IP Library Granted Patent US 9,620,544
Granted Patent B2
US 9,620,544 · App. 14/846,845 · Granted Apr 11, 2017

Image sensor device

Inventors: Chih-Ping Chung (Hsinchu, TW); Ming-Wei Chen (Changhua County, TW); Ming-Yu Ho (Taichung, TW)
Assignee: Powerchip Technology Corporation
H01L27/14629H01L27/1463H01L33/10
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Quick Facts
Patent No.
US 9,620,544
App. No.
14/846,845
Granted
Apr 11, 2017
Kind
B2
Abstract

An image sensor device includes a substrate having a pixel array region, isolation structures in the substrate separating pixel regions from one another in the pixel array region, a photo-sensing region in each of the pixel regions, and a reflective cavity structure in the substrate within each of the pixel region. The reflective cavity structure continuously extends from a bottom of the isolation structure to a deeper central portion of each of the pixel regions, thereby forming a dish-like profile. The reflective cavity structure has a reflective index smaller than that of the substrate.

Claims (14)

1. An image sensor device, comprising:

a substrate having a pixel array region;

a plurality of isolation structures in the substrate separating pixel regions from one another in the pixel array region;

a photo-sensing region in the substrate within each of the pixel regions; and

a reflective cavity structure under the photo-sensing region in the substrate within each of the pixel regions, wherein the reflective cavity structure continuously extends from a bottom of the isolation structure to a deeper central portion of each of the pixel regions, thereby forming a dish-like profile, and wherein the reflective cavity structure has a reflective index smaller than that of the substrate.

2. The image sensor device according to claim 1 , wherein the reflective cavity structure has a thickness ranging between 20˜1000 angstroms.

3. The image sensor device according to claim 1 , wherein the reflective cavity structure is in direct contact with a bottom of each of the isolation structures.

4. The image sensor device according to claim 1 , wherein the reflective cavity structure is not in direct contact with a bottom of each of the isolation structures.

5. The image sensor device according to claim 1 , wherein the photo-sensing region comprises a photodiode.

6. The image sensor device according to claim 1 , wherein the substrate is a silicon substrate and the reflective cavity structure comprises a silicon oxide layer in the silicon substrate.

7. The image sensor device according to claim 6 , wherein the substrate has a refractive index of 4.5 and the reflective cavity structure has a refractive index of 1.5.

8. The image sensor device according to claim 1 further comprising an interconnection structure disposed on the substrate.

9. The image sensor device according to claim 8 , wherein the interconnection structure comprises at least one dielectric layer and at least one conductive layer.

10. The image sensor device according to claim 8 further comprising a color filter layer disposed on the interconnection structure, and a micro lens on the color filter layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049770/0171 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 7, 2015
From: CHUNG, CHIH-PING; CHEN, MING-WEI; HO, MING-YU
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 036500/0614 →
Priority Claims (1)
TW 104124668 A · Jul 30, 2015 · national
Continuity (1)
Related Publication 20170033147A1 · Feb 2, 2017