Method and system for providing optical connections

1. An apparatus for providing optical connections, comprising:

an integrated circuit, comprising an optical grating structure and a first optical waveguide coupled to the optical grating structure;

an interposer coupled to the integrated circuit, the interposer being a physical interface comprising a substrate separate from the integrated circuit; and

an optical fiber coupled to the interposer,

wherein the interposer is configured for transmission, through the interposer, of an optical wave from the optical fiber to the optical grating structure or from the optical grating structure to the optical fiber, and

wherein the optical grating structure is configured to transform the optical wave into a predetermined electromagnetic propagation mode.

2. The apparatus of claim 1 , wherein the interposer comprises a substrate configured for producing an approximately straight path for the optical wave between the optical fiber and the optical grating structure.

3. The apparatus of claim 1 , wherein the interposer is configured to transmit, from the optical fiber, the optical wave at a substantially vertical orientation to the optical grating structure.

4. The apparatus of claim 1 , further comprising an optical transmitter configured to emit the optical wave into the interposer, wherein the optical transmitter comprises a laser device.

5. The apparatus of claim 1 , wherein the interposer comprises:

a second optical waveguide configured to receive the optical wave; and

a beam turning structure coupled to the second optical waveguide, wherein the beam turning structure is configured to direct the optical wave at a substantially vertical orientation to the optical grating structure.

6. The apparatus of claim 1 , wherein the optical fiber is configured to receive the optical wave at a substantially vertical orientation from the optical grating structure using the interposer.

7. The apparatus of claim 1 ,

wherein the optical grating structure comprises a plurality of diffraction grooves.

8. The apparatus of claim 1 ,

wherein the interposer provides for a propagation of the optical wave, wherein the propagation produces an approximately spherical-shaped wave front for the optical wave exiting the interposer, and

wherein the optical grating structure is configured to transform the optical wave exiting the interposer into a planar waveform inside the integrated circuit.

9. The apparatus of claim 1 , wherein the predetermined electromagnetic propagation mode is a transverse electric (TE) mode.

10. A system for providing optical connections, comprising:

an optical grating structure; and

an optical waveguide coupled to the optical grating structure,

wherein the optical grating structure is configured to receive an optical wave, through an interposer, from an optical fiber,

wherein the interposer is a physical interface comprising a substrate that is separate from an integrated circuit comprising the optical grating structure and optical waveguide, and

wherein the optical grating structure is configured to transform the optical wave into a predetermined electromagnetic propagation mode.

11. The system of claim 10 ,

wherein the optical grating structure comprises a plurality of diffraction grooves, and

wherein the plurality of diffraction grooves are configured to receive the optical wave at a substantially vertical orientation.

12. The system of claim 10 ,

wherein the optical grating structure comprises a plurality of diffraction grooves.

13. The system of claim 10 ,

wherein the optical grating structure comprises an area on a photonic integrated circuit with a corresponding size, wherein the corresponding size of the area is a function of a thickness of the interposer.

14. The system of claim 10 , wherein the optical grating structure is coupled to a laser diode, a laser cavity, a laser array, a discrete photo-detector, or an array of optical detectors.

15. The apparatus of claim 1 , wherein the interposer is coupled with the integrated circuit through flip-chip bonding.

16. The apparatus of claim 1 , wherein the optical fiber is mounted to the interposer by an adhesive.