for an OED to have a sheet resistance of the planarized surface of 5 Ω/□ or less.

2. The method of manufacturing a substrate for an OED of claim 1 , wherein forming the precursor material layer and converting the precursor material layer into an adhesive layer comprises:

applying the high refractive coating solution on the conductive pattern and the surface of the releasable substrate having the conductive pattern;

drying the applied high refractive coating solution; and

curing the dried high refractive coating solution.

3. The method of manufacturing a substrate for an OED of claim 1 , further comprising removing the releasable substrate.

4. The method of manufacturing a substrate for an OED of claim 1 , wherein:

the forming the conductive pattern directly on the release surface of the releasable substrate is performed before the forming the precursor material layer for the adhesive layer directly on the conductive pattern and the surface of the releasable substrate having the conductive pattern;

the forming the precursor material layer for the adhesive layer directly on the conductive pattern and the surface of the releasable substrate having the conductive pattern is performed before the laminating the second substrate on the precursor material layer; and

the laminating the second substrate on the precursor material layer is performed before the converting the precursor material layer into the adhesive layer.

5. The method of manufacturing a substrate for an OED of claim 4 , further comprising: removing the releasable substrate; and wherein the converting the precursor material layer into the adhesive layer is performed before the removing the releasable substrate.

6. The method of manufacturing a substrate for an OED of claim 5 , wherein the forming the precursor material layer for the adhesive layer on the conductive pattern and the surface of the releasable substrate having the conductive pattern comprises coating the high refractive coating solution on the conductive pattern and the precursor material layer for the adhesive layer on the conductive pattern.

7. The method of manufacturing a substrate for an OED of claim 6 , wherein the coating comprises bar coating, spin coating, or gravure coating.

8. The method of manufacturing a substrate for an OED of claim 1 , wherein the forming the precursor material layer for the adhesive layer on the conductive pattern and the surface of the releasable substrate having the conductive pattern comprises coating the high refractive coating solution on the conductive pattern and the precursor material layer for the adhesive layer on the conductive pattern.

9. The method of manufacturing a substrate for an OED of claim 8 , wherein the coating comprises bar coating, spin coating, or gravure coating.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2016
From: LG CHEM, LTD.
To: LG DISPLAY CO., LTD.
Reel/Frame 038264/0250 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 27, 2013
From: LEE, YEON KEUN; MOON, KYOUNG SIK; JANG, SEONG SOO; AHN, YONG SIK; KIM, JUNG DOO; PARK, MIN CHOON; KIM, JUNG BUM
To: LG CHEM, LTD.
Reel/Frame 031296/0627 →
Priority Claims (2)
KR 10-2011-0028091 · Mar 29, 2011 · national
KR 10-2011-0102473 · Oct 7, 2011 · national
Continuity (2)
Continuation PCTKR2012002338 · Mar 29, 2012
Related Publication 20140051207A1 · Feb 20, 2014