Method and apparatus to mitigate the bond-line read-out defect in adhesive-bonded composite panels
A method and apparatus to mitigate the severity of the bond-line read-out defect, and more specifically microwave heating to locally cure adhesive bond-line in a single or two stage process comprising heating thermoset adhesive with microwave radiation until the adhesive is fully cured or partially cured. If the adhesive is partially cured, it can be fully cured by being subjected to an additional thermal cycle.
1. A method of bonding two substrates comprising:
(a) applying uncured adhesive along a line along which two substrates are to be bonded together, wherein one of the two substrates is a polymer matrix composite substrate and the other of the two substrates is a metal;
(b) positioning, along the line along which the two substrates are to be bonded together, a first bonding fixture on the polymer matrix composite substrate and a second bonding fixture on the metal substrate;
(c) applying microwave radiation only through the polymer matrix composite substrate to heat the polymer matrix composite and the uncured adhesive until the uncured adhesive is at least partially cured, wherein the first and second bonding fixtures absorb stray microwaves and prevent heating of the polymer matrix composite substrate on either side of the line; and
(d) fully curing the adhesive,
whereby bond-line read-out (BLRO) is minimized relative to a comparative BLRO of a comparative assembly having the polymer matrix composite substrate bonded together to the metal substrate by an adhesive cured with heat only without the application of microwave radiation.
2. A method according to claim 1 , wherein the microwave radiation comprises variable frequency microwaves with a bandwidth of frequencies.
3. A method according to claim 2 , wherein the microwaves have a power of between about 5 and about 10 kW.
4. A method according to claim 3 , wherein the microwaves are applied through a microwave applicator having at least one slot.
5. A method according to claim 4 , wherein the microwave radiation is applied by a microwave applicator having at least one slot on an articulated robotic system.
6. A method according to claim 5 , wherein the bandwidth of frequencies is from about 4.03 GHz to about 6.03 GHz.
7. A method according to claim 5 , wherein the BLRO is reduced at least about 25% relative to panels bonded by heat not provided from microwaves.
8. A method according to claim 1 , wherein the polymer matrix composite substrate is glass fiber-reinforced sheet molding compound.
9. A method according to claim 1 , wherein the applying microwave radiation comprises applying microwave radiation having a power of about 8 kW for about 1 to about 2 minutes.
10. A method according to claim 1 , wherein from about 0.15 to about 0.25 kWh at about 5 kW to about 10 kW is applied in step (b) for up to about 5 minutes.
11. A method according to claim 1 , wherein the fully curing the adhesive comprises heating the adhesive with from about 20 KWh to about 30 kWh at about 40 kW to about 80 kW for about 20-30 minutes.
12. A method according to claim 1 , wherein the adhesive is heated by microwave radiation until fully cured.
13. A method according to claim 1 , wherein step (c) is performed with an open-ended microwave applicator flanked on both sides by the first and second bonding fixture.
14. A method according to claim 1 , wherein the fully curing the adhesive further comprises heating the adhesive until the adhesive is fully cured.
15. A method according to claim 1 , wherein the other of the two substrates that is metal is a steel.
16. A method according to claim 1 , wherein the fully curing the adhesive comprises heating the two substrates in an oven until the adhesive is fully cured.
17. A method according to claim 1 , wherein the applying microwave radiation only through the polymer matrix composite comprises locally applying microwave radiation only through the polymer matrix composite along the line along which the two substrates are to be bonded together.