Semiconductor device and manufacturing method of semiconductor device
A semiconductor device includes a stacked unit having a semiconductor module, a first cooler having a first opening and a first coolant flow path that is connected to the first opening, and a second cooler that has a second opening and a second coolant flow path that is connected to the second opening, and being formed by the first cooler and the second cooler sandwiching the semiconductor module and being stacked such that the first opening and the second opening face each other; a seal member that is arranged between the first opening and the second opening that are adjacent in a stacking direction, and that connect the first opening and the second opening; and a winding member that keeps pressure applied to the stacked unit in the stacking direction by being wound around the stacked unit.
1. A semiconductor device comprising:
a stacked unit including a semiconductor module, a first cooler having a first opening and a first coolant flow path that is connected to the first opening, and a second cooler having a second opening and a second coolant flow path that is connected to the second opening, the stacked unit being formed by the first cooler and the second cooler sandwiching the semiconductor module, and the stacked unit being stacked such that the first opening and the second opening face each other;
a seal member being arranged between the first opening and the second opening that are adjacent in a stacking direction, and the seal member connecting the first opening and the second opening; and
a winding member keeping pressure applied to the stacked unit in the stacking direction by being wound around the stacked unit, wherein
the winding member is welded to the plurality of coolers, and
the winding member is a metal band, a plurality of welding holes are formed in positions facing the plurality of coolers, in the band, and the band is welded to the plurality of coolers, at peripheral edges of the plurality of welding holes.
2. The semiconductor device according to claim 1 , wherein an accommodating groove capable of accommodating the winding member is formed, extending in a length direction of the winding member, in the stacked unit.
3. A manufacturing method of a semiconductor device, comprising:
forming a stacked unit in which a semiconductor module is sandwiched between a first cooler having a first opening and a first coolant flow path that is connected to the first opening, and a second cooler that has a second opening and a second coolant flow path that is connected to the second opening, and the first cooler and the second cooler are stacked such that the first opening and the second opening face each other;
applying pressure to the stacked unit in the stacking direction while a seal member that connects the first opening and the second opening together is arranged between the first opening and the second opening that are adjacent in the stacking direction, and keeping pressure applied to the stacked unit in the stacking direction by winding a winding member around the stacked unit while the pressure is being applied to the stacked unit;
welding the winding member to the plurality of coolers, the winding member being a metal band;
forming a plurality of welding holes in positions facing the plurality of coolers, in the band; and
welding the band to the plurality of coolers, at peripheral edges of the plurality of welding holes.